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WO/2023/162399A1 |
An asphalt composition including asphalt, a polyester resin, and an epoxy-group-containing resin is disclosed. An asphalt pavement material composition including said asphalt composition and an aggregate is also disclosed.
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WO/2023/162511A1 |
A resin composition containing (A) an Fe-Ni-Si alloy magnetic powder and (B) a thermosetting resin, wherein the Si content of the (A) component is 1-8 mass% with respect to 100 mass% of the (A) component.
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WO/2023/162460A1 |
A polycarbonate resin composition characterized by containing, per 100 parts by mass of a polycarbonate resin (A), 0.001-0.3 parts by mass of a specific triaryl phosphate (B) represented by a specific formula (1) and 0.0012-0.12 parts by...
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WO/2023/157905A1 |
The present invention relates to: a film for forming a protective membrane, said film being formed using a resin composition containing (A) a thermoplastic resin, (B) an epoxy resin, (C) an inorganic filler, and (D) a compound containing...
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WO/2023/157817A1 |
The present invention provides: spherical boron nitride particles which enable the achievement of a resin composition that exhibits excellent fluidity; a filler for resins and a resin composition, each of which contains the spherical bor...
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WO/2023/157906A1 |
The present invention relates to: a curable film for forming a protective coating, wherein the ratio of the number of phosphorous atoms to the total number of carbon atoms, nitrogen atoms, oxygen atoms, phosphorous atoms, and silicon ato...
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WO/2023/157542A1 |
Provided is a resin composition capable of giving cured objects which, even in semiconductor chip packages which are, for example, enlarged ones, are inhibited from cracking or causing delamination and from warping. The resin composition...
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WO/2023/157941A1 |
The present invention provides a conductive paste which is capable of forming a cured product that achieves high conductivity and long-term reliability at the same time. The present invention provides a conductive paste which contains, p...
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WO/2023/157907A1 |
The present invention relates to: a curable film for forming a protective coating, wherein the storage modulus E' at all temperatures in the temperature range of 23-150°C is 1 MPa or more, the ratio [E'(80)/E'(130)] of the storage modul...
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WO/2023/156145A1 |
A composition, process, and device are disclosed. The composition includes a polymer formed by reacting an epoxy compound with an amine curing agent. The epoxy compound comprises a Diels-Alder dimer and an ester moiety. The process inclu...
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WO/2023/155221A1 |
Provided is a wave-absorbing material having a composite structure, comprising: a high-frequency rare earth soft magnetic layer adsorbed on a matrix, a FeSiAl layer formed on the high-frequency rare earth soft magnetic layer, and a carbo...
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WO/2023/157893A1 |
The objective of the present invention is to provide a sintered compact composition, wherein an organic binder can be degreased rapidly without requiring special equipment or steps, and cracking and blistering during molding and after si...
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WO/2023/155285A1 |
The present invention provides a reinforced and toughened fiber composite material based on long-short carbon nanotubes and a preparation method therefor. The preparation method comprises: a) mixing short carbon nanotubes, a thermosettin...
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WO/2023/157507A1 |
The present invention addresses the problem of providing: a prepreg having excellent mechanical properties such as strength or elastic modulus, excellent appearance such as low coloring, transparency, or weather resistance, and excellent...
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WO/2023/153387A1 |
This polymerizable composition contains a cation-polymerizable compound, a photocationic polymerization initiator, and a tertiary amine. The blending ratio of the tertiary amine is 60 parts by mass or more with respect to 100 parts by ma...
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WO/2023/153522A1 |
Provided is a chain extending masterbatch for producing a polyester resin molded article, in which the masterbatch has excellent moldability and is capable of increasing the quality of the molded article by a general purpose processing m...
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WO/2023/153435A1 |
Provided is a prepreg in which the toughness and elastic modulus of a cured product thereof are improved. In an embodiment of the prepreg according to the present invention, a matrix resin composition and carbon fibers are contained, the...
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WO/2023/153372A1 |
Provided are: a reinforcing filler which can relatively inexpensively impart flame retardancy using reinforcing fibers; and a method for obtaining the reinforcing filler. The reinforcing filler, when incorporated by kneading into resin...
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WO/2023/149221A1 |
This resin composition for injection molding includes at least one kind of wax (a) having a <80°C melting point.
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WO/2023/149328A1 |
Provided is a two-component thermally conductive resin composition which can be cured at room temperature, and a cured product of which has a sufficient resin stretching ratio. The two-component thermally conductive resin composition com...
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WO/2023/149521A1 |
Provided is a resin composition with which it is possible to obtain a cured product wherein the dielectric loss tangent can be kept low and increases in the melt viscosity can be suppressed. This resin composition contains (A) a silane c...
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WO/2023/149209A1 |
The object of the present invention is to provide a resin composition, etc., from which a cured product having excellent insulation reliability under high temperature and high humidity environments can be obtained, even in the case of a ...
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WO/2023/148996A1 |
Provided are a resin composition that enables fine pattern processing even on a rough-surfaced substrate made of a ceramic or the like, a resin composition film, and a semiconductor device in which these are used. A resin composition con...
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WO/2023/145472A1 |
This resin composition comprises: a curable resin (A); an acrylic monomer copolymer (B) having structures represented by formulas (1) to (3) and having a weight-average molecular weight of at least 10,000 and not more than 900,000; an in...
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WO/2023/145697A1 |
Provided is a chlorine-containing polyether polyol that serves as a material for producing polyurethane having excellent mechanical properties, heat stability, moldability, and flame resistance. The chlorine-containing polyether polyol...
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WO/2023/145500A1 |
The present invention provides: a method for producing a composition, the method being capable of producing a composition which has excellent storage stability and is capable of forming a magnetic material that exhibits high magnetic per...
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WO/2023/145596A1 |
The purpose of the present invention is to provide a molded article that has excellent flame resistance and tracking resistance, that has excellent hydrolysis resistance during high-temperature molding, and that has good low warpage prop...
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WO/2023/140382A1 |
The objective of the present invention is to provide: a curable resin composition that has high dispersibility of acrylic rubber particles in a curable resin and can provide a cured article with excellent appearance; an adhesive; a moldi...
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WO/2023/140644A1 |
The present invention provides: an epoxy resin having a novolak structure containing polyalkylene glycol ether epoxy; a method for manufacturing same; and a liquid resin composition for semiconductor device encapsulation, wherein the liq...
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WO/2023/139814A1 |
The present invention enables patterning to be performed without generating residues during development and provides a high elastic modulus and a low linear expansion coefficient. This resin composition contains a high molecular weight c...
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WO/2023/140118A1 |
Provided are: a resin composition suitable for producing a laser light transmission-side molded article; and a laser light transmission-side molded article. Also provided is a method for improving the laser light transmittance of a molde...
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WO/2023/140154A1 |
Provided is a liquid sealing resin composition that can reduce the modulus of elasticity of a cured article after curing while increasing fluidity before curing. Also provided is a semiconductor device produced from the liquid sealing re...
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WO/2023/135890A1 |
The present invention provides an epoxy resin composition comprising the following components (A) to (D). (A): An epoxy resin. (B): An epoxy resin curing agent that contains a reaction composition (b) containing the reaction product of a...
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WO/2023/136017A1 |
Provided is a resin composition for a flexible device, the resin composition containing an epoxy resin and a phenoxy resin. The glass transition temperature of the cured product of the resin composition is 60°C or higher and the storage...
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WO/2023/135460A1 |
Disclosed herein is a capped poly(phenylene ether) having an activated ester end group and a structure as further defined herein. The capped poly(phenylene ether) can be particularly useful in curable compositions, thermoset compositions...
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WO/2023/132323A1 |
Provided is a multi-part curable composition comprising a preparation A and a preparation B. The preparation A comprises (A) a polyoxyalkylene-based polymer having a reactive silicon group and (B) a (meth)acrylic acid ester-based copolym...
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WO/2023/132317A1 |
Provided is a curable resin composition which has very low CTE and is excellent in terms of heat resistance and crack resistance and of filling property and adhesiveness to copper platings. This curable resin composition comprises (A) ep...
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WO/2023/132360A1 |
The purpose of the present invention is to provide a thermosetting resin composition that has high impregnation property for an insulating sheet and excellent mechanical properties without causing cracks after curing. The present inventi...
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WO/2023/128018A1 |
The present invention provides an epoxy foaming composition containing a carboxyl group for the manufacture of a ship structure, the composition comprising: a main material including a) a first epoxy resin, b) a second epoxy resin contai...
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WO/2023/128253A1 |
The present invention relates to a granular epoxy resin composition and a semiconductor device encapsulated using same.
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WO/2023/128069A1 |
The present invention relates to an epoxy resin composition that has a high refractive index and high adhesiveness, and an encapsulant comprising same, wherein the composition can be applied to various methods, such as an inkjet or a dis...
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WO/2023/128067A1 |
The present invention relates to an epoxy resin composition that is stable at high temperatures, and an encapsulant comprising same, wherein the composition can be applied to various methods, such as an inkjet or a dispensing coating met...
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WO/2023/124484A1 |
The present invention provides a resin composition and use thereof. The resin composition comprises a combination of resin and hollow glass microspheres, said hollow glass microspheres comprising the following components in percentage by...
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WO/2023/127800A1 |
An epoxy resin composition containing an epoxy resin (A) and a curing agent (B) having heteroatoms, the molecular weight α of the curing agent (B) having the heteroatoms being 200≤α≤1200, and the value of α/β, which is the ratio ...
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WO/2023/128236A1 |
The present invention relates to a granular epoxy resin composition and a semiconductor device encapsulated using same.
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WO/2023/126298A1 |
The present invention relates to a one-component thermosetting epoxy resin composition, comprising a) at least one epoxy resin A having on average more than one epoxide group per molecule; b) at least one latent hardener for epoxy resins...
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WO/2023/128247A1 |
The present invention relates to a granular epoxy resin composition and a semiconductor device encapsulated using same.
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WO/2023/128068A1 |
The present invention relates to an epoxy resin composition that has a high refractive index and high adhesiveness, and an encapsulant comprising same, wherein the composition can be applied to various methods, such as an inkjet or a dis...
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WO/2023/125784A1 |
The present invention relates to a resin composition, and a prepreg and the use thereof. The resin composition comprises the following components, in parts by weight: 50 to 150 parts of a modified epoxy resin, 40 to 120 parts of a modifi...
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WO/2023/123845A1 |
The present invention provides an epoxy resin composition. A curing agent containing a disulfide bond is used in the composition for curing an epoxy resin to obtain the curing temperature of the composition; a slurry prepared from the ep...
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