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Patent Searching and Data


Matches 1 - 50 out of 45,110

Document Document Title
WO/2021/203903A1
A method for manufacturing a composite insulating spar core, comprising the following steps: a. weighing raw materials, weighing the following raw materials in terms of parts by weight: a red material 21125 to 28125 parts; a white materi...  
WO/2021/206491A1
The present invention relates to an adhesive composition for a tire cord, a tire cord including an adhesive layer formed of the adhesive composition, and a tire including the tire cord. The present invention provides an environmentally f...  
WO/2021/206041A1
The present disclosure provides a resin composition, with which, when a resin layer of a resin film material is produced, the resin layer is more likely to have flexibility, and when a laminate including a resin layer is hot-pressed, a c...  
WO/2021/201670A1
Disclosed herein is a self-healing material comprising microcapsules comprising a monomeric or oligomeric healing agent, and a catalyst that is able to catalyse the polymerisation of the monomeric or oligomeric healing agent.  
WO/2021/196510A1
The present invention provides a high thermal conductivity electrical insulation packaging material and a preparation method therefor. Specifically, the packaging material provided by the present invention is a mixture composed of an imi...  
WO/2021/200755A1
The present invention provides an aqueous dispersion enabling production of a film that has improved water resistance, tensile elasticity, and breaking point stress, and that exhibits suppressed reduction in breaking point distortion. Th...  
WO/2021/200757A1
Provided is a sheet adhesive for optical use which contains an (A) component and a (B) component, said sheet adhesive for optical use giving a cured product that exhibits a storage sheer modulus (G'0) of 2×107 Pa or less at 0°C. The sh...  
WO/2021/200758A1
Provided is a photocurable sheet adhesive that contains an (A) component, a (B) component, and a (C) component, wherein at least one epoxy resin constituting the (B) component gives a cured product that has a glass transition temperature...  
WO/2021/200984A1
A composition for dip molding containing at least a carboxyl-group-containing nitrile rubber elastomer, an epoxy crosslinking agent that contains an epoxy compound having a parent skeleton that has three or more glycidyl ether groups per...  
WO/2021/201013A1
This sealant includes: a polymerizable compound; a polymerization initiator; and an inorganic filler, the polymerizable compound containing a compound with the specific gravity of 1.3-4.0.  
WO/2021/200032A1
Polishing of a cured product is facilitated, and the surface of the cured product is planarized. A curable resin composition, the curable resin composition being characterized in that the 30-second viscosity obtained by measuring the cur...  
WO/2021/192822A1
Provided are a resin composition for semiconductor encapsulation with a sufficiently reduced specific permittivity, and a semiconductor device resin-sealed using the resin composition for semiconductor encapsulation. This resin compositi...  
WO/2021/193376A1
Provided is an epoxy resin composition for casting which includes a hardener component having excellent storage stability and which has excellent castability at atmospheric pressure. The epoxy resin composition for casting is character...  
WO/2021/193028A1
The present disclosure provides a resin composition for molding, said resin composition easily increasing the thermal conductivity of a cured product thereof and suppressing thermal expansion, while preventing the cured product from havi...  
WO/2021/193303A1
An epoxy resin represented by formula (1), wherein, with respect to the sum of all the epoxy compounds in the epoxy resin which are represented by the formula where n is 1, the total content of the epoxy compound represented by formula (...  
WO/2021/193635A1
The present invention addresses the problem of providing an epoxy resin having exceptional storage stability and curability when a low-activity catalyst is used and at low temperature, and also having exceptional corrosion resistance and...  
WO/2021/190970A1
The present invention relates to a one-component thermosetting epoxy resin composition, comprising at least one epoxy resin A having on average more than one epoxide group per molecule, at least one latent hardener B for epoxy resins, at...  
WO/2021/193929A1
Provided are: an epoxy resin composition which exhibits excellent solubility of a coloring agent, gives a cured product having little color variation and can impart high insulation properties; and an ignition coil which exhibits good imp...  
WO/2021/193166A1
The purpose of the present invention is to provide an epoxy resin composition for casting, which can yield a cured product having excellent resistance to thermal shock and which exhibits excellent impregnation properties in a coil or the...  
WO/2021/187474A1
The present invention is a polyester elastomer resin composition capable of yielding an excellent external appearance due to a reduced amount of bumps and dips resulting from a melt fracture when a parison is ejected at a high-speed from...  
WO/2021/187117A1
Provided is a resin composition for flux, the composition having good preservation stability and producing a cured product that has a high glass transition point. The resin composition for flux includes: an epoxy resin (A); an imidazole ...  
WO/2021/184136A1
A method and composition for manufacturing a material in the form of a plate for generating negative ions, for installation as a negative ion ionisation device in all types of air filters and in all types of internal combustion engines, ...  
WO/2021/187180A1
The present invention provides: a phenoxy resin which exhibits excellent heat resistance, dielectric characteristics and folding resistance; a resin composition which contains this phenoxy resin and a curing agent; a cured product of thi...  
WO/2021/187235A1
An epoxy resin composition (A) containing an epoxy resin represented by formula (1) and an epoxy resin represented by formula (2). An epoxy resin composition (B) containing 0.01-1000 weight parts of a curing agent per 100 weight parts of...  
WO/2021/185898A1
The invention relates to the use of a composition as rheology control agent comprising (A) silicate and (B) a polyethylenimine comprising the structure (I), wherein R1 is formula (I'), or part of the polyethylenimine, and wherein R2 is H...  
WO/2021/185212A1
Examples of the present application provide a method for preparing a thin film piezoresistive material, a thin film piezoresistive material, a robot and a device, and relate to the technical field of electronic material research. The met...  
WO/2021/186939A1
This release film for use in a ceramic green sheet production process comprises a base material and a releasing agent layer formed on one of the surfaces of the base material, wherein the releasing agent layer is formed from a releasing ...  
WO/2021/187240A1
The present disclosure provides a resin composition for sealing, which can be used to produce a sealing material, readily increases adhesion between a sealing material and nickel, and is unlikely to suffer from adverse effects caused the...  
WO/2021/182217A1
This resin composition contains: (B) 0.0001-0.2 parts by weight of a composite tungsten oxide particle (component B) represented by general formula MxWyOz (where M is at least one element selected from among H, He, an alkali metal, an al...  
WO/2021/182295A1
Provided is a curable epoxy composition which can form a cured product having improved heat resistance, by using an alicyclic epoxy compound. The curable epoxy composition includes: an alicyclic epoxy compound (A) having an alicyclic s...  
WO/2021/182207A1
Provided is a resin material that can effectively remove smears using de-smear treatment, reduce the dielectric loss tangent of a cured product, and increase the thermal dimensional stability of a cured product. The resin material acco...  
WO/2021/182232A1
Provided is a photosensitive resin composition which exhibits excellent storage stability and curing reaction properties and which gives a cured product having excellent solvent resistance. This photosensitive resin composition contains ...  
WO/2021/177586A1
The present invention relates to a two-component glass adhesive primer composition comprising: a main part comprising a silane polymer, a first epoxy resin, and an acrylic polymer; and a curing agent part comprising a second epoxy resin,...  
WO/2021/175799A1
The multifunctional composite material comprises a polymeric matrix filled with electrically conductive nanoparticles combined with a self-healing molecular filler selected in the group consisting of molecules and oligomers containing gr...  
WO/2021/178739A1
Aspects of the present disclosure relate to Schiff base oligomers and uses thereof. In at least one aspect, an oligomer is represented by Formula (I) wherein each instance of R4, R5, R6, R7, R8, R10, R11, R12, R13, and R14 is independent...  
WO/2021/174803A1
The present invention relates to an epoxy resin cured product, a composite material, and preparation methods. The epoxy resin cured product is prepared from raw materials comprising epoxy resin and a curing agent. Epoxy resin has a chemi...  
WO/2021/177089A1
The present invention addresses the problem of providing an epoxy resin composition having an excellent elastic modulus, strength, and tackiness and a prepreg and a fiber-reinforced composite material that use the epoxy resin composition...  
WO/2021/177054A1
Provided are a thermosetting resin composition which is relatively inexpensive, has outstanding heat resistance, etc., and has an epoxy compound as a curing component and a prescribed polyimide compound as at least a cross-linking agent,...  
WO/2021/177314A1
The purpose of the present invention is to provide a curable resin composition which has excellent photocuring properties, adhesion, and storage stability, and which, when used as a liquid crystal display element sealant, also has excell...  
WO/2021/172348A1
The present invention is a polyester elastomer resin composition that has excellent extrusion moldability and surface smoothness even in a thin shape while maintaining mechanical properties and has excellent flame retardancy and heat agi...  
WO/2021/170513A1
The invention relates to a curing agent for epoxy resins, containing 1-amino-3-aminomethyl-3,5,5-trimethylcyclohexane and N-benzyl-1,2-ethandiamine in an amount for the ratio of the number of its amine hydrogens to be in the range of 90/...  
WO/2021/172316A1
Provided are a resin composition that exhibits low water absorbency, a cured product, a prepreg, a metal foil-clad laminate board, a resin sheet, and a printed circuit board. The resin composition includes a compound (A) represented by f...  
WO/2021/172387A1
A thermally curable resin composition according to the present invention comprises an epoxy resin (A), a hardener (B), and thermally conductive particles (C), wherein the epoxy resin (A) includes a mesogenic skeleton and has a softening ...  
WO/2021/172733A1
The present invention relates to a primer composition for a glass adhesive, the primer composition comprising a first silane polymer, a second silane polymer, an epoxy resin, and an acrylic polymer, wherein the first silane polymer has a...  
WO/2021/165304A1
The invention relates to a low density two-component structural void filling composition that is preferably based on epoxy chemistry. It is designed for use on interior honeycomb sandwich structures as edge close-out and corner reinforce...  
WO/2021/166541A1
The present invention addresses the problem of providing a composition for forming a heat conductive material having excellent heat conductivity. Also, the present invention addresses the problem of providing a heat conductive sheet, a h...  
WO/2021/164225A1
The present invention relates to the field of thermally conductive fillers, in particular to a chemical and physical treatment method for a filler with high thermal conductivity. The chemical and physical treatment method comprises the f...  
WO/2020/196921A9
This resin composition is produced by a method comprising a washing step for washing, with water, a resin composition containing 1-70 wt% of fine polymer particles (A) having a graft moiety made of a polymer containing, as a constituent ...  
WO/2021/157623A1
An epoxy resin composition for transfer molding, that includes an epoxy resin, an inorganic filler, and a curing agent including a compound represented by general formula (B); a production method therefor; and an epoxy resin composition ...  
WO/2021/127292A3
Adhesion-promoting compositions and the use of the adhesion-promoting compositions to provide adhesion-promoting interlayers to enhance adhesion between adjoining layers of sulfur-containing sealants are disclosed. In repair applications...  

Matches 1 - 50 out of 45,110