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Matches 201 - 250 out of 33,949

Document Document Title
WO/2023/168490A1
The present disclosure relates to organosilicon preceramic resin compositions for forming porous polymer-derived ceramic materials. It also relates to porous organosilicon polymer-derived ceramic materials, and methods for forming porous...  
WO/2023/171353A1
A two-component thermally-conductive addition-curable silicone constituted of a first component and a second component, wherein, the first component contains: (A) an organopolysiloxane having an alkenyl group bonded to a silicon atom, (C...  
WO/2023/169042A1
The present invention provides a high temperature-resistant damping thermoplastic silicone rubber material capable of being repeatedly processed, a preparation method therefor and the use thereof. The thermoplastic silicone rubber materi...  
WO/2023/171352A1
A thermally-conductive silicone composition containing: (A) an organopolysiloxane having an alkenyl group bonded to at least two silicon atoms in one molecule; (B) an organohydrogenpolysiloxane having a hydrogen atom bonded to at least t...  
WO/2023/167251A1
The present invention provides a composition that contains component (A): a crosslinkable compound and component (B): a non-fluorine liquid-repellent compound, and that satisfies the formula: Pb-Pc>0 [in the formula, Pb is the value of t...  
WO/2023/166489A1
A thermoplastic composition comprising: 75 to 98 wt% of a poly(carbonate-siloxane-arylate) and optionally a poly(carbonate-arylate); a poly(carbonate-siloxane) having 30-70 wt% siloxane content, preferably 0.5 to less than 4 wt%, based o...  
WO/2023/160107A1
The present invention belongs to the technical field of quantum-dot diffusion plates, and particularly relates to a quantum-dot diffusion plate, and a preparation method therefor and the application thereof. The quantum-dot diffusion pla...  
WO/2023/162782A1
A method for producing a curable resin composition, the method comprising a step for storing a starting material composition at a temperature of 40°C to 150°C inclusive under a hermetically closed state, in which the starting material ...  
WO/2023/161753A1
A (meth)acrylated hyperbranched polymer consists of C, H, Si, optionally O, and optionally F atoms. The (meth)acrylated hyperbranched polymer comprises end groups, and at least some of the end groups comprise (meth)acryloyloxy groups. A ...  
WO/2023/164018A1
This disclosure relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having an alkenyl group in a molecule; (B) an organosiloxane oligomer having a viscosity at 25 °C of not more than 1,000 mPa·s, havin...  
WO/2023/164019A1
This disclosure relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having an alkenyl group in a molecule; (B) an organosiloxane oligomer having a viscosity at 25 °C of not more than 1,000 mPa·s, havin...  
WO/2023/162611A1
The present invention pertains to hydrophobic cellulose nanofibers which contain (A) cellulose nanofibers and (B) an isocyanate group-containing organopolysiloxane, said hydrophobic cellulose nanofibers being characterized in that the is...  
WO/2023/162323A1
This thermally conductive composition contains a curing polyorganosiloxane (A) and a thermally conductive inorganic filler (B), wherein: 500-5000 parts by mass of the thermally conductive inorganic filler (B) is contained relative to 100...  
WO/2023/162636A1
The present invention is a thermally conductive silicone composition that contains: (A) 100 parts by mass of an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organohydrogenpolysiloxane having at least two sil...  
WO/2023/160423A1
Disclosed are a polysiloxane elastomer having high transparent conductivity and a preparation method therefor. The polysiloxane elastomer takes polysiloxane molecules as a matrix and polyethoxy molecules as conductive phases. The polysil...  
WO/2023/160907A1
Provided is a thermally conductive insulating silicone composition that has favorable thermal conductivity and dispensing properties, has favorable resiliency after curing, and can secure adhesion even under application of impact. Also p...  
WO/2023/156339A1
The present invention relates to a polycarbonate composition comprising A) from 8 wt.% to 65 wt. % of a copolycarbonate, B) from 30 wt.% to 85 wt. % of a homopolycarbonate; C) from 0.06 wt.% to 0.30 wt.% of a fluorine-containing metal or...  
WO/2023/157603A1
An organopolysiloxane according to the present invention, having a structural unit ratio represented by formula (1), provides a room temperature-curable composition that has excellent curability and stability even when a solvent is not u...  
WO/2023/156603A1
The invention relates to compositions comprising a curable polymer and at least one silane compound having at least one hydrolysable group and at least one heteroatom bridged to a silicon atom via a sp2-hybridized quaternary carbon atom,...  
WO/2023/156602A1
The invention relates to oligomers of silane compounds having at least one hydrolysable group and at least one heteroatom bridged to a silicon atom via a sp2-hybridized quaternary carbon atom, as defined herein, a process for preparing s...  
WO/2023/151325A1
The present application provides a hydrophobic porous silicone rubber and a preparation method therefor, an atomizer, and an electronic atomization device. The hydrophobic porous silicone rubber comprises the following materials in parts...  
WO/2023/153233A1
Provided is a thermally conductive composition that includes (A) 100 parts by mass of an organopolysiloxane that is represented by formula (1) and is a liquid at 23°C (in the formula, R is a hydrogen atom, an alkyl group, an aryl group,...  
WO/2023/153871A1
The present application may provide a polyorganosiloxane and a release composition enabling a release layer to be formed, the release layer capable of securing solvent resistance by maximizing bonding strength between a base film and the...  
WO/2023/152685A1
Novel methods for producing porous silicone compositions are disclosed. Methods of this invention provide improved processes for preparing porous silicone rubbers having low specific gravity and mainly closed cells which are suitable for...  
WO/2023/152299A1
The present invention relates to new aspartic acid ester-functional polysiloxanes, their use in the manufacture of curable compositions using polyisocyanate crosslinkers, in particular, in the manufacture of coating compositions, cured c...  
WO/2023/149175A1
A thermally conductive silicone composition comprising (A) a crosslinked silicone gel, (B) a silicone oil containing neither an aliphatic unsaturated bond nor an SiH group, (C) a thermally conductive filler having an average particle dia...  
WO/2023/147698A1
A curable thermally conductive composition contains: (A) an alkenyl-functional polyorganosiloxane having a viscosity in a range of 25 to 2000 millipascal*seconds; (B) a silyl-hydride functional polysiloxane crosslinker; (C) from 94 to 97...  
WO/2023/150058A2
A polymer composition that includes a polyarylene sulfide is disclosed. The polymer composition can be utilized in forming components of an electric vehicle, such as electrical components and/or thermal management system components.  
WO/2023/149360A1
The present invention provides a contamination preventing agent composition that has a sufficiently excellent contamination prevention effect and sustainability thereof. The present invention is a contamination preventing agent compositi...  
WO/2023/148005A1
Provided is a thermally conductive silicone composition for use as a gap filler, where the thermally conductive silicone composition exhibits excellent coating workability on a substrate and good shape retentivity after coating, is able ...  
WO/2023/145438A1
The present invention pertains to a thermally-conductive addition-curable silicone composition characterized by comprising: (A) an organopolysiloxane that includes at least one aliphatic unsaturated hydrocarbon group per molecule and tha...  
WO/2023/146172A1
The present invention relates to a silicone resin composition and a cured product thereof. More particularly, the present invention relates to a high-luminance silicone resin composition and a cured product thereof, the silicone resin co...  
WO/2023/147047A1
The present subject matter relates to devices and techniques for preparing a sample. The disclosed device can include a mixer, a reaction channel, and a micro sprayer. The mixer can be configured to mix at least two components and perfor...  
WO/2023/145474A1
The purpose of the present invention is to provide a thermosetting resin composition which has a low refractive index after curing and is capable of forming a thick film. The present invention relates to a thermosetting resin composition...  
WO/2023/145301A1
This mixed composition comprises: a compound (A1) represented by formula (a1) and/or a compound (A2) represented by formula (a2); and an organic silicon compound (B) represented by formula (b1). In formula (a1), Ra1 represents a group re...  
WO/2023/145659A1
This composition for an acoustic lens contains components (a)-(c) which are: (a) a straight-chain polysiloxane having a vinyl group; (b) a straight-chain polysiloxane having at least two Si-H groups in the molecular chain; and (c) surfac...  
WO/2023/144348A1
The invention relates to a non-fluorinated processing aid for polyolefins which can delay the onset of sharkskin melt fracture to higher extrusion rates. The aid is a composition comprising: a polyolefin; and 0.01 to 50 wt.-% of a functi...  
WO/2023/145473A1
A resin composition according to the present invention contains: a core-shell rubber (A) having a core that contains a silicone polymer and/or an acrylic polymer and a shell that contains a poly(methyl methacrylate), said rubber having a...  
WO/2023/141959A1
The present invention relates to two-component (2K) silicone-based coating composition comprising an effective amount of catalyst, an acrylic group containing tackifier, a crosslinker comprising pendant hydrosilyl group and optional term...  
WO/2023/143728A1
The present invention relates to a cross-linkable, thermally conductive silicone composition (Y) containing 5 - 50 vol.% of a cross-linkable silicone composition (S) and 50 - 95 vol. % of at least one thermally conductive filler (Z) havi...  
WO/2023/143730A1
The present invention relates to a cross-linkable, thermally conductive silicone composition (Y) containing 5 - 50 vol.% of a cross-linkable silicone composition (S) and 50 - 95 vol. % of at least one thermally conductive filler (Z) havi...  
WO/2023/140134A1
The present invention is a curable perfluoropolyether gel composition that provides a perfluoropolyether gel cured product, the composition containing (A) 10-90 parts by mass of a straight-chain perfluoropolyether compound having two or ...  
WO/2023/140053A1
The present invention addresses the problem of providing a new surface treatment agent containing a polysiloxane compound. Said problem is solved by a surface treatment agent comprising: a polysiloxane compound (A) which has a urea group...  
WO/2023/138279A1
The present invention provides a single-component silica gel medium suitable for direct-ink-writing-type 3D printing, and a preparation method therefor and the use thereof. The single-component silica gel medium has a viscosity of 200-10...  
WO/2023/140043A1
The present invention pertains to: a polyamide resin composition obtained by blending, with respect to 100 parts by weight of a polyamide resin (A), 0.01-12 parts by weight of a silicone resin (B) and 0.01-5 parts by weight of a silane c...  
WO/2023/140006A1
The present invention is a thermally conductive silicone composition, characterized by containing: (A) an alkoxysilyl-group-free organopolysiloxane having a kinematic viscosity at 25°C of 10-100,000 mm2/s; (B) an organopolysiloxane havi...  
WO/2023/139218A1
The disclosure provides for elastomers prepared at least from a composition comprising a polysiloxane based binder system, wherein said binder system comprises one or more hydroxyl functional polysiloxanes and one or more organic polysil...  
WO/2023/135857A1
A thermally conductive composition which comprises a matrix resin comprising a heat-curable resin, a curing catalyst, and thermally conductive particles, wherein the thermally conductive particles comprise (a) 600-1,500 parts by mass of ...  
WO/2023/136188A1
Provided is a silicone gel composition which contains, as a base polymer, a silicon-bonded alkenyl group-containing straight-chain or branched-chain organopolysiloxane containing a specific amount of a diphenylsiloxane unit in the molecu...  
WO/2023/136287A1
The present invention provides a copolymer composition which is characterized by containing: a copolymer (S) which comprises a constituent unit derived from ethylene (A), a constituent unit derived from an α-olefin (B) having 3 to 20 ca...  

Matches 201 - 250 out of 33,949