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Patent Searching and Data


Matches 401 - 450 out of 28,249

Document Document Title
WO/2023/042599A1
Provided is a resin composition for jet dispensing having excellent jet dispensability and curability. The resin composition includes (A) a methacrylate compound, (B) a polyfunctional thiol compound, and (C) a radical polymerization init...  
WO/2023/042745A1
[Problem] To provide: an organopolysiloxane composition which can undergo a curing reaction, which forms a slightly-adhesive adhesive agent layer having excellent transparency, and from which it is possible to design a heat-curable/light...  
WO/2023/042840A1
The present invention provides a temporary protective material that has excellent hot water removing properties and has water resistance and adhesion that make it possible to protect a component mounting surface in a step for mounting a ...  
WO/2023/042600A1
Provided is a resin composition having exceptional workability and stability. This resin composition includes (A) a methacrylate compound, (C) a polyfunctional thiol compound, (D) a radical polymerization initiator, and (E) an anionic po...  
WO/2023/042789A1
Provided are: an adhesive composition which is agingless, has good adhesive properties and excellent storage stability, and can be used reliably for a long time even after the addition of a curing agent; and an adhesive sheet. An adhesiv...  
WO/2023/040076A1
The present invention relates to the technical field of sealants, and in particular, to an acrylate sealant for construction and a preparation method therefor. The acrylate sealant for construction comprises preparation raw materials of:...  
WO/2023/042839A1
The present invention provides a temporary protective material which has water resistance and which can protect a component mounting surface, in a semiconductor substrate mounting step. This temporary protective material is used as a pro...  
WO/2023/037721A1
Provided are an optical laminate that has excellent anti-static performance and excellent humidification durability, and an image display device that uses the optical laminate. An optical laminate according to the present invention compr...  
WO/2023/038146A1
Provided is an electroconductive resin composition that can cure at a temperature of 150°C or less and has exceptional electroconductivity, adhesive strength, and solvent resistance after curing. An electroconductive resin composition...  
WO/2023/038001A1
One ultraviolet-curable resin composition according to the present invention contains: at least one compound (A) that is selected from the group consisting of poly(meth)acrylates (a1) and polyvinyl ethers (a2); a compound (B) that has at...  
WO/2023/038123A1
Provided is an adhesive-layer-equipped substrate having a substrate and an adhesive layer disposed on the substrate, wherein: the adhesive layer contains polymer particles (A), an inorganic oxide (B), and a light-shielding agent (D); the...  
WO/2023/038003A1
One ultraviolet-curable resin composition according to the present invention contains: at least one compound (A) that is selected from the group consisting of poly(meth)acrylates (a1) and polyvinyl ethers (a2); a compound (B) that has at...  
WO/2023/038528A1
The invention relates to a clamp coupling for connecting two structural components, comprising a first structural component and a second structural component connected to the first structural component, wherein a first surface of the fir...  
WO/2023/039504A1
An adhesive composition including an adhesive compound; and a plurality of particles each comprising an exterior surface comprising a coating deposited thereon wherein the coating comprises a thermoset material and a method or forming an...  
WO/2023/037914A1
Provided is an adhesive composition suitable for a heat-peelable adhesive sheet that has sufficiently high peel strength from an adherend, can be peeled easily from the adherend through heating after process completion, and does not cont...  
WO/2023/032979A1
Provided is a solventless two-part curing-type adhesive which has excellent initial cohesive power and for which a decrease in the cohesive power over time is prevented. The two-part curing-type adhesive contains: an isocyanate composi...  
WO/2023/033075A1
Provided is an adhesive composition having both high adhesive strength and improved cohesive failure rate. An adhesive composition that includes a thermosetting resin (component (A)), a toughening agent (component (B)), a curing agent ...  
WO/2023/033064A1
Provided is a refractive index adjustment agent for adjusting the refractive index of adhesives, wherein this refractive index adjustment agent for adhesives is an organic compound comprising a structure having at least two substituents ...  
WO/2023/032790A1
Provided is an adhesive sheet that has excellent flexibility at low temperatures and also has excellent resilience. According to the present invention, an adhesive sheet is formed from an adhesive composition [I] that contains an acryl...  
WO/2023/032700A1
The present disclosure provides a curable composition that contains an -ene compound and a thiol compound, a resulting cured product of which can be highly flexible, and is less likely to lose preservation stability. A curable compositio...  
WO/2023/033074A1
The present invention provides an adhesive composition which has achieved a good balance between high bonding strength and improvement of cohesive failure ratio. The present invention provides an adhesive composition which contains a t...  
WO/2023/032685A1
The present invention provides an antireflection film with a pressure-sensitive adhesive sheet, the antireflection film being suitable for use in organic EL display devices (OLEDs). This antireflection film 10 with a pressure-sensitive a...  
WO/2023/033076A1
Provided is an adhesive composition having both a high adhesion strength and an improved cohesive failure rate. The adhesive composition comprises a heat-curable resin [referred to as component (A)], thermoplastic-resin particles [refe...  
WO/2023/032690A1
Provided are: a two-component curable adhesive exhibiting excellent adhesion to a metal foil or a metal deposition layer; and a laminate and a packaging material that are obtained by using said adhesive. The present invention provides ...  
WO/2023/032888A1
The present invention addresses the problem of providing an adhesive which exhibits adhesive properties and heat resistance and is capable of transferring/mounting a large number of semiconductor elements all at once even in a step in wh...  
WO/2023/032782A1
A multilayer body which comprises a semiconductor substrate, a supporting substrate and a bonding layer that is provided between the semiconductor substrate and the supporting substrate, wherein: the bonding layer is formed of a cured pr...  
WO/2023/030317A1
The present invention relates to the technical field of polyurethane, and to a low-viscosity reactive flame-retardant polyether polyol, and a preparation method therefor and an application thereof. In the present invention, low-molecular...  
WO/2023/032795A1
The present invention provides an adhesive composition suited for use in an organic EL display device (OLED). The provided adhesive composition (I) includes a (meth)acrylic polymer (A) as a principal component thereof, and also includes ...  
WO/2023/032135A1
The purpose of the present invention is to provide a heat-removable pressure-sensitive adhesive tape which is suitable for use in high-temperature heating steps and, when heated at a higher temperature after use in a heating step, can be...  
WO/2023/027563A1
Various embodiments of the present disclosure relate to an electronic device including a ceramic resin composite frame. Various embodiments of the present disclosure may provide an electronic device including a ceramic structure, the ele...  
WO/2023/023966A1
A UV adhesive for packaging, and a preparation therefor. The UV adhesive for packaging at least comprises, in percentages by weight: 5%-26% of a modified bisphenol A epoxy resin, 16%-42% of an acrylate prepolymer and 6%-10% of inorganic ...  
WO/2023/024267A1
The present invention provides a bridging agent, a composition, a masterbatch, a packaging film and an electronic component. The bridging agent has a cyclic structure with the following general structural formula: R1 xR2 y[CH3SiO]n, wher...  
WO/2023/026872A1
A problem addressed by the present invention is to provide a resin composition, an adhesive, or a sealing material that gives a cured product having reworkability at a specific temperature that does not have a thermal effect on parts. Th...  
WO/2023/026687A1
Provided are: an adhesive composition that has a low resistance and excellent reworkability, and can inhibit the occurrence of dents; and a polarizing plate using the adhesive composition. The adhesive composition according to an embodim...  
WO/2023/026586A1
This adhesive comprises: a first agent containing gelatin, a gelatin derivative in which a hydrophobic group is bonded to the gelatin via an imino group and that is represented by formula 1: GltnNH-R1, and cyclodextrin, the gelatin havin...  
WO/2023/019766A1
The present invention relates to the technical field of artificial turf, and specifically relates to a non-contact type permanent antibacterial artificial turf and a manufacturing process thereof. The artificial turf comprises a back adh...  
WO/2023/022541A1
The present invention relates to a graft copolymer, and more particularly, to: a core-shell graft copolymer comprising a core containing a rubber polymer, and a shell formed by graft-polymerizing the rubber polymer with a graft monomer, ...  
WO/2023/023205A1
A power transmission belt having a belt body, a tensile cord embedded in the belt body, and a jacket defining a pulley contact surface, where the jacket has been treated on at least the pulley contact surface with an aqueous fabric treat...  
WO/2023/021773A1
Provided is a pressure-sensitive adhesive sheet including a pressure-sensitive adhesive layer which can be formed with low heat energy and can exhibit excellent adhesive force. This pressure-sensitive adhesive sheet comprises a substra...  
WO/2023/022094A1
A curable adhesive composition for use in bonding wiring members as a component of a multilayered wiring board. The curable adhesive composition gives a cured object which, when the thermal expansion coefficient and glass transition temp...  
WO/2023/020226A1
The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silico...  
WO/2023/017787A1
[Problem] To achieve an anaerobic adhesive composition with which the occurrence of coating failures during application can be suppressed. [Solution] This anaerobic adhesive composition contains a (meth)acrylic monomer, an organic peroxi...  
WO/2023/017788A1
[Problem] To provide an anaerobic adhesive composition containing a novel component that functions as an anaerobic curing accelerator in the anaerobic adhesive composition. [Solution] This anaerobic adhesive composition contains a (meth)...  
WO/2023/017752A1
The present invention addresses the problem of providing a resin composition and an adhesive that are highly curable and have a high photocuring adhesive strength with UV light having a longer wavelength (for example, 405 nm) and that ar...  
WO/2023/015797A1
The present invention discloses a zwitterionic liquid silane coupling agent, and the preparation and use thereof. According to the present invention, a series of zwitterionic liquid silane coupling agents are prepared by reacting a silox...  
WO/2023/017777A1
The purpose of the present invention is to provide a (meth)acrylic adhesive composition, a laminate, and a tire, in each case for which the vulcanized rubber-to-vulcanized rubber adhesiveness is excellent. The present invention is a two-...  
WO/2023/013128A1
Provided is a composition that becomes cured objects which have flexibility enough to be films and which have high adhesiveness to low-roughness copper foils, are low in permittivity and dielectric dissipation factor, and have a high gla...  
WO/2023/013399A1
The present invention provides an adhesive composition with which it is possible to form an adhesive having both a high refractive index and low elastic modulus. Provided is an adhesive composition including an acrylic polymer and a plas...  
WO/2023/013651A1
A bonding method for bonding an adherend (120) with an adhesive (11) for high-frequency dielectric heating, the bonding method comprising a placement step in which the electrodes of a dielectric heater (50), the adherend (120), and a spa...  
WO/2023/013678A1
The present invention addresses the problem of developing a binder or an adhesive having superior easy-disassembly properties or decomposition properties while having sufficient adhesiveness prior to being heated. The above problem is ...  

Matches 401 - 450 out of 28,249