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WO/2024/048088A1 |
Provided are an anisotropic conductive film, a connection structure, and a method for producing a connection structure, that, in the case of high-pressure mounting, suppress increases in the continuity resistance value, avoid the generat...
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WO/2024/048055A1 |
Provided is a resin composition having excellent solder heat resistance and low dielectric properties. The resin composition contains (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at an ...
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WO/2024/042878A1 |
A connected body of metal materials having an overlapping portion where an end A of a metal material A and an end B of a metal material B are overlapped via a film composed mainly of a thermoplastic resin, wherein the film is one that ha...
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WO/2024/034464A1 |
Disclosed is an adhesive film for circuit connection. This adhesive film for circuit connection comprises: a first adhesive layer containing conductive particles and a thermoplastic resin; and a second adhesive layer provided on the firs...
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WO/2024/026920A1 |
A composite hot melt adhesive film for soles and a preparation method therefor. The composite hot melt adhesive film comprises: a TPU/EVA alloy base layer; an EVA adhesive film layer located on the upper surface of the TPU/EVA alloy base...
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WO/2024/024424A1 |
A connected body of metal materials obtained by matching a cross-section A of a flat metal material A and a cross-section B of a flat metal material B, covering at least part of the opposing portion, which is a region spanning both the e...
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WO/2024/025476A1 |
Disclosed herein is an ionic conducting gel that comprises a polymeric adhesive material in an amount of from 5 to 20 wt% of the gel, a metal salt in the amount of from 2 to 10 wt% of the gel, and the balance being a hydrophilic polymeri...
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WO/2024/012932A1 |
The invention relates to a polyepoxide for use in reactive adhesive compounds, wherein the polyepoxide can be produced by the polymerisation of a monomer composition comprising, based on the mass of the monomer composition: i) one or mor...
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WO/2024/014123A1 |
This thermoplastic resin composition contains: a crystalline thermoplastic polyimide resin (A) which contains a repeating constituent unit represented by formula (1) and a repeating constituent unit represented by formula (2) and in whic...
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WO/2024/005071A1 |
Provided is an energy ray-curable film-shaped transparent adhesive comprising an epoxy resin, a phenoxy resin, and a photocationic polymerization initiator containing antimony at an anionic site. Also provided are a device comprising the...
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WO/2023/238792A1 |
The present disclosure provides a photocurable composition which contains an ene compound and a thiol compound, and which can have good curability in a deep portion even if a coloring agent is contained therein. This photocurable composi...
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WO/2023/239857A1 |
A two-component room temperature cure adhesive comprising an epoxy resin composition A, and a curative composition B, wherein the curative composition B comprises at least one room temperature curative and at least one chain extender hav...
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WO/2023/233962A1 |
Provided are an adhesive composition having excellent adhesiveness to resinous materials and an article including a cured object formed from the adhesive composition. This adhesive composition includes either a polyether polycarbonate di...
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WO/2023/234063A1 |
Provided is an adhesive composition capable of forming an adhesive having high heat resistance while maintaining strong adhesive force with a configuration having a composition containing a styrenic block copolymer capable of achieving s...
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WO/2023/233102A1 |
The invention relates to a two-component thermally conductive composition comprising: a composition (A) comprising: a silyl polymer, and a composition (B) comprising: at least 1% by weight of a filler (C) relative to the total weight of ...
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WO/2023/222623A1 |
The invention relates to a moisture curable composition, comprising: at least one silyl-modified polymer (A); at least one organofunctional silane compound (B) possessing at least one amino group and a hydrolysable silyl group; and at le...
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WO/2023/217795A1 |
The invention relates to a composition comprising: - a silylated polymer, - carbon black having an oil absorption number (OAN) of at least 80 ml/100 g, and - a rheology agent. The invention also relates to the use of the composition acco...
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WO/2023/205965A1 |
The present application discloses a negative electrode composition, a negative electrode slurry, a negative electrode plate, a secondary battery, and an electrical device comprising the secondary battery. The negative electrode compositi...
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WO/2023/202133A1 |
Disclosed are an aminosilane modified tackifier and a preparation method therefor, and a silane modified polyether adhesive and a preparation method therefor. The aminosilane modified tackifier has the following structure. The aminosilan...
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WO/2023/199738A1 |
[Problem] The purpose of the present invention is to provide a composition that achieves an excellent balance between electrical characteristics and adhesive strength. [Solution] Provided is a composition which contains a cyclic ether co...
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WO/2023/190722A1 |
This adhesive composition for a battery comprises an organic polymer having a hydrolyzable silyl group, and a thermally conductive filling material. A cured product of the curable adhesive composition for a battery has a Shore A hardness...
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WO/2023/190177A1 |
A purpose of the present invention is to provide: compositions for a vulcanization-bonded laminate which are for tenaciously bonding an epichlorohydrin rubber to a fluororubber; and a laminate obtained from the compositions. The composit...
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WO/2023/162664A1 |
The purpose of the present invention is to provide a curable composition having excellent workability and exceptional adhesiveness even after alkali treatment without using an epoxy resin. The above problem is solved by providing a curab...
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WO/2023/156083A1 |
In order to improve optical transparency, cost efficiency and adhesive behavior, an optically transparent pressure-sensitive adhesive layer for use in a pressure-sensitive adhesive comprises a polymer network with at least one alkylsilox...
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WO/2023/136017A1 |
Provided is a resin composition for a flexible device, the resin composition containing an epoxy resin and a phenoxy resin. The glass transition temperature of the cured product of the resin composition is 60°C or higher and the storage...
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WO/2023/127667A1 |
Provided is a method for manufacturing a joined body by joining, in the following order, a base material A, a film containing, as a main component, an amorphous thermoplastic resin that is at least either a thermoplastic epoxy resin or a...
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WO/2023/127666A1 |
A method for producing a bonded body that is obtained by sequentially bonding a base material A, a solid bonding agent which is mainly composed of an amorphous thermoplastic resin that is composed of at least either a thermoplastic epoxy...
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WO/2023/127668A1 |
A method for manufacturing a joined body which is obtained by joining, in the following order, a resin A, a film that has as the main component thereof an amorphous thermoplastic resin which is at least one of a thermoplastic epoxy resin...
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WO/2023/103323A1 |
The embodiments of the invention disclose an adhesive, and a die attach film and a preparation method therefor. The adhesive comprises, in parts by mass, 20-60 parts of an epoxy resin, 20-30 parts of a phenoxy resin, 5-10 parts of an ind...
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WO/2023/100628A1 |
A purpose of the present invention is to provide an adhesive composition for vulcanized rubbers which has excellent adhesiveness. This adhesive composition for vulcanized rubbers comprises an organic polymer having an alkoxysilyl group, ...
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WO/2023/100406A1 |
The present invention provides a polarizing plate with a retardation layer, the polarizing plate having excellent durability at high temperatures. A polarizing plate with a retardation layer according to one embodiment of the present inv...
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WO/2023/100501A1 |
One embodiment pertains to an adhesive for skin affixation containing (A) a polymer having a reactive functional group, (B) a urethane compound in which the mass average molecular weight is 1,500-40,000, and (C) a curing agent, the ureth...
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WO/2023/085280A1 |
A curable resin composition containing a prepolymer (A) having a reactive silyl group, an epoxy compound (B), and a photoacid generator (C).
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WO/2023/085269A1 |
Provided is a composition for adhesion containing a hydrolyzable silyl group-containing polyoxyalkylene polymer, wherein the composition for adhesion has improved adhesiveness to polyester base materials. An adhesive composition for poly...
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WO/2023/072106A1 |
Disclosed in the present invention are a binder and a lithium-ion battery comprising same. The binder comprises at least one polymer, wherein the polymer has the structure as shown in formula 1. In the binder, by means of a composite str...
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WO/2023/066902A1 |
The present invention relates to reactive hot-melt adhesive compositions containing, based on the total weight of the composition, a) 3 wt.% to 49 wt.% of at least one alpha-silane-terminated organic polymer; b) 1 wt.% to less than 20 wt...
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WO/2023/067279A1 |
The invention relates to an adhesive composition comprising at least one silylated polymer (A) comprising at least one, preferably at least two, groups of formula (I): -Si(R4)P(OR5)3-P where: each R4 independently represents a linear or ...
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WO/2023/054449A1 |
The present invention provides a sheet-like curable adhesive which is able to be suppressed in bleeding. The sheet-like curable adhesive is formed of an adhesive composition which contains (A) a phenoxy resin having a hydroxyl group and ...
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WO/2023/054677A1 |
Provided is a curable adhesive sheet having a curable adhesive layer capable of forming a cured product having a loss tangent of 0.01 or less at 23°C and 1 GHz, and a first release film and a second release film enclosing the two surfac...
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WO/2023/053749A1 |
Provided is a resin composition that has excellent resistance to soldering heat, has a low dielectric characteristic at an initial state, and can suppress changes in dielectric characteristics when left for an extended period at a high t...
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WO/2023/020226A1 |
The present invention provides a resin composition and an application thereof, the resin composition comprising the following components by weight percentage: 15-39% cross-linkable curable resin and 61-85% filler, the filler being silico...
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WO/2023/007982A1 |
The present invention provides: a novel phosphorus compound having an isocyanurate ring; a synthetic method for said phosphorus compound; a flame retardant containing said phosphorus compound; and a resin composition containing said phos...
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WO/2023/002970A1 |
Provided is a curable adhesive composition comprising a binder resin (A) having a reactive functional group, a poly(phenylene ether) resin (B) having a vinyl group and a number-average molecular weight of 1,500 or higher but lower than 5...
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WO/2023/281215A1 |
The invention relates to 1) a crosslinkable adhesive composition comprising: at least one polymer (A) comprising a hydrolysable alkoxysilane group; at least one tackifying resin (B); at least one fumed silica (C), preferably hydrophic; a...
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WO/2023/281216A1 |
The invention relates to: (1) A cross-linkable adhesive composition comprising: - at least one polymer (A) comprising a hydrolysable alkoxysilane group; - at least one tackifying resin (B); - at least one fumed silica (C), preferably hyd...
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WO/2023/282298A1 |
The present invention relates to a curable composition that includes an oxyalkylene polymer A that has an average of 4–8 terminal groups per molecule and includes a reactive silicon group represented by (1) -SiXaR3-a (in which R is a C...
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WO/2022/270613A1 |
A method for manufacturing a bonded body, having: a pre-bonding step in which a substrate A, a solid bonding agent, and a substrate B are positioned in this order to prepare a layered body, said solid bonding agent having, as the primary...
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WO/2022/260057A1 |
A curable composition comprising: a perfluoro(poly)ether group–containing silane compound represented by general formula (I) (the radicals in the formula are defined in the description); (b) an organosilicon compound having at least tw...
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WO/2022/255078A1 |
Provided is a resin composition for adhesive films which has a low dielectric loss and nevertheless attains a sufficient adhesion strength and which can give adhesive films inhibited from suffering resin flow. The resin composition compr...
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WO/2022/235712A1 |
A paste composition, method of use, and building product containing such composition. The composition comprises at least one (preferably two) silyl-terminated polymer resin and a plurality of adhesion promoters. In preferred embodiments,...
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