| Document |
Document Title |
|
JP5650909B2 |
Copolyamide (A) comprises at least two monomers and diamine diacid compound (I). Copolyamide comprises at least two monomers and diamine diacid compound of formula (A/(diamine) z-(diacid) w) (I), where the amino acid, diamine and diacid ...
|
|
JP5644716B2 |
An adhesive film includes an insulation film, an adhesive layer formed on the insulation film and including a copolyamide resin being soluble in a solvent at a room temperature (25° C.) and having a melting point of not less than 100° ...
|
|
JP2014231536A |
To provide a thermosetting resin composition and adhesive using the same that has a high insulation property, a low thermal expansion property and a high glass transition temperature (Tg), that does not exhibit appearance abnormality suc...
|
|
JP2014227505A |
To provide an adhesive composition exhibiting an excellent adhesiveness to a polyamide resin, carbon material, glass substrate, or metallic material, yielding a flexible coating film having a blocking resistance, and exhibiting a scarce ...
|
|
JP5605259B2 |
Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid...
|
|
JP5603803B2 |
|
|
JP2014181268A |
To provide an adhesive composition having excellent adhesiveness between a metallic material and a resin material and heat resistive adhesiveness, and in which flexibility and alkali resistance can be imparted to an adhesive layer, and f...
|
|
JP5593914B2 |
To provide an adhesive composition which has moderate viscoelasticity before curing, can be pressure-bonded to an adherend by a weak pressure, and shows high cohesive force without reacting them for a long time under a high temperature, ...
|
|
JP5589732B2 |
To provide a hot melt adhesive composition preventing air from being included in the interface between a hot melt adhesive layer and an adherend by flexibly corresponding to a part of the surface of the adherend having unevenness of seve...
|
|
JP5586225B2 |
A film which comprises a layer composed of a moulding composition composed of a semicrystalline polyamide whose enthalpy of fusion is at least 8 J/g is used for production of a composite part with a substrate composed of a moulding compo...
|
|
JP5572322B2 |
Crosslinkable composition comprises: e.g. 5-50 (preferably 10-25) wt.% of at least a polyamide as component (a); 20-95 (preferably 60-89.5) wt.% of at least an alpha -olefin-vinyl acetate-copolymer as component (b); 0-30 (preferably 5-15...
|
|
JP2014141603A |
To provide a highly thermostable adhesive agent composition having a low dielectric constant and a low dielectric dissipation factor, and further excellent in adhesiveness to metals, an adhesive sheet obtained by molding the adhesive age...
|
|
JP5565931B2 |
|
|
JP5560208B2 |
|
|
JP5527861B2 |
Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epox...
|
|
JP5531017B2 |
Heat-activatable adhesive tape, in particular for the production and further processing of electronic components and conductor tracks, comprising an adhesive composition which comprises at least a) a polyamide, which is soluble in ethano...
|
|
JP5526525B2 |
|
|
JP5516044B2 |
To provide a photosensitive adhesive composition excellent in terms of resolution, adhesion and adhesive strength while it has a adequately reduced moisture permeability and moisture absorbing property and to provide a photosensitive ele...
|
|
JP5499031B2 |
An article comprising an adhesive having an acid number of less than about 5 is provided. The adhesive is selected from the group consisting of polyurea, polyamide, polyurethane, polyester, addition cure silicone and combinations thereof...
|
|
JP5498778B2 |
An alkoxysilane-containing resin is produced by reacting a terminal carboxyl group-containing oligomer with an isocyanato alkoxysilane compound.
|
|
JP5490403B2 |
|
|
JP5487634B2 |
|
|
JP5474834B2 |
This invention relates to the modification of bitumen by polymeric materials used particularly for the preparation of asphalt mixtures with enhanced mechanical properties, wherein the polymeric materials are selected from additives capab...
|
|
JP5460322B2 |
Disclosed is a thermosetting resin composition containing (i) a reactive hydroxy group-containing polyamide resin, (ii) at least one epoxy resin selected from the group consisting of epoxy resins having a polycondensate skeleton of dicyc...
|
|
JP5455377B2 |
Heat-sealable coating system, suitable for sealing various substrates, contains a film-forming dispersion based on polymers of the type (A) containing a polyester (mixture), (B) comprising a (meth)acrylate homo- or/and copolymer containi...
|
|
JP5454056B2 |
|
|
JP5446015B2 |
The present invention relates to an adhesive composition containing a compound having an azetidinium functional group, and an optical film and a polarizer both containing an adhesive layer formed using the adhesive composition.
|
|
JP5428306B2 |
|
|
JP5413521B2 |
|
|
JP5411629B2 |
|
|
JP5393791B2 |
The present invention relates to a process of making composite structures comprising applying an adhesive composition comprising a protein component, an azetidinium functionalized polymer component and a viscosity modifying component to ...
|
|
JP5385635B2 |
Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive res...
|
|
JP5384801B2 |
To provide a polyamide resin composition excellent in laser weldability and the like. The black laser welding polyamide resin composition comprises 100 pts.wt. polyamide resin (A), 0-100 pts.wt. reinforcing filler (B), and 0.01-1 pt.wt. ...
|
|
JP2013245245A |
To provide a pressure-sensitive adhesive for reinforcing a copper-clad laminate or a flexible wiring board, which has no occurrence of flotation from an adherend during a heat-treatment, has a slight rise in adhesive force by the heat-tr...
|
|
JP2013245243A |
To provide a pressure-sensitive adhesive that is a pressure-sensitive adhesive for bonding a support film to a glass plate, can maintain sufficient adhesion even exposed to a high-temperature environment when a following ITO sputtering t...
|
|
JP2013245244A |
To provide a pressure-sensitive adhesive that is a pressure-sensitive adhesive for pasting a support film to reinforce a glass substrate, can maintain adhesion even in formation of an image display element to be exposed to a high-tempera...
|
|
JP5354113B2 |
|
|
JP5342446B2 |
The invention relates to a two-component bonding agent system, consisting of a component A and a component B, comprising A) at least one polymer that possesses at least one Michael acceptor group, and in addition at least one Michael don...
|
|
JP5337526B2 |
To provide a method of easily and reliably forming a circuit at an inner periphery of an insulating base of a three-dimensional shape such as a cylindrical shape. A polyglycolic acid-based resin molded article is used as an insert materi...
|
|
JP5314012B2 |
This invention relates to a mixture of a polydiorganosiloxane polyamide-containing material and an organic polymer.
|
|
JP2013209674A |
To provide a new adhesive which can keep adhesiveness even under a high temperature environment, and to provide a method for using the same.An adhesive includes a condensation-based resin having structural units obtained by condensation-...
|
|
JP2013209484A |
To provide an adhesive composition which lowers adhesive force by heating, electromagnetic wave irradiation, or the like, to provide a filmy adhesive using the same, and to provide a method for peeling an adherend therewith.There are pro...
|
|
JP5286679B2 |
To provide an adhesive composition for electronic parts capable of forming an adhesive layer excellent in adhesive durability under an elevated temperature and in insulation durability under an elevated temperature and an elevated humidi...
|
|
JP5278136B2 |
To provide an adhesive solution excellent in storage stability of an adhesive composition comprising a nylon resin and an epoxy resin, and to provide an adhesive composition exhibiting a high adhesiveness to a polyimide film, excellent i...
|
|
JP5282643B2 |
To provide a heat-resistant adhesive composition containing a nylon resin, an epoxy resin, a novolac resin, and a hardening promotor and an adhesive composition which has an excellent adhesion to a polyimide film, exhibits excellent sold...
|
|
JP5246594B2 |
|
|
JP5240584B2 |
Disclosed is a method for joining two or several plastic parts of an electrical or electronic component, preferably a particularly multipole connector. According to said method, the plastic parts that are to be joined are joined together...
|
|
JP5239661B2 |
To provide a coverlay film superior in chemical resistance and excellent in processability. Disclosed is the coverlay film having a protective film and an adhesive layer, containing (A) a polyamide resin of 0.5 to 10 in amine value conta...
|
|
JP2013125598A |
To provide a curable film-like anisotropic conductive adhesive of a polymerizable (meth)acrylic type, which is improved in adhesive strength and connection reliability.The film-like conductive adhesive contains a film-forming resin (A), ...
|
|
JPWO2011096467A1 |
The glass with resin parts (20) includes the glass (11), the polyamide-based primer film (12) applied to the glass, the cyanoacrylic adhesive (16) applied to the polyamide-based prima film, and the cyanoacrylic adhesive (16). It consists...
|
