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JP2006169456A |
To provide a hot-melt adhesive for bonding rubber that does not use any organic solvent and can surely bond rubber to adherends (rubber, plastics, metals and the like) with high bond strength.In an adhesive comprising the hot-melt adhesi...
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JP2006159675A |
To provide a laminated film which can obtain a semi-glossy surface in addition to a glossy surface and a mat surface while keeping good image characteristics, weatherability, and handling properties.In the laminated film in which a prote...
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JP2006143940A |
To provide a hot melt resin composition for cold transfer coating, by which smooth coating can be performed without causing the scattering of dots and the like, dots with good appearance can be obtained after coating, and high adhesive s...
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JP3778459B2 |
To obtain a polyamide based hot melt adhesive having high bond strength and adheres at relatively low temperature and is capable of film forming. The subject composition is produced by mixing (a) 20-60 pts.wt. of polyamide resin, (b) 10-...
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JP3779334B2 |
PURPOSE: To improve heat resistance and adhesive force by incorporating a thermoplastic resin obtained by reacting a given thermo-plastic resin and a coupling agent. CONSTITUTION: An aromatic diamine and/or bisphenol is polycondensed wit...
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JP3776205B2 |
To prepare a self-locking agent composition which has little effect on the work environment or the human body when polyamide powder and/or copolyamide powder are applied to a screw member such as a bolt, and enable the self-locking screw...
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JP3774419B2 |
To provide a semiconductor device adhesive tape which is superior in wire-bonding properties and reflow resistance and which does not have the problem of interlayer peeling or the like. In the semiconductor device adhesive tape, a thermo...
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JP2006117824A |
To provide an adhesive composition for semiconductor devices which has low hygroscopicity, strong adhesivity and high reflow resistance.The adhesive composition for semiconductor devices contains (A) at least one kind of thermoplastic re...
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JP2006117863A |
To provide a hot melt adhesive comprising a new aromatic block copolymer, flexible and having excellent cold resistance and adhesiveness with a high softening temperature.The hot melt adhesive comprises the aromatic amide block copolymer...
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JP3769853B2 |
To provide a TAB tape having excellent adhesiveness and insulating property, by causing an adhesive layer to contain a polyamide resin and a crosslinked phenol resin as essential components. A TAB tape with an adhesive is made of a lamin...
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JP3762443B2 |
PURPOSE: To improve copolyamides to be used as hot-melt adhesives for heat sealing. CONSTITUTION: A hot-melt adhesive is composed only of a copolyamide having a melting point of lower than 140°C to be obtained by copolymerizing at least...
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JP2006057026A |
To provide a thermoplastic adhesive having excellent adhesion performance of a molded resin article and a metallic fixing tool and resistant to the deterioration of the adhesion performance even by the exposure to ultraviolet rays by the...
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JP3750669B2 |
To provide a tape having an adhesive for a semiconductor device which achieves soldering-heat resisting and moisture resisting reliability, and a copper clad laminate, a semiconductor connection board and a semiconductor device using the...
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JP2006052244A |
To provide a 2-pot type curable aqueous adhesive excellent in initial bonding strength, continuous bonding strength, durable bonding strength and preservation stability and also having less discoloration over time of its bonded layer, an...
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JP2006045322A |
To provide an adhesive composition which excels in processability and flexibility and can improve heat resistance and adhesiveness.The adhesive composition comprises (A) a modified polyamideimide resin obtained by copolymerizing (a) an a...
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JP2006500245A |
An insulating structural part for heat and noise insulation, especially automobile noise, provided at least partially with a fire resistant coating (3,5,6) consisting of at least the components (wt.%):ceramic adhesive (40-90), ceramic mi...
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JP2005336465A |
To provide a resin composition which has a sufficiently low stress property, even when used for large area adhesion uses, and exhibits good adhesiveness, and to provide a semiconductor device which uses the resin composition as a die att...
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JP2005336490A |
To provide a novel adhesive or sealant composition, which is usable of fixing directly a windshield into a metal frame of a motor vehicle.The composition comprises a crosslinkable polymer, a crosslinking catalyst of the polymer, a rheolo...
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JP3718357B2 |
To improve production efficiency when a cover lay of a flexible printed board is laminated and cut a cost by using adhesive which is excellent in liquid stability by one liquid and short in a setting time. The wiring board adhesive compo...
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JP2005320456A |
To provide a transfer sheet and a method for forming recording images capable of clearly forming images on a material to be transferred regardless of the shape or quality of the material to be transferred.The transfer sheet comprises a b...
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JP2005314445A |
To obtain a reactive hot-melt adhesive that keeps a long adhesion time after application, improves initial adhesive power, thereby prevents a strain adherend from separating and peeling, especially prevents an adherend in a working envir...
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JP2005307152A |
To provide a thermosetting adhesive composition that can improve flexibility and high temperature reliability by increasing the interface adherence between the substrate film and the adhesive and provide a thermosetting adhesive composit...
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JP2005532440A |
The invention relates to a polymer composition which comprises at least one at least semicrystalline polymer having no ionic groups and comprises at least one compound with plasticizing properties, and which comprises having 0.1 to 30% b...
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JP2005298673A |
To provide a tape which is used for fixing lead frames, has excellent electric reliability at high temperature and can be adhered at low temperature, to provide a lead frame using the tape for fixing the lead frames, and to provide a sem...
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JP3702922B2 |
To produce the filter having an excellent heat resistance and chemical resistance, hardly causing a falling of a constituent fiber and also excellent in pressure resistance and filtering precision by heat-treating and forming a non-woven...
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JP3700243B2 |
To provide an adhesive tape for TAB(tape automated bonding) having high adhesion after a resist process and a plating process and excellent moisture resistance and insulation and improve the reliability of a semiconductor device using th...
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JP3700297B2 |
To improve the reliability of the insulation of a TAB tape or adhesion of TAB leads by strictly controlling the fluidity of adhesive so that the max. overhang of an adhesive-coated tape for TAB is at most a specified value. An adhesive-c...
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JP2005226062A |
To provide a method for molding and processing an -caprolactam polymer through anionic polymerization suitable for mass production.A strong film of the -caprolactam polymer is formed on a surface of a target material, by coating the targ...
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JP2005220356A |
To provide an adhesive film for semiconductor, capable of bonding, in a semiconductor device, semiconductor elements to a lead frame at low temperatures, and having good temperature cycling endurance.The adhesive film for semiconductor c...
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JP3679172B2 |
To obtain thermally bonding fabric capable of effectively applying the pressure in heat bonding to bonding, free from transfer of an adhesive to the surface of base fabric, excellent in adhesive force and the appearance of the base fabri...
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JP2005179670A |
To provide an adhesive composition giving excellent adhesive strength and releasing strength.The invention relates to the two-component water-base adhesive composition that includes (a) a first component containing the reaction product o...
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JP3668587B2 |
To obtain a medical adhesive having suitable internal cohesion, flexibility, good drug-retaining/releasing properties, and suitable adhesion to the skin, excellent in followingness to the skin and low in stimulation by using a specific p...
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JP2005162998A |
To provide an adhesive for bonding in a mold, preventing the adhesive applied to the surface of a metal insert from being flown away by a flowing pressure of a molten resin in an injection molding, bonding the metal insert with the resin...
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JP2005146289A |
To provide a structure having a fluoropolymer layer and a bonding layer of a polymer whose base is piperazine.The structure has the fluoropolymer layer and the bonding layer whose base is polyamide and which is directly stuck to at least...
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JP2005146212A |
To provide a single-sided adhesive tape which is free from a supporting substrate and has a sufficient strength.The single-sided adhesive tape comprises an adhesive layer and a non-adhesive coating layer set on the single side of the adh...
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JP3657578B2 |
To provide a novel composition useful for, particularly, an adhesive which avoids using a toxic raw material like an isocyanate without losing desirable characteristics for an adhesive due to a low molecular weight raw material. A manufa...
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JP3653499B2 |
To provide a poly(imide-benzoxazole) (PIBO) copolymer using, as raw materials, a trimellitic anhydride halide monomer and a bis(o- diaminophenol) monomer. This PIBO copolymer has the following repeating unit, wherein X is-O-,-S-,-C(CF3)2...
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JP2005126563A |
To provide an adhesive for thermal fusion bonding which, even when subjected to high-temperature thermal fusion bonding for a long time, gives an adhesive interlining with sufficient adhesive power.The adhesive for thermal fusion bonding...
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JP2005126562A |
To provide an adhesive for thermal fusion bonding which, even when subjected to high-temperature thermal fusion bonding for a long time, gives an adhesive interlining with sufficient adhesive power.The adhesive for thermal fusion bonding...
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JP3644181B2 |
To obtain a product superior in adhesion, chemicals resistance and insulation, by using an adhesive layer contg, a thermoplastic resin A and epoxy resin B contg. an epoxy resin b shown by specified formula as a necessary component. A tap...
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JP3642912B2 |
To provide a new adhesive for medical treatment which has a sufficient adhesion, and is excellent in the stability for an adhering performance, and a function as a sticking preparation, etc. A polyether, and polyester, polyamide skeleton...
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JP2005036126A |
To provide an epoxy resin composition having excellent repeated flexing resistance, adhesiveness, heat resistance, moisture resistance, and electrical reliability, especially the electrical reliability at high temperature in high humidit...
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JP3616377B2 |
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JP3612921B2 |
To obtain a product superior in adhesion, chemicals resistance and insulation by using an adhesive layer contg. a thermoplastic resin A and an epoxy resin B which contains an epoxy resin shown by specified formula as a necessary componen...
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JP3611743B2 |
To provide a heat-sealing adhesive film which prevents a thin card-like article, which is a seal molded product of the film, from warping or twisting, without deteriorating the heat-sealing adhesion property of a heat-sealing adhesive la...
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JP3603220B2 |
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JP2004356369A |
To provide a tape with an adhesive for a semiconductor having an adhesive layer with excellent quality stability by realizing application to various usages and reducing a process cost, and to provide a substrate for connecting a semicond...
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JP3594611B2 |
PCT No. PCT/EP96/00064 Sec. 371 Date Jul. 3, 1997 Sec. 102(e) Date Jul. 3, 1997 PCT Filed Jan. 9, 1996 PCT Pub. No. WO96/21691 PCT Pub. Date Jul. 18, 1996Biodegradable polyetheresteramides Q1 with a molecular weight (Mn) in the range fro...
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JP3594612B2 |
PCT No. PCT/EP96/00067 Sec. 371 Date Jul. 3, 1997 Sec. 102(e) Date Jul. 3, 1997 PCT Filed Jan. 8, 1996 PCT Pub. No. WO96/21692 PCT Pub. Date Jul. 18, 1996Biodegradable polyesteramides as defined in the specification obtained by reacting ...
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JP3596237B2 |
To improve the adhesive property, the chemical resistance and the insulating characteristics at a high temperature by a method wherein a thermoplastic resin, an epoxy resin, silica particles and a silane coupling agent are contained as e...
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