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WO/2023/042409A1 |
The purpose of the present invention is to provide an adhesive sheet having an adhesive agent layer that has an adhesive surface having a wettability unlikely to change even when being exposed in an air environment and that is unlikely t...
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WO/2023/040076A1 |
The present invention relates to the technical field of sealants, and in particular, to an acrylate sealant for construction and a preparation method therefor. The acrylate sealant for construction comprises preparation raw materials of:...
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WO/2023/037721A1 |
Provided are an optical laminate that has excellent anti-static performance and excellent humidification durability, and an image display device that uses the optical laminate. An optical laminate according to the present invention compr...
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WO/2023/038123A1 |
Provided is an adhesive-layer-equipped substrate having a substrate and an adhesive layer disposed on the substrate, wherein: the adhesive layer contains polymer particles (A), an inorganic oxide (B), and a light-shielding agent (D); the...
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WO/2023/033075A1 |
Provided is an adhesive composition having both high adhesive strength and improved cohesive failure rate. An adhesive composition that includes a thermosetting resin (component (A)), a toughening agent (component (B)), a curing agent ...
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WO/2023/033176A1 |
The purpose of the present invention is to provide an adhesive tape for semiconductor device manufacturing, which is excellent in chip component delamination performance, and which is capable of preventing adhesive residue from remaining...
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WO/2023/033064A1 |
Provided is a refractive index adjustment agent for adjusting the refractive index of adhesives, wherein this refractive index adjustment agent for adhesives is an organic compound comprising a structure having at least two substituents ...
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WO/2023/033074A1 |
The present invention provides an adhesive composition which has achieved a good balance between high bonding strength and improvement of cohesive failure ratio. The present invention provides an adhesive composition which contains a t...
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WO/2023/032685A1 |
The present invention provides an antireflection film with a pressure-sensitive adhesive sheet, the antireflection film being suitable for use in organic EL display devices (OLEDs). This antireflection film 10 with a pressure-sensitive a...
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WO/2023/033076A1 |
Provided is an adhesive composition having both a high adhesion strength and an improved cohesive failure rate. The adhesive composition comprises a heat-curable resin [referred to as component (A)], thermoplastic-resin particles [refe...
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WO/2023/032135A1 |
The purpose of the present invention is to provide a heat-removable pressure-sensitive adhesive tape which is suitable for use in high-temperature heating steps and, when heated at a higher temperature after use in a heating step, can be...
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WO/2023/027563A1 |
Various embodiments of the present disclosure relate to an electronic device including a ceramic resin composite frame. Various embodiments of the present disclosure may provide an electronic device including a ceramic structure, the ele...
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WO/2023/026687A1 |
Provided are: an adhesive composition that has a low resistance and excellent reworkability, and can inhibit the occurrence of dents; and a polarizing plate using the adhesive composition. The adhesive composition according to an embodim...
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WO/2023/022076A1 |
The present invention provides a production method for an adhesive sheet 1A for semiconductor device production that comprises a release film 2 and an adhesive film 3 that is provided on the release film 2. The production method for the ...
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WO/2023/022029A1 |
The purpose of the present invention is to provide an adhesive layer-attached polarizing film having a separator, whereby both easy peelability of the separator and high temperature durability of the adhesive layer are achieved. In the...
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WO/2023/022094A1 |
A curable adhesive composition for use in bonding wiring members as a component of a multilayered wiring board. The curable adhesive composition gives a cured object which, when the thermal expansion coefficient and glass transition temp...
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WO/2023/022185A1 |
Provided is an adhesive sheet that has an adhesive agent layer which is curable by active energy rays and in which a reduction in hardness is suppressed by including a curable component. The provided adhesive sheet comprises an adhesive ...
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WO/2023/022027A1 |
The purpose of the present invention is to provide a polarizing film equipped with an adhesive layer that has a separator, the film being conductive and achieving both a separator that can easily be separated and an adhesive layer that i...
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WO/2023/017831A1 |
The present invention relates to a method for expanding a pressure-sensitive adhesive sheet which comprises a substrate and a pressure-sensitive adhesive layer, wherein at least one layer included in the pressure-sensitive adhesive sheet...
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WO/2023/017832A1 |
The present invention relates to a method for manufacturing a semiconductor device using an adhesive sheet for semiconductor processing having a base material, an intermediate layer, and an adhesive layer in that order, one or more layer...
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WO/2023/013529A1 |
A connector manufacturing method with excellent production efficiency is provided. This connector manufacturing method involves processes 1 and 2 below. Step 1: a step in which a coating liquid for a conductive adhesive agent layer, wh...
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WO/2023/013387A1 |
A composition for bonding that comprises component (A), which is a first polymerizable monomer, component (B), which is a rubber component, component (C), which is a polymer component having a first reactive functional group, and compone...
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WO/2023/013651A1 |
A bonding method for bonding an adherend (120) with an adhesive (11) for high-frequency dielectric heating, the bonding method comprising a placement step in which the electrodes of a dielectric heater (50), the adherend (120), and a spa...
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WO/2023/013400A1 |
The present invention provides an adhesive that can obtain both a high refractive index and flexibility. Provided is an adhesive having a refractive index of 1.55 or more and a storage modulus G' (0°C) at 0°C in the range of 1.0×104 P...
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WO/2023/007982A1 |
The present invention provides: a novel phosphorus compound having an isocyanurate ring; a synthetic method for said phosphorus compound; a flame retardant containing said phosphorus compound; and a resin composition containing said phos...
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WO/2023/007947A1 |
This mold release film comprises a base material layer and an adhesive layer, wherein the thickness of the adhesive layer is 4-30% of the total thickness of the base material layer and the adhesive layer, and the thickness of the base ma...
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WO/2023/008542A1 |
The present invention aims to provide a curable resin composition that has excellent curing characteristics and a high refractive index for cured products. In addition, the present invention aims to provide a sealant for display elements...
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WO/2023/002981A1 |
The present invention provides: an adhesive composition which is capable of forming an adhesive layer that has a low dielectric constant and a low dielectric loss in a high frequency band, while having dielectric characteristics that are...
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WO/2023/002970A1 |
Provided is a curable adhesive composition comprising a binder resin (A) having a reactive functional group, a poly(phenylene ether) resin (B) having a vinyl group and a number-average molecular weight of 1,500 or higher but lower than 5...
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WO/2023/002982A1 |
Provided are: a pressure-sensitive adhesive agent composition capable of forming a pressure-sensitive adhesive agent layer that has low dielectric constant and dielectric loss at a high frequency band, that is unlikely to be affected by ...
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WO/2023/286576A1 |
The present invention aims to provide a novel polarizing plate that: has an adhesive layer formed from an adhesive that has sufficient pot life during production; and suppresses reduction in transmittance when exposed to high-temperature...
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WO/2023/286575A1 |
The purpose of the present invention is to provide a polarizing plate having a hard coat layer on the surface such that even when the polarizing plate and a transparent member are bonded together by a UV-curable silicone adhesive composi...
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WO/2023/286681A1 |
A tape laminate is provided which, when used to seal a flow path, enables suppressing gas leakage and contamination while not being prone to peeling due to gas generation. This tape laminate 1 is provided with: a first substrate 2; a f...
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WO/2023/286757A1 |
The present invention addresses the problem of providing an adhesive agent composition having excellent nanocellulose dispersing ability. Said problem can be solved by an adhesive agent composition containing nanocellulose and a resin th...
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WO/2023/281861A1 |
[Problem] To provide a protective sheet for semiconductor processing that sufficiently suppresses electrostatic charge generated during processing of a wafer, even if the wafer is being thinned by DBG or the like, and that inhibits crack...
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WO/2023/282008A1 |
The present invention provides a double-sided adhesive sheet that has excellent impact resistance and excellent reworkability. A double-sided adhesive sheet 1 comprises an adhesive layer 2. The thickness of the double-sided adhesive sh...
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WO/2023/281215A1 |
The invention relates to 1) a crosslinkable adhesive composition comprising: at least one polymer (A) comprising a hydrolysable alkoxysilane group; at least one tackifying resin (B); at least one fumed silica (C), preferably hydrophic; a...
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WO/2023/281860A1 |
[Problem] To provide: a protective sheet for semiconductor processing, the protective sheet being suppressed in breakage of a wafer when the protective sheet for semiconductor processing is removed therefrom even in cases where the wafer...
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WO/2023/281996A1 |
The present invention addresses the problem of providing an adhesive tape for wafer processing that combines tensile stress and uniform expandability suitable for a step of dividing an adhesive layer by expansion, and high shrinkability ...
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WO/2023/281859A1 |
[Problem] To provide a protective sheet for semiconductor processing, the protective sheet being suppressed in the occurrence of a crack in a chip when the protective sheet is removed from the chip even in cases where a wafer is processe...
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WO/2023/282310A1 |
The present invention provides an adhesive tape which is able to be removed by heating in a short time, while being capable of preventing thermal damage to an adherend, and which is removed by heating by an easy operation. The present ...
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WO/2023/281858A1 |
[Problem] To provide a protective sheet for semiconductor processing that sufficiently suppresses an electrostatic charge produced during processing of a wafer and suppresses cracking of chips during peel-off, even when the wafer is proc...
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WO/2023/282311A1 |
The present invention provides an adhesive tape which is able to be removed by heating in a short time, while being capable of excellently preventing thermal damage to an adherend. The present invention provides an adhesive tape which ...
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WO/2023/281216A1 |
The invention relates to: (1) A cross-linkable adhesive composition comprising: - at least one polymer (A) comprising a hydrolysable alkoxysilane group; - at least one tackifying resin (B); - at least one fumed silica (C), preferably hyd...
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WO/2023/276304A1 |
A polarizing plate according to the present invention includes at least an optical film, an adhesive layer, and a polarizer layer, wherein: the optical film contains at least a cycloolefin polymer having a polar group; the half width of ...
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WO/2023/276936A1 |
Provided is a polarizing film in which a transparent protective film is stacked on at least one surface of a polarizer with an adhesive layer therebetween, the polarizing film being characterized in that in at least part of the polarizer...
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WO/2023/277184A1 |
The present invention provides a star polymer which has an arm section derived from an arm polymer obtained by polymerizing a vinyl monomer, and a core section containing a structure derived from a polyfunctional alkenyl compound for cro...
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WO/2023/276931A1 |
Provided is a polarizing film in which a transparent protective film is laminated on at least one surface of a polarizer with an adhesive layer interposed therebetween. The polarizer has a non-polarizing part having a recess formed on on...
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WO/2023/276638A1 |
A method for producing a multilayer body that comprises two silicon substrates, the method comprising a novel process for bonding the two silicon substrates. A method for producing a multilayer body that comprises two silicon substrates,...
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WO/2023/276932A1 |
Provided is a polarizing film in which a first transparent protective film is layered on one surface of a polarizer via a first adhesive layer. A non-polarizing part is formed in at least a portion of the polarizer, and the polarizer sat...
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