Login| Sign Up| Help| Contact|

Patent Searching and Data


Matches 101 - 150 out of 14,997

Document Document Title
WO/2023/017831A1
The present invention relates to a method for expanding a pressure-sensitive adhesive sheet which comprises a substrate and a pressure-sensitive adhesive layer, wherein at least one layer included in the pressure-sensitive adhesive sheet...  
WO/2023/017832A1
The present invention relates to a method for manufacturing a semiconductor device using an adhesive sheet for semiconductor processing having a base material, an intermediate layer, and an adhesive layer in that order, one or more layer...  
WO/2023/016701A1
The invention relates to a projection exposure system (1, 101) for semiconductor lithography, comprising two materially bonded components (31, 32); wherein the material bond is produced by an adhesive layer (35); wherein the adhesive lay...  
WO/2023/018457A1
A two-part epoxy and delivery system having at least one tube containing one component of a two-part epoxy, the tube having an enlarged opening for dispensing strengthening fibers through the enlarged opening mixed with the one component...  
WO/2023/013387A1
A composition for bonding that comprises component (A), which is a first polymerizable monomer, component (B), which is a rubber component, component (C), which is a polymer component having a first reactive functional group, and compone...  
WO/2023/013651A1
A bonding method for bonding an adherend (120) with an adhesive (11) for high-frequency dielectric heating, the bonding method comprising a placement step in which the electrodes of a dielectric heater (50), the adherend (120), and a spa...  
WO/2023/008747A1
The present invention relates to an adhesive sheet and, more specifically, to an adhesive sheet comprising a substrate film having a predetermined range of water contact angle and an adhesive layer disposed on the substrate film. The pre...  
WO/2023/008204A1
This layered body manufacturing method includes: a step in which a first adhesive coating layer is formed on a surface of a support substrate; a step in which a second adhesive coating layer is formed on a surface of a semiconductor subs...  
WO/2023/008207A1
This layered body manufacturing method includes: a step in which a first adhesive coating layer is formed on a surface of a release agent coating layer formed on a surface of a support substrate; a step in which a second adhesive coating...  
WO/2023/281101A1
The invention relates to a method for determining the state of the mechanical properties of a bonded assembly of materials by applying a local heat source that excites particles comprised within the adhesive and investigating the effect ...  
WO/2023/275795A1
To provide a double-sided adhesive tape with both high adhesive force and excellent ease of disassembly. A double-sided adhesive tape including a first adhesive layer; a separation layer containing a pigment, the separation layer being p...  
WO/2022/270502A1
The present invention provides an optical multilayer body which is obtained by stacking a reflective polarizer and an absorptive polarizer, and which has high image sharpness in a virtual reality display device to which this optical mult...  
WO/2022/269426A1
Dispensed adhesive compositions including a core-sheath filament comprising a non-tacky sheath and an adhesive core comprising a polymer, where the dispensed adhesive composition is a product resulting from compounding the core-sheath fi...  
WO/2022/270613A1
A method for manufacturing a bonded body, having: a pre-bonding step in which a substrate A, a solid bonding agent, and a substrate B are positioned in this order to prepare a layered body, said solid bonding agent having, as the primary...  
WO/2022/271781A1
The present teachings generally relate to an adhesive or adhesive component for multi-material hot melt adhesive bonding. The adhesive or adhesive component comprises a reaction product of two or more monomers or prepolymers, wherein the...  
WO/2022/263128A1
The invention relates to a contact device (1) comprising an electrically conductive substrate (2) and at least one electrically conductive, deformable, preferably permeable, contact means (3, 3'), wherein the substrate (2) and the contac...  
WO/2022/255382A1
The present invention provides a single component composition for temporary fixing of thin layer glass. The composition exhibits excellent photocuring properties and enables thin layer glasses to be strongly temporarily fixed to each oth...  
WO/2022/250981A1
In one example, a method of preparing a fluidic channel includes covalently coupling a first region of a substrate to a first region of a cover using first moieties covalently coupled to the first region of the substrate and second moiet...  
WO/2022/246336A1
Photocurable compositions are provided herein, which provide a balance of fast curing properties at exposure to radiation in the electromagnetic spectrum and impressive cure through depth.  
WO/2022/245573A1
Bonding dissimilar materials of medical device components can be carried out by applying an adhesive on at least one surface of two components which are composed of dissimilar materials and contacting the surfaces and exposing the contac...  
WO/2022/230199A1
This substrate bonding apparatus comprises a first holding mechanism that holds a first substrate, a second holding mechanism that holds a second substrate and can change the distance between the first substrate and the second substrate,...  
WO/2022/226796A1
A silicone pressure sensitive adhesive is prepared by curing a hydrosilylation reaction curable composition. The silicone pressure sensitive adhesive adheres to silicone elastomers and is useful in preparation of components of flexible d...  
WO/2022/230928A1
A heat releasable adhesive which contains a (meth)acrylic polymer having, in a side chain and/or at an end, a kinetic covalent bond that is capable of reversibly making a dissociation and a bond by means of heating and cooling. An articl...  
WO/2022/225152A1
The present invention relates to a dual curable hybrid resin composition and a display adhesive using same, and, more specifically, has excellent initial adhesive strength after UV curing since a moisture curable component and a radiatio...  
WO/2022/221780A2
The present disclosure is generally directed to solvent mixtures for swelling and bonding polymeric substances for use in facilitating the connection of polymeric substances to other parts. A swelling solvent solution according to the pr...  
WO/2022/218630A1
The present application is directed to a bonded structure comprising: a first substrate having an electrically conductive surface; and, a second substrate having an electrically conductive surface; wherein an electrochemically-debondable...  
WO/2022/216904A1
Curable heat-expanding debondable coating compositions for use as a pre-coating or surface preparation in conjunction with adhesive composition. The debondable coating compositions include heat-expandable microspheres which are designed ...  
WO/2022/215040A1
Various embodiments of an adhesive prediction system are disclosed. The system can include a non-transitory computer-readable medium including instructions that, when implemented on a processor, cause the processor to perform operations ...  
WO/2022/215039A1
Various embodiments of a hand tape applicator and system including such applicator are disclosed. The hand tape applicator includes a body, a spindle connected to the body that is configured to receive a tape roll that includes tape, and...  
WO/2022/215041A1
Various embodiments of a module or apparatus for characterization of surface quality of a surface of a substrate and a system that includes such apparatus are disclosed. The apparatus includes a sensor configured to detect at least one p...  
WO/2022/207300A1
The present invention is directed to a curable and electrochemically debondable two-component (2K) adhesive composition comprising: a first component comprising: i) at least one polyol selected from the group consisting of fatty alcohols...  
WO/2022/210413A1
An aspect of the present invention relates to a bonded object or a method for producing the bonded object, the bonded object comprising substrates bonded to each other by an adhesive layer obtained from a fluororubber composition compris...  
WO/2022/208316A1
The present disclosure provides an adhesive precursor composition, comprising a polyfunctional acrylate oligomer, a reactive diluent including an acrylate monomer; a photoinitiator; and heat-expandable microspheres which are capable of e...  
WO/2022/207392A1
Provided is a method for forming a bond between two substrates of a device, comprising the steps of: providing a first substrate and a second substrate of a device; providing a first functionalized polyelectrolyte polymer (A) comprising ...  
WO/2022/209222A1
The present invention addresses the problem of providing: adhesive tape in which adhesive force with respect to an adherend can be adequately reduced and which can easily be detached and removed, without damaging or dirtying the adherend...  
WO/2022/213078A1
A system for attaching a phenolic panel to a metal part includes a phenolic laminate panel having (i) a phenolic panel, (ii) a ferromagnetic susceptor bonded at an inner side of the phenolic panel via higher melting point adhesive and (i...  
WO/2022/210068A1
Provided is an adhesive composition, wherein: an adhesive-coated layer obtained by applying the adhesive composition has a complex viscosity of 10-10,000 Pa∙s at 25-100ºC; and the viscosity reduction rate of the adhesive-coated layer,...  
WO/2022/200199A1
The invention relates to a method for preparing an adhered article by conducting single-sided gluing, an adhered article, and the use of an adhered article in the production of footwear. The method comprises: a. applying a cleaning agent...  
WO/2022/201613A1
An adhesive sheet 1 is for bonding two rigid sheets together. At least one of the two rigid sheets has a contoured surface on a side to be bonded to the other rigid sheet. The adhesive sheet is provided with: a composite adhesive layer 1...  
WO/2022/202153A1
Provided is an adhesive composition which is suitable for temporarily bonding a bumped semiconductor substrate to a supporting substrate and which gives an adhesion layer that can inhibit or reduce bump deformation caused by an external ...  
WO/2022/203033A1
Provided is an ink-jet adhesive which, when a transparent member is used as an adherent member, can inhibit a component of the adhesive from adhering to areas of the transparent member which are not intended to be bonded. This ink-jet ...  
WO/2022/202160A1
A temperature-sensitive adhesive according to the present invention contains an ultraviolet curable side-chain crystalline polymer which is a reaction product of side-chain crystalline polymer and a compound having an ultraviolet curable...  
WO/2022/200974A1
The present invention relates to adhesive mixtures. In particular, the invention concerns the use of lignin in biobased hot-melt (non-pressure sensitive) and pressure sensitive adhesives, as well as novel adhesive mixtures suitable for u...  
WO/2022/202659A1
Provided is a workpiece processing method in which a workpiece such as a wafer is processed in a state of a layered body obtained by fixing the workpiece to a support body via a temporary fixing material, wherein the workpiece such as a ...  
WO/2022/202822A1
This adhesive composition contains a modified polyolefin resin. The polyolefin resin is obtained by modifying a polyolefin resin with an unsaturated carboxylic acid and a radically reactive aromatic compound. The heat of fusion of the po...  
WO/2022/194716A1
The invention is directed to a method for adhesively bonding two substrates, comprising the steps: a) applying a liquid, radiation-curable primer composition onto the surface of a first substrate; b) curing the liquid, radiation-curable ...  
WO/2022/194241A1
The present invention relates to the technical field of processing and manufacturing. Disclosed are a protective colloid and a use method therefor. The protective colloid is prepared from the following raw materials: a UV epoxy modified ...  
WO/2022/189577A1
The present invention relates to a composition formed of a hot melt adhesive having a colour-forming compound admixed therein. The invention further relates to a substrate or multi-layer substrate construction having the composition appl...  
WO/2022/189646A1
The present invention relates to a specific triazine silane compound, an oligomer thereof, a mixture comprising said compound and/or said oligomer, as well as a respective storage and working solution. Furthermore, the present invention ...  
WO/2022/186914A1
A synthetic glass screen protector apparatus may include a polymethyl methacrylate (PMMA) layer. The apparatus may further include an A-B glue layer, where the A-B glue layer includes an optically clear adhesive sub-layer and a silicone ...  

Matches 101 - 150 out of 14,997