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WO/2024/070341A1 |
The present invention addresses the problem of providing a metal nanowire production method that makes it possible to obtain a metal nanowire having high joining strength at the time of joining. A metal nanowire production method accordi...
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WO/2024/068552A1 |
Porous metal plate material and process for producing such a material. The material comprises a perforated metal base plate and an electrodeposited layer with pin-shaped protrusions on at least one side of the perforated base plate made ...
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WO/2024/051152A1 |
A flexible foil production system, relating to the technical field of water plating. The system comprises first liquid accumulation rollers, tension rollers, first electrical conduction rollers and second electrical conduction rollers, w...
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WO/2024/051952A1 |
The present invention relates to an electrolytic copper foil having an excellent elongation by adjusting an average cross- sectional grain size on at least one surface area of the electrolytic copper foil, with respect to a cross-section...
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WO/2023/239399A9 |
The production of a porous copper-zinc structure includes providing copper ink, creating a 3D model of the porous copper-zinc structure, 3D printing the copper ink into a porous copper lattice structure using the 3D model, heat treatment...
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WO/2024/031243A1 |
A composite foil and a preparation method therefor and application thereof. The composite foil comprises a metal elemental substance layer, and metal alloy layers, which are closely attached to two opposite surfaces of the metal elementa...
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WO/2024/025070A1 |
The present invention relates to an assembly-type single-cell alkaline water electrolysis module comprising individual stacks in which each of bipolar plates, gaskets, diffusers, electrodes, and cell frames are sequentially arranged on a...
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WO/2024/018005A1 |
The invention concerns a treated copper foil for use in a secondary battery with a first side and a second side opposite to the first side. The treated copper foil comprises a copper foil with two opposite surfaces and a treatment stack ...
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WO/2024/014745A1 |
The present invention relates to a heat treatment method by which deformation such as curl can be reduced and a low thermal expansion coefficient obtained through thermomechanical heat treatment of an Fe-Ni alloy foil. The heat treatment...
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WO/2024/014744A1 |
The present invention relates to a manufacturing apparatus and a manufacturing method therefor, which can manufacture, with high quality, through continuous plating, a metal foil such as an iron-nickel alloy foil, a nickel foil and a cop...
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WO/2024/014782A1 |
The present invention relates to an electroconductive contact pin, and the objective of the present invention is to manufacture a metal molded product with a high aspect ratio, the metal molded product using a mold made of an anodized fi...
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WO/2023/234026A1 |
A method for manufacturing an electroformed component, provided with: a step for forming an electroformed layer around a wire in an electroforming tank disposed on a pathway along which the wire is transported; a step for inspecting the ...
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WO/2023/234770A1 |
The present invention relates to a porous material comprising a porous wall structure defining and separating primary pores that are interconnected across its thickness dimension. The primary pores have a diameter greater than 5 µm and ...
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WO/2023/234027A1 |
The present invention provides a method for producing an electroformed member, the method comprising: a step for forming an electroformed layer around a wire rod; a step for detecting an abnormal part of at least one of the wire rod and ...
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WO/2023/234564A1 |
The present invention relates to a selective electrochemical additive manufacturing (S-ECAM) printing device which can selectively deposit metal raw materials on a substrate using electrochemical additive manufacturing (ECAM). In additio...
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WO/2023/234565A1 |
The present invention relates to a selective electrochemical additive manufacturing (S-ECAM) printing device which can selectively build up layers of metal materials on a substrate by using electrochemical additive manufacturing (ECAM). ...
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WO/2023/219264A1 |
A method for manufacturing an electrolytic copper foil, according to one embodiment of the present invention, comprises the steps of: dissolving copper (Cu) and nickel (Ni) in sulfuric acid to prepare an electrolytic solution containing ...
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WO/2023/219269A1 |
A method for controlling the properties of an electrolytic copper foil, according to one embodiment of the present invention, adds a glossiness control agent so as to adjust the glossiness of an electrolytic copper foil, and thus control...
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WO/2023/210458A1 |
This shafting comprises a wire rod, an electroformed layer positioned around the wire rod, and a sacrificial layer positioned between the wire rod and the electroformed layer.
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WO/2023/211722A1 |
An industrial process is conducted within a sealed chamber filled with dimethylformamide (DMF) saturated with CO2 under pressure which provides the carbon atoms for manufacturing graphene. A copper wire comprising an anode is reeled betw...
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WO/2023/210459A1 |
A method for manufacturing an electroformed tube comprising a step for moving at least one of a positive electrode and at least one wire material operating as a negative electrode, the movement being carried out in the surroundings of th...
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WO/2023/197070A1 |
Systems and methods for generating hydrogen gas are described herein. The systems include a fluidized bed reactor configured to receive a feed stream including hydrocarbons and direct the feed stream through particles within a chamber of...
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WO/2023/189566A1 |
Provided is a metal foil with a carrier that makes it possible to suppress the occurrence of breakage or cracking of the metal foil during handling. This metal foil with a carrier comprises a carrier, a release layer, and a metal foil in...
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WO/2023/186895A1 |
A method of synthesizing a layer of two-dimensional material or a stack of layers of two-dimensional material comprises: providing (101) a liquid precursor composition on a flat surface of a liquid metal, the liquid metal being a metal o...
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WO/2023/189565A1 |
Provided is a carrier-attached metal foil in which the occurrence of fractures or cracks in the metal foil during handling thereof can be suppressed. The carrier-attached metal foil comprises a carrier, a release layer, and a metal foil ...
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WO/2023/190845A1 |
Provided are a copper foil having high adhesion to a coating film, and a light-shielding material having, in addition to excellent light shielding properties, high adhesion to a black coating film and a substrate. A copper foil (1) has, ...
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WO/2023/188757A1 |
[Problem] To provide a metal foil that achieves folding resistance, thinness, and corrosion resistance at a further high level. [Solution] This alloy electrolytic foil is formed of an alloy based on iron and nickel, and is characterized ...
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WO/2023/182177A1 |
The present invention provides a roughened copper foil which can have both high adhesion to a thermoplastic resin and excellent high-frequency characteristics at the same time. This roughened copper foil has a roughened surface on at lea...
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WO/2023/182178A1 |
Provided is a roughened copper foil capable of achieving both high adhesiveness to a thermoplastic resin and exceptional high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. The ...
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WO/2023/182176A1 |
Provided is a roughened copper foil capable of achieving both high adhesion to a thermoplastic resin and excellent high-frequency characteristics. The roughened copper foil has at least one roughened surface. The roughened surface has a ...
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WO/2023/182837A1 |
Disclosed is a method for manufacturing a fine metal mask, the method comprising the steps of: a) patterning a plated resist on a substrate; b) forming a metal plated layer on the substrate exposed through the patterned plated resist; c)...
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WO/2023/182179A1 |
Provided is a roughened copper foil capable of exhibiting both good adhesion to a thermoplastic resin and superior high-frequency characteristics. The roughened copper foil has a roughened surface on at least one side thereof. The roughe...
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WO/2023/182174A1 |
Provided is a roughened copper foil capable of achieving both high adhesion to a thermoplastic resin and excellent high-frequency characteristics. The roughened copper foil has at least one roughened surface. Provided is a roughened copp...
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WO/2023/182175A1 |
Provided is a roughened copper foil capable of achieving both high adhesiveness to thermoplastic resins and excellent high-frequency characteristics. This roughened copper foil has a roughened surface on at least one side thereof. The ro...
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WO/2023/142599A1 |
The present application relates to the field of assembly of biomacromolecules, and discloses a preparation method for a collagen material stripped from an electrode, and a use of the collagen material. The preparation method for the coll...
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WO/2023/140011A1 |
The present invention addresses the problem of providing: a metal nanowire production method whereby it is possible to obtain a metal nanowire with low connection resistance; a metal nanowire; a dispersion liquid; and a conductive film. ...
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WO/2023/127394A1 |
This method for producing an electrocast tube includes a core material preparation step (S1), an electroconductive layer formation step (S3), a support layer formation step (S5), a support-layer-equipped core material cutting step (S7), ...
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WO/2023/118001A1 |
The invention relates to an electrodeposited copper foil and its manufacturing method. The copper foil has an as produced tensile strength above 52 kgf/mm2, presents tensile strength above 50 kgf/mm2 after 120 days at 35°C, and presents...
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WO/2023/117127A1 |
The present invention provides an electrolytic copper foil having improved elongation and electrical conductivity due to an increase in shape deformation of grains selective to a specific direction and an increase in an average grain siz...
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WO/2023/116705A1 |
An electrolytic solution for a copper foil, and the preparation and use of an electrolytic copper foil. The electrolytic solution for a copper foil comprises an additive, wherein the additive comprises an inhibitor and an auxiliary agent...
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WO/2023/117128A1 |
The present invention provides an electrolytic copper foil securing high strength (e.g., tensile strength) characteristics by maintaining an area ratio of fine grains and grain boundaries in the electrolytic copper foil even after high-t...
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WO/2023/117126A1 |
The present invention provides a double layered electrolytic copper foil of which various physical properties may be freely controlled and a method of manufacturing the same.
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WO/2023/101419A1 |
The present invention relates to a copper foil manufacturing apparatus comprising: a plating tank (100) filled with an electrolyte; a negative electrode drum (300) including an inner drum body (310) which is made of copper and to which t...
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WO/2023/075196A1 |
Disclosed is an electrolytic copper foil for a current collector of a secondary battery. The present invention provides an electrolytic copper foil characterized in that the thickness ratio elongation at room temperature is 1.3 to 2.0 %/...
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WO/2023/074223A1 |
A copper-plated membrane having coarsened crystals can be obtained by a simple operation, by using a method for coarsening copper crystal grains in an object to be plated, said method being characterized by including: a step (a) in which...
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WO/2023/075195A1 |
Disclosed are an electrolytic copper foil with high strength and high elongation characteristics and a manufacturing method therefor. The present invention provides an electrolytic copper foil having a tensile strength of 40kgf/mm2 or hi...
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WO/2023/075197A1 |
An electrolytic copper foil for a secondary battery current collector is disclosed. The present invention relates to an electrolytic copper foil having a thickness elongation at room temperature of 1.3-2.0 %/μm and, in the XRD spectrum ...
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WO/2023/073209A1 |
A method of manufacturing a component carrier (100), wherein the method comprises stamping a surface profile in a design layer (102), forming an electrically conductive seed layer (118) on the stamped design layer (102), forming a patter...
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WO/2023/061759A1 |
The invention relates to an assembly (1) for generating a plurality of nanowires (2), said assembly comprising the following elements which are arranged in the specified sequence: - an electrically conductive surface (3), - a film (4) ha...
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WO/2023/057068A1 |
The present invention is directed to a copper foil having high fracture energy to be strong against breakage, and to an electrode for secondary batteries and a secondary battery exhibiting, by including the copper foil, excellent charact...
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