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WO/2024/081507A1 |
Examples are disclosed that relate to irrigating an ion exchange membrane in an electrodeposition system. In one example, the electrodeposition system comprises a fluid distribution system comprising a membrane assembly that comprises a ...
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WO/2024/076575A1 |
A method can include: processing precursors, electrochemically oxidizing sulfur dioxide, processing sulfuric acid and hydrogen, and/or any suitable steps. An electrolyzer can include an anode, a cathode, and a separator. The anode can in...
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WO/2024/073866A1 |
An electrode, and use and a preparation method thereof. The electrode includes a substrate, an interlayer and a catalytic layer; wherein the interlayer is selected from a metal Ta layer, a Ti-Ta alloy layer or a Ti-Pd alloy layer; and th...
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WO/2024/075533A1 |
Provided are a device for forming a metal coating and a method for forming a metal coating, the device and method making it less likely for tarnishing of a metal coating to occur. This device 1 for forming a metal coating comprises an el...
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WO/2024/073867A1 |
An electrode and use thereof. The electrode includes a substrate, a catalytic layer and a protective layer; wherein the catalytic layer is selected from a mixed metal oxide layer, and the protective layer is selected from an organic iono...
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WO/2024/067514A1 |
The present application relates to the technical field of photovoltaics, and discloses a solar cell electroplating device and a solar cell electroplating method. A first conductive assembly and a second conductive assembly are respective...
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WO/2024/070236A1 |
Provided is a plating apparatus with which, even when the flow amount of a plating solution sprayed from a spray unit is increased, there is no excessive rising of a material subject to plating to a high position within retained plating ...
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WO/2024/070234A1 |
Provided is a plating apparatus that suppresses the occurrence of defects in a plated object without the plated object rising excessively to a high position in a plating solution in which the plated object is contained, even if the flow ...
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WO/2024/068704A1 |
An apparatus for electrolytically coating metal wires arranged in a web also called a 'plating section' is presented. Compared to prior art plating sections, the apparatus is provided with one or more ultrasound emission boxes that hang ...
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WO/2024/070235A1 |
Provided is a plating apparatus with which the time required for plating is improved and unevenness in the thickness of the obtained plating film is minimized. This plating apparatus comprises a plating tank storing a plating liquid, a...
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WO/2024/062396A1 |
A galvanic plating apparatus (100) and a method for galvanically plating a component carrier structure (102) are provided. The galvanic plating apparatus (100) comprises an anode (104) split into a plurality of separate anode parts (106)...
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WO/2024/051152A1 |
A flexible foil production system, relating to the technical field of water plating. The system comprises first liquid accumulation rollers, tension rollers, first electrical conduction rollers and second electrical conduction rollers, w...
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WO/2024/046870A1 |
A device for holding a planar substrate (1) in an apparatus for non-immersive wet-chemical treatment of the substrate (1) comprises a support structure (34). The support structure (34) comprises at least one part (36a,b) for engaging a s...
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WO/2024/042700A1 |
To measure the state of a substrate serving as an object subject to plating. This substrate state measurement device comprises: a stage constituted so as to support a substrate having a seed layer and a resist layer formed on the seed ...
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WO/2024/041968A1 |
The invention relates to a method for controlling the chromium feed in an electrolysis process for producing a chromium layer by means of direct current and use of an anode (44, 144, 244) and a cathode (48, 148, 248), comprising, during ...
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WO/2024/037008A1 |
Disclosed in the present invention are a cathode conductive device and electroplating equipment. The cathode conductive device comprises: a conductive section rack; an upper conductive tank assembly which comprises an upper conductive ta...
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WO/2024/033966A1 |
The present invention achieves a small pre-wet module that is capable of performing different pre-processes. This pre-wet module 200 includes: a stage 220 configured so as to hold a rear surface of a substrate WF having a surface WF-a ...
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WO/2024/033999A1 |
A plating device comprising: a plating tank configured so as to accommodate a plating solution; a substrate holder configured so as to hold a substrate to be plated; a rotating mechanism which rotates the substrate holder; a raising/lowe...
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WO/2024/034047A1 |
The present disclosure provides a substrate holder having a centering pin that does not push the substrate any farther toward the center than the design position even if a first holding member deviates from the design position with respe...
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WO/2024/033365A1 |
A device for rotatably supporting a section of a shaft (4) of a roller (2) of a conveying system in a bath of an apparatus for wet-chemical treatment of workpieces comprises at least one body (14). A space for receiving the shaft section...
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WO/2024/033366A1 |
A system for conveying planar workpieces (4;32) through a bath of an apparatus for wet-chemical treatment of the workpieces (4;32) comprises a plurality of workpiece holding devices (1;29). Each workpiece holding device (1;29) comprises ...
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WO/2024/030745A1 |
Examples are disclosed that relate to operating an electrodeposition system comprising an inert anode. In one example system, the electrodeposition system includes a substrate holder and a cathode chamber configured to hold a catholyte. ...
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WO/2024/028973A1 |
A plating method for performing a plating process on a substrate by means of a plating apparatus provided with a substrate holder including a contact member that comes into contact with the substrate so as to enable electrical conduction...
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WO/2024/022201A1 |
The present disclosure provides an electroplating apparatus, a multi-channel electroplating apparatus group, and an electroplating reaction system. The electroplating apparatus comprises: a cathode control member, a cathode chamber frame...
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WO/2024/022535A1 |
An electroplated part, which contains hardly any organic residues and has a uniform electroplated layer. An electroplating method for manufacturing the electroplated part is also provided. By means of controlling the ratio of the length ...
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WO/2024/007076A1 |
There is described a solid reservoir reference electrode having a first layer of a metal; a second layer of a salt of the metal and a non-metallic species atop the first layer; a third layer of an electrolyte salt atop the second layer, ...
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WO/2024/007630A1 |
A water electroplating apparatus with a double-sided coating function. The water electroplating apparatus comprises a plating tank and a film conveying mechanism, wherein a first main roller and a second main roller are arranged in the p...
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WO/2023/248416A1 |
With the present invention, a pre-treatment of a substrate is efficiently performed, and also adhesion of air bubbles to a surface to be treated of the substrate is suppressed. This pre-wetting module 200 includes a deaeration tank 210...
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WO/2023/243079A1 |
Provided is a plating device with which it is possible to clean a contact cleaning member. The plating device includes: a plating tank configured to contain a plating solution; a substrate holder configured to hold a substrate in which...
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WO/2023/243078A1 |
Provided is a technique for determining the presence or absence of a plating liquid leak to a region where a contact member is disposed. The leakage determination method comprises: a discharge step 120 for discharging a washing liquid ...
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WO/2023/238572A1 |
The present invention relates to a plating apparatus and a plating method, by each of which at least one main surface of a rectangular substrate is plated. A plating apparatus according to the present invention is provided with: a proces...
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WO/2023/232420A1 |
The present invention relates to a module kit for a chemical and/or electrolytic surface treatment of a substrate, a platform assembly comprising such a module kit, a method for a chemical and/or electrolytic surface treatment of substra...
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WO/2023/234564A1 |
The present invention relates to a selective electrochemical additive manufacturing (S-ECAM) printing device which can selectively deposit metal raw materials on a substrate using electrochemical additive manufacturing (ECAM). In additio...
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WO/2023/234565A1 |
The present invention relates to a selective electrochemical additive manufacturing (S-ECAM) printing device which can selectively build up layers of metal materials on a substrate by using electrochemical additive manufacturing (ECAM). ...
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WO/2023/233571A1 |
To provide a technology with which it is possible to suppress uneven film thickness of the outer edge of a substrate. This plating device 1 comprises a plating tank, an anode, a substrate holder, at least one auxiliary anode 60a-60d, a...
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WO/2023/228398A1 |
The present invention provides: a resistor which makes it possible to improve the uniformity of a plating film that is formed on a substrate; and the like. The present invention provides a resistor for plating apparatuses for electric ...
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WO/2023/229670A1 |
A system may include a first semiconductor processing station configured to deposit a material on a first semiconductor wafer and a chemical tank that provides liquid to the processing station during a deposition process. The chemical ta...
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WO/2023/225279A1 |
Systems and methods for beneficially affecting the surface morphology of electrically conductive materials using electrochemistry are described. The systems and methods for beneficially affecting the surface morphology of electrically co...
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WO/2023/214449A1 |
Provided is a technology with which the effects of air bubbles and the like can be minimized in the plating of minute vias and trenches, and with which a plurality of plating treatments can be handled with a single plating device. This p...
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WO/2023/207349A1 |
The present invention belongs to the technical field of photovoltaic device manufacturing. Disclosed are a manufacturing method and apparatus for an electronic component. The method comprises: placing a semiconductor device in a cathode ...
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WO/2023/203409A1 |
The present invention relates to a piece of equipment (10) for the galvanic surface treatment of an object (O). The equipment (10) comprises: a galvanic treatment tank (20) suited to receive an electrolytic substance (S) for the galvanic...
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WO/2023/203231A1 |
A method of facilitating electrolytically depositing chromium onto a metal substrate from an electrolyte including an ionic form of chromium and one or more organic additives in an electrodeposition vessel by applying a current through t...
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WO/2023/203720A1 |
The present invention provides a technology that makes it possible to prevent the deterioration in plating quality of a substrate due to the formation of air bubbles coming from an anode. A plating module 400 includes: a plating tank 1...
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WO/2023/203824A1 |
The present invention proposes a method with which it is possible to manufacture a steel sheet having a beautiful plating layer without a quality defect such as a plating defect or a pickup caused, in particular, by a distortion in the s...
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WO/2023/196285A1 |
Electroplating methods may include providing an initial anolyte to a first compartment of an electrochemical cell. The methods may include providing an initial catholyte to a second compartment of the electrochemical cell. The initial ca...
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WO/2023/196254A1 |
Disclosed herein is an aluminum-ether-based composition that can serve a dual role as either an electrolyte for use in batteries and/or as an electroplating bath for ambient temperature aluminum deposition. The aluminum-ether-based compo...
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WO/2023/196284A1 |
Electroplating methods may include providing an electrolyte feedstock comprising copper to a first compartment of an electrochemical cell. The methods may include providing an acidic solution to a second compartment of the electrochemica...
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WO/2023/188371A1 |
According to the present invention, a plating device comprises a plating tank for holding a plating liquid, an anode that is arranged inside the plating tank and has a plurality of through holes, a substrate holder that holds a substrate...
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WO/2023/182375A1 |
A surface treatment jig according to the present invention is connected to an exterior body of an accumulator including a bottom, a shell, and a port, to carry out surface treatment in a state of supporting the exterior body and comprise...
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WO/2023/181133A1 |
Provided is a method for manufacturing an electrode which has a specific surface area of at least 1×104 cm-1 and has a surface in which voids occupy 5-20% by area percentage as observed by SEM, wherein a raw material powder having an av...
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