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WO/2004/113813A1 |
The inventive device (1) for compressing a ceramic dental mixture for producing dental prosthesis such as crowns, bridges and inlays comprises a top part (2), a lower part (4) movable with respect to the top part (2) and a piston (7) whi...
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WO/2004/114377A1 |
A heating means is disclosed which comprises a reflector plate composed of an opaque quartz and a quartz tube welded to the surface of the reflector plate. A carbon wire which generates heat when a current is applied is inserted in the q...
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WO/2004/094568A2 |
A Pulverized Coal Pressurized Gasifier (PCPG) including a gasifier chamber, a fuel (18) chamber and at least one flame retention burner (100). The flame retention burner (100) prolongs high temperature exposure of coal (18) to the hot fl...
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WO/2004/085943A1 |
The aim of the invention is to provide a reliable and efficient operation of a dental furnace (1) for producing compacted ceramics, comprising a hood-shaped firing chamber (3), into which a muffle (5) can be inserted and which is closed ...
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WO/2004/077912A2 |
A one-piece or otherwise unitary annular shim member made from a carbon material is used to maintain a space between stacked annular preforms during a manufacturing process, such as densification. The one-piece structure advantageously s...
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WO/2004/077505A2 |
An etching system for etching a wafer of a material has a measuring device, an etching chamber, and a controller. The measuring device measures the critical dimension test feature (CD) along the profile of the wafer at a plurality of pre...
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WO/2004/073051A1 |
A heater assembly for an ALD or CVD reactor provides protection for an electrical conductor associated with a heating element by using a purge gas to isolate the conductor from the corrosive environment of the reactor chamber. The purge ...
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WO/2004/070747A1 |
A heat treatment system in which the direction of a magnetic field being generated by a field generating means (20) in a region for heat treating an object is in parallel with the direction of the object being carried into a heat treatme...
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WO2004008493A9 |
A method and system for supporting semiconductor wafers during processing. A T-shaped support, when viewed in top-down cross-section, has a relatively large, semicircular portion at one end, tapering to a series of relatively thin ledges...
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WO/2004/059230A1 |
The invention relates to the thermochemical hardening of products, mainly having residual surface stress, for example metal products consisting of hot-rolled parts, metal wireworks including metal-woven, filtering fabrics, fastener threa...
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WO/2004/044969A1 |
Two bypasses (32, 33) are formed in the valve box (21) of a main valve (18) provided in the piping (13) of the exhaust system (12) of a heat treatment furnace (1). Each bypath (32, 33) is opened&sol closed by an auxiliary valve (30, 31) ...
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WO/2004/035846A1 |
A low pollution process for extracting arsenic in vacuum, including: heat and keep the smelting chamber to a temperature of 100-300 °C under the reduced pressure lower than 50 Pa to remove the water vapor and some dust; then heat and ke...
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WO/2004/033731A1 |
The invention concerns a heat treatment method for metal parts (6) arranged in feed (5) wherein the feed of parts is successively brought into a vertical treatment furnace (1) capable of being opened downwards, said method consisting in:...
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WO/2004/027845A1 |
A heat−treating apparatus comprising a reaction chamber accommodating an object to be treated, a heat−insulating body surrounding the reaction chamber, holes defined in the heat−insulating body, annular spacer members provided in t...
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WO/2004/015348A1 |
A reactor chamber (130) is positioned between a top array of LED heat lamps (146) and a bottom array of LED heat lamps (148). The LED heat lamps (180) forming the top and bottom arrays (146, 148) are individually or controllable in group...
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WO/2004/007105A1 |
Various backfill injectors that provide upflowing gas and have improved uniformity of distribution of gas into the perimeter of the process chamber are provided for use in semiconductor wafer processing apparatus. Suitably optimized back...
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WO/2004/008008A2 |
A gaseous flow control method and system. The flow control system monitors and controls gaseous levels and gas flow into and out of an enclosed space by using a proportional/integral/derivative (PID) controller to manipulate gas flow int...
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WO/2004/007318A2 |
A loadport apparatus for conditioning the interior of a FOUP having a FOUP door. The apparatus includes platform, a housing, an loadport door, a loadport door seal and a conditioning system. The FOUP platform receives the FOUP. The housi...
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WO/2004/007819A2 |
The invention concerns a method which consists in heating carbon products in an oven (10) under reduced pressure and under neutral gas sweeping, while continuously extracting from the oven gas effluent containing elementary or combined s...
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WO/2004/008491A2 |
An apparatus (100) and method are provided for thermally processing substrates (108) held in a carrier (106). The apparatus (100) includes a vessel (101) having a top (134), side (136) and bottom (138), and a heat source (110) with heati...
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WO/2004/008052A2 |
A cooling system and method are provided for cooling an apparatus (100) having a vessel (102) containing a substrate (108) to be processed, and heating elements (10012) distributed coaxially around and spaced apart from the vessel to for...
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WO/2004/008494A2 |
A method and system for controlling a servomotor network. The system has at least one local control node remotely located from a central processing area. The local control node actuates one or more servomotors, and is physically placed n...
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WO/2004/005203A1 |
A method of forming a single crystalline structure having a substantially linear response at least over the wave lengths of 1,200 to 1,700 nanometers, the resulting structure and its use as an optical media or a barrier coating. Thus, ma...
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WO/2004/001311A1 |
A heating muffle for a muffle kiln for the production of a dental ceramic product containing titanium, which comprises a hollow unit, which is provided with at least one opening for the uptake of the ceramic product and has completely he...
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WO/2003/091462A1 |
A vertical muffle type heat treating furnace, comprising a vertically disposed muffle allowing metal strips to be led therein from an upper side to a lower side, a heating zone for heating, from the outside of the muffle, the metal strip...
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WO/2003/073485A1 |
A heat treating device (50) has a cooling sleeve that covers a treating vessel (56) and a heater (100). The cooling sleeve has a cylindrical base member (110) and a cooling pipe (112) spirally wound on the outer peripheral surface hereof...
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WO/2003/035307A1 |
The invention relates to a method for controlling the binder-release process for MIM- (Metal Injection Moulding), or CIM- (Ceramic Injection Moulding) pieces, in which a polymeric plastic, for example, is used as binder, which, by intera...
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WO2002058437B1 |
A method of heating an article (29) with microwave energy is described in which a thin layer (34) of a highly microwave absorbed material is provided around at least a portion of a container (31) made of microwave transparent material. T...
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WO/2003/012849A1 |
The exhaust pressure in an exhaust system (15) for exhausting a treatment furnace (2) is measured as an absolute pressure by a differential pressure gage (23) for measuring the pressure as the differential pressure between the exhaust pr...
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WO/2002/101850A2 |
An electrically insulating collar (170) for an electric furnace (1) is described. This collar has a mounting flange (176) and passageway (182). An electrically conductive lead (90) is at least partially in the passageway and, a means for...
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WO/2002/101806A1 |
The invention relates to a method and a device for the thermal treatment, especially short-term, of flat objects in particular, such as semi-conductor, glass or metal substrates. Heat is, at least in part, supplied to or taken away from ...
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WO/2002/066687A1 |
A gas-cooled single chamber heat treating furnace (T), wherein vent holes (9A, 9B) for cooling gas opened and closed by doors (11A, 11B) are provided in each of the opposed walls of an inner chamber (5) forming a treating chamber and, in...
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WO/2002/061818A1 |
A sheet type heat treating device (2) comprising a processing chamber (5) for receiving a board (W) to be processed, with a shower head (10) disposed on the ceiling thereof. In applying a semiconductor processing to the board (W), a supp...
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WO/2002/049395A2 |
A method and system for inductively coupling energy to a heating filament (7A', 7B', 7C', 7A, 7B, 7C) in a thermal processing environment. By applying AC power to a coil antenna (11) and inductive coupling to a filament (e.g., a halogen ...
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WO/2002/032831A1 |
A burning furnace and a method of producing burnt bodies, wherein a burning-subject formed of ceramic material, fine ceramic material or the like is burnt to produce a burnt body. A heat insulation wall (28) and an inner shell (25) defin...
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WO/2002/000407A1 |
The invention relates to a device for heating a meltable material, such as plastic, before it enters a processing installation, such as a casting or extrusion installation. The inventive device comprises a conveying channel (1) for the m...
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WO/2001/092171A1 |
An oven for heat treatment of glass articles, or the like, in particular CRT tubes, comprises an enclosure (38), a fan (48) for driving a flow of air through the enclosure and a radiant heater (64) located within the enclosure. The inven...
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WO/2001/051867A2 |
A thermal processing plant has heating tubes (4) which are arranged in an undulating line (10) in an oven chamber (3). Burners (6) which generate a stream of gas that is directed against the opposite wall of the oven are positioned on ea...
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WO/2001/049075A1 |
Infrared oven for heating a plurality of preforms and comprising: a conduit through which said preforms move, a flow of outside air that flows through said conduit from an intake mouth to an exhaust mouth under the action of a blower, a ...
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WO/2001/035453A1 |
A film forming device, comprising a treating furnace, gas feeding means feeding treating gas into the processing furnace, heating means heating the inside of the treating furnace to a specified treating temperature, and a normal pressure...
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WO/2001/029902A2 |
The invention relates to a device for simultaneously tempering and processing several process goods by means of electromagnetic radiation. The device is a batch-type furnace. The process goods and the energy sources are arranged adjacent...
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WO/2001/016255A1 |
A heater includes a radiant section having a wall and a roof, the roof having a longitudinal opening. A radiant heat exchange tube is disposed in the radiant section, and the tube has an inlet and outlet through which a process fluid can...
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WO/2001/013054A1 |
An apparatus (10) for heat treatment of a wafer (28) is disclosed. The apparatus includes a heating chamber (18) having a heat source (20). A cooling chamber (32) is positioned adjacent to the heating chamber and includes a cooling sourc...
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WO/2000/029799A1 |
A dual resistive heater system includes a base or primary heater (120A), surrounded by a peripheral or edge heater (120B). Both resistive heaters deliver heat to a heated block, and the heaters and heated block are substantially enclosed...
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WO/1999/058260A1 |
An apparatus and a method for treating an object material containing a heavy metal and a noxious organic halide, and a method of treating soil. The treating apparatus is provided with an air-tight door (115b) and a retort (115c) as inter...
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WO/1999/054655A2 |
Disclosed is a thermal insulation to be inserted between two structures, surfaces, walls or the walls of components which are to be insulated. The thermal insulation consists of an plurality of hollow spheres made up by loose hollow sphe...
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WO/1999/004067A1 |
A rapid thermal processing (RTP) chamber comprising a transparent plate and a body, the plate sealed with a gas tight seal against the body, the gas tight seal activated by inflating an inflatable element.
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WO/1998/041806A1 |
Method for cooling a furnace, and furnace designed to be able to be cooled particularly quickly and efficiently. According to the invention, it is proposed to periodically reverse the direction of flow of a cooling gas which is moved alo...
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WO/1998/039609A1 |
A vertically oriented thermal processor (10) for processing batches of semiconductor wafers held within a processing chamber (16). The processing chamber (16) is contained within a processing vessel (18). A furnace liner (82) surrounds t...
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WO/1998/037258A1 |
A novel rapid thermal process (RTP) barrel reactor (100) processes a larger batch of semiconductor substrates (170) than was previously possible. The RTP barrel reactor is characterized by a short process cycle time in comparison to the ...
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