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WO/2021/044142A1 |
There is provided a thermal management apparatus for use with a vehicle comprising: a chassis in thermal contact with one or more first components that require thermal management and one or more second components that require thermal man...
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WO/2021/045211A1 |
This vapor chamber is provided with: a layer which comprises a plurality of first flow paths and a second flow path provided between first flow paths adjacent to each other, and which has grooves forming the first flow paths and the seco...
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WO/2021/043309A1 |
The present application provides a vapor chamber and a terminal device. The vapor chamber of the present application comprises a first cover plate and a second cover plate; the first cover plate and the second cover plate together enclos...
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WO/2021/042945A1 |
A chain-shaped copper capillary structure and a manufacturing method therefor. The chain-shaped copper capillary structure is formed in a groove structure of a first metal sheet and used for sealing and processing the first metal sheet w...
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WO/2021/041853A1 |
A heat transfer device includes three plates sandwiched together to form a vapor chamber or similar device. The three plates may be sealingly joined at a closed periphery to define a closed volume that contains a working fluid. One or mo...
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WO/2021/036701A1 |
Provided are a heat transfer apparatus and a terminal device. The present application relates to the field of heat dissipation. The heat transfer apparatus comprises: a housing, and a capillary structure arranged inside the housing, wher...
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WO/2021/031699A1 |
Provided in the present invention are a liquid metal high-temperature pulsating heat pipe and a testing method, comprising a high-temperature pulsating heat pipe, a high-temperature heating furnace, a cooling liquid block, a high-pressur...
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WO/2021/032229A1 |
According to the invention, a housing (1) for a computer has a modular design, thermocouples (10, 15) for a heat-conducting insertion of thermal connectors (9) of heat pipes (8) being provided on the inner faces of walls (4) in order to ...
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WO/2021/026620A1 |
The invention relates to an expansion device for refrigeration apparatuses, comprising a suction tube (1) and a capillary tube (2) in a single extruded aluminum profile, in which the two parallel tubes, referred to as the suction tube (1...
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WO/2021/029204A1 |
A structure (1) comprises a heat insulating layer (20), an evaporator (30) provided on one side of the heat insulating layer (20), a condenser (40) provided on the other side of the heat insulating layer (20), a steam flow path (50) for ...
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WO/2021/025128A1 |
This temperature regulator is provided with a first heat exchanger (3), a second heat exchanger (4), a heat medium path (6), and a heat exchange amount controller (5, 7, 41, 45, 45a, 51, 72, 81, 82a). The first heat exchanger (3) perform...
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WO/2021/022312A1 |
The invention relates to an air heat exchanger (1) for cooling a power electronics component (2) comprising: - a carrier plate (3) having an accommodating region (4) for accommodating the power electronics component (2); - a heat exchang...
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WO/2021/019786A1 |
Provided is a cooling device that, when the cooling device liquid-cools a cooling target, comprises a cooling medium holding section that supports the cooling target and holds the flowpath for the cooling medium and a device that drives ...
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WO/2021/018071A1 |
A conductive flexible link and manufacturing method thereof are provided. The conductive flexible link comprises substrates (1). The substrates (1) are constructed into a panel (4) and straps (2) which are embedded into the panel (4). Th...
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WO/2021/017731A1 |
A composite-type vapor chamber and manufacturing method therefor. The composite-type vapor chamber comprises first and second cover plates and a cavity (3); support structures and a sintered powder wick structure (4) are provided inside ...
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WO/2021/017630A1 |
The present invention relates to a metro composite energy multifunctional tail end heat pump system using a capillary pipe heat exchanger, comprising energy ends, a user tail end and a heat storage water tank, the first energy end compri...
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WO/2021/012984A1 |
A gravity assisted heat pipe radiator and an electronic device, which relates to the technical field of heat radiation. The gravity heat pipe radiator comprises a box body, the box body being internally provided with a cavity, and the ca...
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WO/2021/009629A1 |
The invention relates to a device (1) for receiving, storing and releasing heat. The device comprises a heat carrier fluid volume region (FV), which can be flowed through by at least one heat carrier fluid (F), and a phase change materia...
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WO/2020/232372A9 |
Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagneti...
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WO/2020/255883A1 |
A cooling device (10) is provided with an evaporation unit (14), a condensation unit (16), a piping unit (15), and a flow path forming member (17). The flow path forming member includes a partitioning portion (170) disposed in the piping...
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WO/2020/255513A1 |
A vapor chamber (1) comprising: a case (10) comprising a first sheet (11) and a second sheet (12) having an outer edge thereof bonded by heat; a hydraulic fluid (20) inside the case; a wick (30); and support columns (40). The support col...
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WO/2020/254189A1 |
The system (104) for cooling electric modules (102) comprises: - evaporation chambers each having a heat exchange wall intended to be pressed against a respective one of the electric modules (102) so as to transfer the heat given off by ...
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WO/2020/255836A1 |
There is provided a copper composite plate material in which: one surface of a first copper layer is pressure-welded to a second copper layer; the first copper layer is configured from a precipitation-strengthened copper alloy; and the s...
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WO/2020/252573A1 |
A dynamic temperature regulating device is for use in association with a temperature-controlled container. The dynamic temperature regulating device includes at least one heat source, at least one heat sink, a heat transfer medium and a ...
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WO/2020/252555A1 |
An efficient heat transfer device that can he suitable for mass production is proposed. The heat transfer device comprises: - an evaporation region. - a condensation region. - a vapor channel extending from the evaporation region to the ...
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WO/2020/247995A1 |
The invention relates to a cooling device (2) comprising a casing (6) made of at least one single-layer or multi-layer film (9, 10) forming an interior (7) which contains a working medium and at least one evaporation element (8) for tran...
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WO/2020/246734A1 |
The present invention relates to an outer-wick heat pipe, and more specifically, to an outer-wick heat pipe enabling the enhancement of a heat transfer effect by having a plurality of grooves formed on the outer side of the heat pipe. Th...
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WO/2020/247456A1 |
A packaging system for transporting a payload while maintaining the payload within an acceptable temperature range. The payload is cooled by two sets of U-shaped heat pipes within the payload compartment. A set of cold heat pipes is cool...
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WO/2020/246240A1 |
Provided is a structure that is easy to produce and improves the reliability of a self-oscillating heat pipe that is for use in a moving body such as a railway vehicle. A mobile body cooling device 5 that: is to be connected to a semic...
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WO/2020/246248A1 |
The ebullient cooling device is provided with an evaporator (10), a condenser (20), a heat medium passage (30), a flow rate adjusting unit (6, 52), and a control unit (5). The evaporator cools an on-board instrument (2) by boiling and ev...
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WO/2020/132131A9 |
This disclosure describes a reaction vessel assembly that includes the following: a reaction vessel including a housing component; a reaction chamber defined by the housing component; and a light absorbing layer conforming to a portion o...
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WO/2020/241496A1 |
This equipment temperature adjustment device (1) is configured as a thermosiphon that adjusts the temperature of target equipment. A condensation unit (3) condenses a working fluid through heat exchange between the working fluid and an e...
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WO/2020/242687A1 |
A heat sink may include a base having a first surface in a first plane configured to contact a system on chip, SoC, located on a circuit board. The heat sink may include a plurality of heat transfer members connected to and extending fro...
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WO/2020/241497A1 |
This heat-transfer device for mediating transfer of heat between walls (BW1, BW2) and a pipe (12) extending along the walls is provided with: a plate-shaped wall-facing section (211) which is disposed at a position closer to the walls th...
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WO/2020/238865A1 |
Provided are a heat-conducting member and an electronic device. The heat-conducting member comprises: a housing having inner layers (111, 121) and outer layers (112, 122), the inner layers (111, 121) enclosing a cavity (13), and the oute...
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WO/2020/243169A1 |
A wearable electronic device is disclosed. The device can include a support structure and an electronic component disposed in or on the support structure. A heat exchanger element can be thermally coupled with the electronic component, t...
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WO/2020/241495A1 |
A heat exchanger for cooling a fluid by heat exchange with a refrigerant in a refrigeration cycle is provided with: a refrigerant-side heat exchange unit (27) constituted by part of refrigerant piping (26, 29) through which the refrigera...
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WO/2020/235217A1 |
[Problem] To provide a cooling device that can efficiently cool a heating element with high heat generation density, and that enables a low cost, lightweight, compact design, and in particular, to provide a heat radiating structure for a...
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WO/2020/235475A1 |
A device temperature adjustment apparatus (1) has a plurality of evaporators (20), a condenser (30), a gas phase flow path (40), and a liquid phase flow path (50). The plurality of evaporators are arranged side by side in a predetermined...
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WO/2020/228073A1 |
The present application discloses a capillary structure, comprising at least one metal wire layer and at least one metal powder film. The metal wire layer is formed by interweaving or arraying a plurality of metal wires, pores in communi...
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WO/2020/229081A1 |
The invention relates to a method for joining a power semiconductor component (1.1) to a heat pipe (2), wherein, during joining, the external pressure (p2) acting on the heat pipe (2) is changed proportionally to the internal pressure (p...
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WO/2020/230499A1 |
The present invention provides a heat sink capable of having improved heat radiation efficiency from heat radiation fins and making the heat input at a heat receiving part uniform while ensuring that the heat receiving part, a heat insul...
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WO/2020/229728A1 |
A novel heat transfer system (100) is herein proposed involving a coupler which, when attached to a heat sink (110), defines at least a part of a vapor chamber (130) inside the heat transfer system (100). The coupler (120) attaches compo...
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WO/2020/225981A1 |
In order to provide a self-excited vibration heat pipe cooling device in which self-excited vibration is generated even when the initial distribution of liquid slag and vapor plug in the heat pipe is uniform, whereby an excellent startab...
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WO/2020/222487A1 |
A cold water production apparatus and method are provided. A cold water production apparatus according to one embodiment of the present invention can comprise: an apparatus body; a water tank which is provided in the apparatus body and w...
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WO/2020/223017A1 |
A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The ...
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WO/2020/218008A1 |
A cooling system (1) is provided with a looped thermosiphon (10) including a cooler (11) and a condenser (12), wherein a refrigerant naturally circulates between the cooler (11) and the condenser (12). The cooling system (1) is provided ...
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WO/2020/217919A1 |
A device temperature adjustment apparatus (1) is configured as a thermosiphon for carrying out a heat transfer by means of a phase change between a liquid phase and a gas phase of a working fluid sealed in a tubular sealed container (10)...
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WO/2020/218007A1 |
A cooling device comprises: an evaporation unit that evaporates a heat medium by exchanging heat between a cooling object and the heat medium, thereby cooling the cooling object; a condensation unit arranged above the evaporation unit, t...
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WO/2020/217285A1 |
This electronic device increases pressure resistance to a refrigerant in piping, improves electronic device assembly properties and enables greater electronic device compactness. This electronic device is provided with multiple substrate...
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