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Patent Searching and Data


Matches 501 - 550 out of 13,790

Document Document Title
WO/2020/214493A1
A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit ...  
WO/2020/213463A1
The present invention provides a heat sink such that the heat radiation performance for the heat radiation fins thereof can be improved, while preventing drying out at the heat receiving part, even in environments with a limited heat sin...  
WO/2020/213581A1
The present invention provides a heatsink which can increase the fin area of a heat radiation fin while sufficiently obtaining the volumes of a heat receiving part, a heat insulating part, and a heat radiating part even in an environment...  
WO/2020/209138A1
The present invention provides a cooling device which makes it possible, even when reduced in size, to prevent attachment of droplets of primary refrigerant sealed in a container onto a condensation pipe in the container, and to prevent ...  
WO/2020/206371A1
In one aspect, thermal management devices are described herein. In some embodiments, the thermal management device is a thermal management plate comprising an exterior surface defining an interior volume, and a thermal management materia...  
WO/2020/203152A1
A thermosiphon-type cooling device for a vehicle, wherein cooling capability is secured to the extent possible even when the amount of inclination changes. The present invention comprises: an evaporation unit (13) that absorbs heat from ...  
WO/2020/197739A1
A manifold structure is formed using ultrasonic additive manufacturing and machining. The manifold structure includes a body having a base plate and a cover plate that define a flow passage therebetween, and a plurality of walls that seg...  
WO/2020/195301A1
[Problem] To efficiently cool down heat of a heating element 20. [Solution] This electronic device 100 is provided with a circuit board 10, a case 30, and a connection part 40. The circuit board 10 has a heating element 20 that is attach...  
WO/2020/188651A1
This cooling device (100) is designed to perform cooling by utilizing evaporative latent heat without using a compressor and comprises: a liquid feeding section (10) that feeds a refrigerant; an evaporator (20) that evaporates the fed re...  
WO/2020/186575A1
Disclosed is a temperature and humidity adjustment heat exchange coil with metal fiber layers attached to the surfaces of fins, wherein same relates to the technical field of heat exchange coils, and specifically comprises a temperature ...  
WO/2020/189713A1
This vapor chamber is provided with: a top plate; a bottom plate that constitutes a container together with the top plate; a bonding sheet sandwiched between the top plate and the bottom plate; and a working fluid and a wick body which a...  
WO/2020/188896A1
This vapor chamber comprises an enclosure configured from opposing first and second sheets having joined outer edges, an operating fluid enclosed in the enclosure, and a wick provided to an inner wall surface of the first sheet or the se...  
WO/2020/184620A1
Provided is a vapor chamber comprising a sealed space in which an operating fluid is sealed, the sealed space having a first flow path and a liquid flow path portion adjacent to the first flow path.  
WO/2020/183063A1
The specification relates to a system (100, 300, 400) for storing and transferring heat. The system (100, 300, 400) comprises at least one resistor (101, 301, 401) for producing heat energy from electrical energy, at least one heat stora...  
WO/2020/181605A1
The present invention relates to a microchannel heat exchanger structure having a nozzle and a working method, comprising a first heat-exchanging part, a second heat-exchanging part, and at least one nozzle part arranged between the firs...  
WO/2020/176746A1
The present disclosure provides materials and methods related to passive cooling systems. In particular, the present disclosure provides a condensorator heat exchanger with a single microchannel coil that integrates the evaporator and co...  
WO/2020/174593A1
A coolant flow path (2) of this cooling device (100) includes an inlet opening (22) for inflow of the refrigerant (5), distribution paths (23) branching from the inlet opening and connecting to each heat exchange unit (21), and an outlet...  
WO/2020/176781A1
An enhanced gravity-driven, thin film condensation heat transfer condenser is disclosed for use in a thermosyphon performing in two perpendicular orientations, as well as orientations in between. The thermosyphon includes an evaporator f...  
WO/2020/170430A1
A cooling device (100) is provided with a first pressure drop unit (4a) in which a restriction amount is fixed and a second pressure drop unit (4b) in which a restriction amount is fixed. The first pressure drop unit (4a) is configured t...  
WO/2020/170428A1
This cooling device (1) is provided with a heat receiving block (11), a heat transfer member (12), and a plurality of first heat pipes (13). A heat generating body (31) is fixed to the first principal surface (11a) of the heat receiving ...  
WO/2020/155901A1
Disclosed is a boiling enhancement apparatus, comprising an evaporation chamber having a cavity therein and boiling enhancement fins. The boiling enhancement fins are provided on an inner wall surface of the evaporation chamber. A phase ...  
WO/2020/158324A1
In order to solve the problem wherein cooling performance of a heat sink for self-oscillating heat pipe is best in the proximity of the center of the heat pipe in the longitudinal direction, and deteriorates towards the ends, this heat s...  
WO/2020/155899A1
Disclosed is a phase change heat radiating device, comprising a phase change assembly internally provided with a phase change heat exchange medium, wherein the phase change assembly comprises an evaporation part and a condensation part; ...  
WO/2020/155900A1
Disclosed is a phase change heat radiating device, comprising a phase change assembly internally provided with a phase change heat exchange medium, wherein when the phase change heat exchange medium provided in the phase change assembly ...  
WO/2020/152822A1
This cooling device (1) is provided with: a heat-receiving block (11) to which a heating element (31) is attached; a first heat pipe (12) fixed to the heat-receiving block (11); and a second heat pipe (13) adjacent to the first heat pipe...  
WO/2020/149223A1
The present invention provides a vapor chamber which efficiently carries out heat radiation of a heat-emitting electronic component mounted on a thin high-density electronic circuit board, and method for manufacturing said vapor chamber....  
WO/2020/150544A1
The present invention is related to a thin heat dissipation device and a method for manufacturing the same. The device of the present invention mainly comprises a hollow body having an enclosed chamber and a working fluid with which the ...  
WO/2020/148728A1
A heat sink with internal chamber for phase change material (10) formed from a body of solid phase change material (14) received within a thermally conductive housing (12) so at least one contact face of the body of solid phase change ma...  
WO/2020/061267A9
The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a ...  
WO/2020/145066A1
The purpose of the present invention is to provide: a heat pipe structure in which the heat transfer properties from a base block to a heat pipe are excellent and the fixation stability of the heat pipe to the base block is excellent, ev...  
WO/2020/143121A1
Disclosed are a chip heat exchanger and an inverter air conditioner. The chip heat exchanger comprises a heat pipe (5), an inflation plate condenser (4) and a capillary tube (3), wherein an evaporation section (51) of the heat pipe (5) i...  
WO/2020/140406A1
A geothermal energy mining system using a stepped gravity-assisted heat pipe having no accumulated liquid effect, comprising a gravity-assisted heat pipe (1), a condenser (2), and a liquid storage tank (3); the gravity-assisted heat pipe...  
WO/2020/142749A1
An electronic device includes an integrated circuit and a heat exchanger. The heat exchanger includes a heat pipe and a first plurality of cooling fins and a second plurality of cooling fins. The heat pipe is thermally coupled to the int...  
WO/2020/138081A1
An evaporator that converts at least a part of a liquid-phase working fluid into a gas by using heat of a heating element comprises: a housing that has at least one working fluid inlet and at least one working fluid outlet and is provide...  
WO/2020/138082A1
The present invention provides an evaporator mounted on a transporter, equipped with: a plurality of heat exchange units, which are lined up in the horizontal direction when the transporter is placed on a horizontal surface, the attitude...  
WO/2020/137473A1
The present invention provides a temperature adjustment unit capable of efficiently adjusting the temperature of a specific object with less risk of failure of electronic components due to leakage of a temperature-adjusting medium. This ...  
WO/2020/138077A1
A purpose of the present invention is to achieve both the attainment of a stable quantity of heat conveyance even if the position of a loop-type heat pipe changes, and the suppression of external energy consumption, in a heat conveyance ...  
WO/2020/138080A1
This evaporator is provided with a housing having a plurality of surfaces including a front surface and a rear surface of which at least one has the maximum area, and a heat-receiving body which is provided on at least one of the front s...  
WO/2020/138078A1
This loop-type heat pipe mounted on a transporter in which the allowable tilt angle is α° is provided with an evaporator for changing at least some of a liquid-phase working fluid into a gas by receiving heat from a heat source, a cond...  
WO/2020/138079A1
A loop-type heat pipe which is mounted in a transport device that undergoes a tilting operation, and which is equipped with: an evaporator for converting at least a portion of a liquid-phase working fluid to gas; a first condenser and a ...  
WO/2020/137569A1
The objective of the present invention is to provide a heatsink that can exhibit an excellent cooling property even for a heat producing element arranged in a narrowed space and having a high heat value. A heatsink comprising: a pluralit...  
WO/2020/137822A1
This cooling device has a heat receiving unit that has a space therein, liquid phase piping that supplies liquid phase refrigerant to the heat receiving unit, gas phase piping that discharges gas phase refrigerant from the heat receiving...  
WO/2020/138584A1
According to one embodiment of the present invention, a thermoelectric module is used so as to generate cool air, and the cool air is blown at a user through an efficient cool air transfer structure, and thus energy efficiency is increas...  
WO/2020/130837A1
The invention pertains to a method of cooling a microchip, using vaporization of a cooling liquid in a vaporization chamber of a cooling element wherein the vaporization chamber comprises channels and a plurality of flow- modifying struc...  
WO/2020/131410A1
A method of manufacturing a thermal management device includes radiantly heating an unsealed chamber of the thermal management device that is filled with a working fluid.  
WO/2020/129645A1
The objective of the present disclosure is to provide an equipment temperature regulating device that can cope with being inclined with respect to an evaporator arrangement direction, while limiting an increasing in installation space. A...  
WO/2020/123631A1
To provide a vapor chamber having excellent function of circulating a working liquid from an end portion to a center portion of a wick and enabling the prevention of the occurrence of dry-out. A vapor chamber includes a casing formed of ...  
WO/2020/122688A1
The present invention relates to a battery and a fuel cell stack heat exchanger, and in the present invention, an inlet pipe or an outlet pipe respectively having an insertion part and an extension part is applied while being fixed, thro...  
WO/2020/123393A1
A multi-fluid heat exchanger includes at least three fluid inlets and at least three fluid channels. Each of the at least three fluid channels have a minimum dimension of no greater than 30 mm.  
WO/2020/119436A1
The present application provides a thin heat pipe, a method for manufacturing the thin heat pipe, and an electronic device. The thin heat pipe comprises a pipe body having a cavity. Two ends of the pipe body comprise a tapered portion. A...  

Matches 501 - 550 out of 13,790