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Matches 201 - 250 out of 13,790

Document Document Title
WO/2022/215902A1
An electronic device according to various embodiments comprises: a housing including a heat source and a thermal management chamber thermally coupled to the heat source; and a display located on the housing so as to be on the opposite si...  
WO/2022/209359A1
A cooling system according to the present disclosure comprises: a refrigerant tank that houses, in a closed interior space, a refrigerant that removes heat from a heating element; an array of a plurality of heat pipes extending from the ...  
WO/2022/206019A1
The present application relates to a heat exchanger (10), a cabinet (100), and a communication base station. The heat exchanger (10) comprises a gas-collecting pipe (20), a liquid-collecting pipe (30) and an exchange pipeline (40). The e...  
WO/2022/209164A1
This heat dissipation module comprises: a container in which a working fluid is sealed; and at least two porous sheets housed in the container. A vapor channel is formed in the container. A gap for generating capillary force in the worki...  
WO/2022/209604A1
This aluminum composite material (1, 2, 3, 4, 5) is obtained by combining an aluminum fiber structure (10) and a composite material (70, 80, 110). With respect to the aluminum fiber structure (10), aluminum fibers (20) are partially bond...  
WO/2022/210838A1
Provided is a vapor chamber in which a thermal resistance when a liquid-phase working fluid changes to a gas phase is reduced and dryout of the liquid-phase working fluid in an evaporating portion is prevented, thereby providing excellen...  
WO/2022/203659A1
A nuclear reactor includes a heat exchanger that transfers thermal energy from a primary reactor coolant to a secondary coolant. The heat exchanger is formed with a hot flow channel, a cold flow channel, and a porous layer between the ho...  
WO/2022/201918A1
A vapor chamber (1), which is one embodiment of this thermal diffusion device, comprises: a housing (10) having a first inner wall surface (11a) and second inner wall surface (12a) facing each other in the thickness direction (Z); a work...  
WO/2022/198140A1
A versatile, modular power system is described which includes a refinery in conjunction with renewable energy sources and a vapor recovery unit which in combination with power from sources of renewable energy produces stacked power to be...  
WO/2022/195719A1
This boiling-type cooler (100) comprises: a boiling unit (10) that has a storage space (11) for storing a refrigerant (1), said boiling unit (10) boiling the refrigerant by exchanging heat with a heating element (HS); and a condensing un...  
WO/2022/190794A1
A vapor chamber 1A that is one embodiment of a heat dissipation device includes: a housing 10 having a first inner wall surface 11a and a second inner wall surface 12a that are opposed to each other in the thickness direction Z; a workin...  
WO/2022/191240A1
A wick sheet (30) for a vapor chamber (1) comprises: a first body surface (31a); a second body surface (31b) located on the reverse side from the first body surface (31a); a frame portion (32), and a plurality of land portions (33) provi...  
WO/2022/190868A1
This cooling device comprises a cooling tank (10), a circulation circuit (20), a heat exchanger (22), a circulation pump (21), and a heat conduction unit (13). The cooling tank (10) stores a refrigerant solution (11) that cools a heating...  
WO/2022/190766A1
The present invention comprises: a cooling tank (10) that stores a refrigerant liquid (11) for immersing and cooling a heat generating body (2); a liquid storage tank (20) that stores the refrigerant liquid outside of the cooling tank an...  
WO/2022/183773A1
A method for reducing the heat transfer temperature difference of a loop heat pipe, relating to the technical field of heat dissipation devices. According to the method, a second vapor cavity (7) is arranged between a first vapor cavity ...  
WO/2022/185109A1
Apparatus for the thermal recovery from at least two thermal flows, comprising: at least a first circuit (2) of a flow to be heated (L); at least a second circuit (3) of a flow to be cooled (S); and a third circuit (4) of an exchange flo...  
WO/2022/183793A1
The present invention relates to the technical field of heat dissipation devices, and in particular to a thin plate type loop heat pipe, comprising a housing. The housing comprises a first housing plate and a second housing plate that co...  
WO/2022/185908A1
The present invention provides a heat pipe that has excellent circulation properties for a working fluid, that makes it possible to prevent abnormal noise from occurring during circulation of the working fluid, and that demonstrates exce...  
WO/2022/184244A1
The invention relates to heat sink (100) comprising a container (208) for accommodating a cooling fluid. The container (208) is arranged at a cooling wall (202) adjacent to and in thermal contact with an electronical heat source (300). T...  
WO/2022/183269A1
A flat foldable heat pipe includes a sealed container formed at least partly of flexible sheets jointed at peripheral portions. The flat foldable heat pipe further includes a spacer housed in the container, where the spacer has walls def...  
WO/2022/185177A1
The present invention relates to a micro-channel type evaporator (100) suitable for cooling electronic components, which exchanger (100) comprises a plateĀ¬ like body (10) having an external coupling surface (11 ) with the electronic com...  
WO/2022/181630A1
A first plate and a second plate of this thermally conductive member are positioned facing each other in a first direction. A first panel section of the first plate extends in a second direction orthogonal to the first direction. A secon...  
WO/2022/181453A1
A thermal device according to the present disclosure utilizes the latent heat of a phase-transforming material. The thermal device according to the present disclosure has a ceramic container and a seal part. The ceramic container include...  
WO/2022/181632A1
A first plate and a second plate of this thermally conductive member are positioned facing each other in a first direction. A first panel section of the first plate extends in a second direction orthogonal to the first direction. A secon...  
WO/2022/181345A1
This cooling device comprises a support plate and a plurality of heat pipes opposite thereto in an up-down direction. The heat pipes are disposed on the upper side of the support plate in the up-down direction. The heat pipes extend in a...  
WO/2022/181631A1
A first plate and a second plate of this thermally conductive member are positioned facing each other in a first direction. A first panel section of the first plate extends in a second direction orthogonal to the first direction. A secon...  
WO/2022/181344A1
This cooling device comprises a support plate opposite a heat source in an up-down direction, and a plurality of heat pipes. The heat pipes are disposed on the upper side of the support plate in the up-down direction. The heat source is ...  
WO/2022/181566A1
A thermal device according to the present disclosure comprises a ceramic container, a fluid, and a sealing part. The container comprises an internal space, an opening connected to the internal space, and a communication path connecting t...  
WO/2022/181343A1
This cooling device comprises a flow path through which a refrigerant flows, and a plurality of heat pipes. The heat pipes extend from the upstream side of the flow path toward the downstream side thereof, and are arrayed in a direction ...  
WO/2022/181629A1
A first plate and a second plate of this thermally conductive member are positioned facing each other in a first direction. A first panel section of the first plate extends in a second direction orthogonal to the first direction. A secon...  
WO/2022/176985A1
A vapor chamber that comprises: a body sheet that has a first body surface and a second body surface that is provided on the reverse side from the first body surface; a space part that is provided on the first body surface of the body sh...  
WO/2022/177715A1
The discussion relates to cooling computing devices and specifically to managing two-phase cooling. One example can include a two-phase liquid immersion tank containing heat generating components and a liquid phase of a coolant having a ...  
WO/2022/172546A1
This evaporator 100 for a loop heat pipe comprises a flat-plate-like housing 120 which includes a bottom wall 120a, a top wall 120b facing the bottom wall 120a in a thickness direction T, and a side wall 120c that connects, in the thickn...  
WO/2022/171931A1
According to a first aspect of the present invention, there is provided a heat dissipation apparatus (100) comprising a block (110) and a closed flow cavity (130) which is formed, at least in part, into the block (110). The flow cavity (...  
WO/2022/173490A1
A method of manufacturing a cold plate includes forming a fluid circuit on a build surface in a layer-by-layer fashion from a build material. The fluid circuit includes a plurality of peripheral walls, each of the plurality of peripheral...  
WO/2022/167752A1
The present invention relates to a condenser (1) for a heat pipe: - a plurality of tubes (2) comprising a wall (3) having an outer face (3a) and an inner face (3b), the wall (3) delimiting a space containing a heat transfer fluid; - the ...  
WO/2022/168891A1
A vapor chamber body sheet according to the present invention comprises a first body surface, a second body surface provided on the reverse side from the first body surface, and a through space that extends from the first body surface to...  
WO/2022/168801A1
A vapor chamber (1) comprises: a first sheet (10); a second sheet (20); and a wick sheet (30). The wick sheet (30) includes: a first body surface (31a); a second body surface (31b); a vapor flowpath section (50) which extends from the fi...  
WO/2022/161342A1
A heat dissipation device, a preparation method for a heat dissipation device, and a wireless communication base station. The heat dissipation device comprises an evaporator (11) and a plurality of rib plates (12), wherein the evaporator...  
WO/2022/161131A1
The present invention relates to a composite capillary structure applied to a thin vapor chamber. The composite capillary structure comprises a first metal sheet and a porous metal capillary structure. The first metal sheet is provided w...  
WO/2022/157727A1
A cold plate heat exchanger (10) is disclosed, comprising: a main body (12) comprising at least one active surface (22) suitable to the heat transfer with at least one device in thermal contact with it; at least one channel (14), in whic...  
WO/2022/159782A1
Embodiments include an optical fiber cable comprising a length extending between a first end and a second end, a central cooling tube, a plurality of optical fibers disposed radially around the cooling tube, each optical fiber comprising...  
WO/2022/151618A1
Disclosed in the present invention are a novel flat heat absorber for solar tower power generation and a system using same. The system comprises a windproof cover, a flat heat absorber, and a circulation pipeline, wherein the flat heat a...  
WO/2022/149337A1
This optical transceiver comprises: a case provided with a heat sink; a heat generating body housed in the case; a heat-conducting portion protruding from an inner wall surface of the case and in thermal contact with the heat generating ...  
WO/2022/148766A1
Techniques facilitating multiple cryogenic systems sectioned within a common vacuum space are provided. In one example, a cryostat can comprise a plurality of thermal stages and a thermal switch. The plurality of thermal stages can inter...  
WO/2022/148899A1
According to an example aspect of the present invention, there is provided a heat sink (100) with an elongated inner core (110) and an elongated outer profile (120). The profile (120) forms a cross-sectional periphery and is provided aro...  
WO/2022/148021A1
A metal heat pipe material based on laser surface cladding, comprising a double-layer structure including an inner layer material and an outer layer material, wherein the inner layer material is a porous structure liquid absorption core;...  
WO/2022/141654A1
Disclosed is an electronic device heat dissipation apparatus having a semiconductor auxiliary heat pump. The electronic device heat dissipation apparatus comprises a main heat dissipation fin group, a first heat pipe group, a first heat ...  
WO/2022/146226A1
In some aspects, a vapor chamber includes a sealed enclosure. The sealed enclosure includes: a main chamber; a first elongate chamber extending laterally from a first side of the main chamber; and a second elongate chamber extending late...  
WO/2022/145205A1
This antenna device is provided with an antenna part, a first base member, a second base member, a pillar, and a first fixing member. The antenna part, the first base member, the second base member and the pillar are arranged in this ord...  

Matches 201 - 250 out of 13,790