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WO/2023/228676A1 |
A resin component for a cooling structure, comprising a first resin portion 100A and a second resin portion 100B that is joined to the first resin portion, wherein a first joint surface of the first resin portion that is joined to the se...
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WO/2023/230320A1 |
An immersion cooling system and methods for operating the system are described. The system can comprise a management system comprising a processor and a memory; a tank configured to hold a thermally conductive dielectric fluid; a compute...
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WO/2023/229621A1 |
A chassis is provided for supporting electronic device circuitry. The chassis generally includes a mounting surface on a first side of the chassis and a cooling surface on a second side of the chassis opposite the mounting surface. The c...
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WO/2023/228765A1 |
A circulation device (100) for a two-phase cooling system comprises: an inlet-side connection portion (41) and an outlet-side connection portion (42); and a bypass flow path (75) that branches downstream of a pump (10) and upstream of th...
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WO/2023/216482A1 |
A mobile terminal, comprising a middle frame (20) and a vapor chamber (30), wherein the vapor chamber (30) is fixed to the middle frame (20); the vapor chamber (30) comprises a first cover plate (31), a second cover plate (32) and a conn...
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WO/2023/219168A1 |
Provided is a wick used to transport heat, the wick containing materials including nanofibers and/or a two-dimensional substance of a material represented by the formula MQaOb (wherein M is at least one element selected from the group co...
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WO/2023/209417A1 |
The present disclosure relates to systems and methods of geothermal energy production using a dual thermosiphon heat exchange system. In one system two working fluids in which a thermosiphon flow is induced to recover thermal energy from...
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WO/2023/210711A1 |
A joint component according to the present invention has a base portion, a first joint portion and a second joint portion disposed on one main surface of the base portion, and a protruding portion that protrudes in a direction parallel t...
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WO/2023/210710A1 |
A cooling structure comprising a first outer packaging material, a second outer packaging material, and a joint component, the joint component being secured to the first outer packaging material and not being secured to the second outer ...
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WO/2023/204919A1 |
An electronic assembly includes: a printed circuit board having a first surface and a second surface opposite the first surface; a heat-generating component disposed on the first surface of the printed circuit board; and a thermal wick a...
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WO/2023/203131A1 |
A compressor-expander system (10) having a compressor (12) that can be driven by an electric machine (11), in order to take in air to be compressed from an environment, having a first heat exchanger (13) arranged downstream of the compre...
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WO/2023/205553A1 |
A method includes using electroforming (406) to deposit a first portion of material (304). The method also includes placing (408) a preformed tube (200) on the first portion of material, where the preformed tube includes multiple capilla...
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WO/2023/204798A1 |
Examples of heat exchanger are described herein. In some examples, a heat exchanger may include a flow channel. In some examples, the heat exchanger may include a lattice structure disposed in the flow channel. In some examples, the heat...
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WO/2023/199944A1 |
A method for preparing a refrigerant that comprises adding an additive to a refrigerant at such a composition and concentration as to satisfy the following requirements: when a preset heat quantity Qin[W] is applied to a heat diffusion b...
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WO/2023/197578A1 |
Disclosed in the present application are a two-phase radiating fin and a heat sink. The two-phase radiating fin comprises a radiating toothed flat plate (100), a circumferential loop channel (110) and a flow dividing channel (120), where...
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WO/2023/195158A1 |
The purpose of the present disclosure is to reduce the temperature in the vicinity of a water surface. The present disclosure is a heat conversion system that comprises a float (20) that floats on water and a heat conversion part (10) ...
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WO/2023/195667A1 |
The heat pipe-integrated reactor comprises: a base in which heat transfer fluid flows; heat pipe fins coupled to the base such that first working fluid flows therein; and an absorbent disposed between the heat pipe fins, wherein each of ...
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WO/2023/194455A1 |
Method involving a flexible heat pump actuated by recuperated environmental energy and associated device. The method that forms the subject of the invention is a method for producing heat and cold in a flexible material comprising gas-fi...
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WO/2023/189773A1 |
This method for manufacturing a boiling-type cooler (100) comprises a condensation part forming step and a boiling part forming step, wherein the boiling-type cooler is provided with: a boiling part (10) for boiling a refrigerant through...
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WO/2023/189739A1 |
[Problem] To provide: an information processing device having a heat dissipation structure which exhibits high heat dissipation capability and which is suited for miniaturizing the information processing device; and a circuit module. [So...
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WO/2023/191000A1 |
A body sheet for a vapor chamber according to the present invention includes a first land part that extends in a first direction, a second land part that extends in a second direction different from the first direction, and a land inters...
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WO/2023/189232A1 |
A wick (10) for a heat pipe having a metal fiber non-woven fabric, the wick (10) for a heat pipe having a sparse fiber part (11) in which there are many voids within the metal fiber non-woven fabric, and a dense fiber part (12) in which ...
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WO/2023/189070A1 |
Provided is a heat sink that can be used to prevent dryout even when the operating ambient temperature is lower than the melting point of a working fluid, without compromising heat transport characteristics. This heat sink comprises: a...
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WO/2023/190524A1 |
This heat dissipation plate comprises: a substrate having a first main surface, and a second main surface located on the side opposite the first main surface; and a plurality of needle-like bodies extending from the first main surface to...
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WO/2023/183251A1 |
A thermal system configured to mechanically bend and provide a thermal conduit to transfer heat through an electronic device, and an electronic device having a bent or curved profile or a mechanical articulation or coupler between a firs...
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WO/2023/182033A1 |
A vapor chamber (1) that is one embodiment of this thermal diffusion device comprises: a housing (10) that has a first inner wall surface (11a) and a second inner wall surface (12a) facing each other in a thickness direction (Z) and that...
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WO/2023/182029A1 |
A vapor chamber (1), which is one embodiment of a heat diffusing device, comprises a housing (10) having a first inner surface (11a) and a second inner surface (12a) that face one another in a thickness direction (Z) and having an intern...
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WO/2023/174882A1 |
The invention relates to a vapor chamber (1), comprising walls sealing off an interior space of the vapor chamber from surroundings, said walls including at least an evaporator wall (3) and a condenser wall (4). In order to obtain a reli...
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WO/2023/173471A1 |
Provided are a combined evaporator vapor chamber and a machining method therefor. The vapor chamber comprises an upper cover plate (1), a lower cover plate (2), an evaporator (3), a capillary structure and a support structure (5), wherei...
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WO/2023/174462A1 |
The invention relates to a device for cooling the lower layers of the atmosphere, which comprises a support tube sleeve (1 ) filled with a buoyant carrier gas, wherein in the support tube sleeve (1 ) is arranged in parallel at least one ...
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WO/2023/172223A1 |
The present invention is related with improvement of heat transfer performance of a plug-in unit by implementing phase change mechanism into the cover/frame (definitions are taken from family of ANSI/VITA standards e.g.). Especially for ...
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WO/2023/171408A1 |
A thermal diffusion device (1A) comprises a casing (10), partition walls (30) provided to a first inner surface (10a) of the casing (10), and wicks (40). Inner edges (15) of the casing (10) include a first inner edge portion (15a) and a ...
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WO/2023/167086A1 |
Provided are a cooling device and a cooler that is capable of causing boiling at a low superheat by suppressing an increase in a boiling starting point. The cooler uses a boiling method for cooling a heating element, and comprises: a con...
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WO/2023/167087A1 |
Provided are a cooling member having a favorable cooling effect, a cooler, a cooling device, and a cooling member manufacturing method. The cooling member comprises integrally formed electrolytic metal foils constituted by a double-layer...
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WO/2023/159966A1 |
The present application discloses a heat dissipation module and a heat dissipation device. The heat dissipation module (100) comprises a heat dissipation fin bodies (110) and at least two loop channels (121) arranged on the heat dissipat...
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WO/2023/160109A1 |
Provided in the embodiments of the present application are a heat dissipation device and an electronic apparatus. The heat dissipation device comprises a housing and a fluid working medium, wherein the housing internally comprises evapor...
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WO/2023/161494A1 |
The present invention relates to a heater module comprising: a heat exchanger including: a first volume comprising a nano-fluid; and a second volume surrounding the first volume and in thermal communication with the first volume for a se...
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WO/2023/160393A1 |
A computer equipment cooling device comprising: a temperature dependent thermal conduction member that includes a first major surface and a second major surface; a set of fins connected in thermal communication with the first major surfa...
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WO/2023/163200A1 |
Provided is a vapor chamber that not only has resistance to pressure from the external environment but is also highly resistant to pressure from within the vapor chamber. The vapor chamber comprises: a container in which a hollow porti...
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WO/2023/162468A1 |
Provided is a heat transport device that can prevent dry-out of working fluid in an evaporation unit even under a use condition in which a heat-generating body having a large volume of heat generated is thermally connected, or under a us...
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WO/2023/157536A1 |
In order to provide a self-regenerating bridge-type heat pipe capable of effectively transporting heat while keeping a filling ratio of a working fluid low, in an aluminum self-regenerating bridge-type heat pipe according to the present ...
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WO/2023/155098A1 |
Disclosed in the present application is a drying apparatus. The drying apparatus comprises a drying frame; vapor chambers, arranged on the drying frame; a PTC heater, arranged on the drying frame, attached to the lower ends of the vapor ...
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WO/2023/155895A1 |
The present application provides a heat pipe capable of preventing freezing and expanding. The heat pipe comprises a pipe body provided with a closed chamber; a heat transfer medium and a capillary structure are provided inside the close...
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WO/2023/158368A1 |
In some aspects, a vapor chamber includes a sealed enclosure. The sealed enclosure includes: a main portion defining a main chamber and a duct portion. The main portion has a heat input surface region for contacting a heat source. The du...
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WO/2023/156976A1 |
An evaporator assembly (2) including at. least one compensation chamber (10) and at least one capillary pump (11) comprising a primary wick (15), the evaporator assembly (2) including a secondary wick (16) extending through the at least ...
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WO/2023/153530A1 |
According to the present invention, by inserting a capillary to which wicks are attached into a conventional vertical heat pipe, the force that pulls up a refrigerant increases due to capillary action by the wicks provided inside, and sp...
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WO/2023/149069A1 |
The present invention provides: a clad plate which is formed of a copper layer and a stainless steel layer, wherein the total content ratio of the constituent elements of the stainless steel layer within the copper layer after being held...
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WO/2023/145397A1 |
A thermal diffusion device 1 comprising : a housing 10 that has a first inner wall surface 11a and a second inner wall surface 12a facing one another in the thickness direction Z; a working medium 20 that is enclosed in an internal space...
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WO/2023/144551A1 |
Attachment device comprising: (a) a housing (12), the housing having: (i) a through bore, the through bore being configured to allow a fluid conduit (16) to pass therethrough, and (ii) an at least one heat source member (20a) receiving s...
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WO/2023/145396A1 |
A thermal diffusion device 1 comprising : a housing 10 that has a first inner wall surface 11a and a second inner wall surface 12a facing one another in the thickness direction Z; a working medium 20 that is enclosed in an internal space...
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