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WO/2022/008135A1 |
Disclosed is a method of improving a measurement of a parameter of interest. The method comprises obtaining metrology data comprising a plurality of measured values of the parameter of interest, relating to one or more targets on a subst...
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WO/2022/008903A2 |
A method for use in the spatial registration of first and second objects comprises fixing the first and second objects to the same motion control stage in an unknown spatial relationship, using an imaging system to acquire an image of th...
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WO/2022/002497A1 |
The invention provides a a method to determine one or more signal parameters of each signal of interest in a plurality of signals of interest received at a single detector of a heterodyne interferometer, said method comprising the follow...
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WO/2021/259645A1 |
Systems, apparatuses, and methods are provided for determining the alignment of a substrate. An example method can include emitting a multi-wavelength radiation beam including a first wavelength and a second wavelength toward a region of...
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WO/2021/259618A1 |
A system includes an illumination system, an optical element, a switching element and a detector. The illumination system includes a broadband light source that generates a beam of radiation. The dispersive optical element receives the b...
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WO/2021/259559A1 |
Disclosed is a method to determine a performance indicator indicative of alignment performance a processed substrate. The method comprises obtaining measurement data comprising a plurality of measured position values of alignment marks o...
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WO/2021/254698A1 |
An offset alignment method for a micro-lithographic printing device comprises placing (S10) of an alignment target substrate. A target pattern presents areas of at least two different light reflectivities is defined relative an origin po...
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WO/2021/254810A1 |
A system includes an illumination system, an optical element, a switching element and a detector. The illumination system includes a broadband light source that generates a beam of radiation. The dispersive optical element receives the b...
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WO/2021/254709A1 |
Disclosed is a method for modeling measurement data over a substrate area and associated apparatus. The method comprises obtaining measurement data relating to a first layout; modeling a second model based on said first layout; evaluatin...
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WO/2021/257055A1 |
The present disclosure relates to apparatus and methods for performing maskless lithography processes. A substrate processing apparatus includes a slab with a plurality of guiderails coupled to and extending along the slab. A first shutt...
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WO/2021/249711A1 |
Disclosed is method of determining a position value relating to at least one target, and associated apparatuses. The method comprises obtaining measurement data relating to measurement of at least one target; wherein the measurement data...
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WO/2021/250034A1 |
Disclosed is target arrangement comprising a first target region having at least a first pitch and at least a second pitch a second target region having at least a third pitch, wherein a portion of the first target region having a second...
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WO/2021/249682A1 |
The present invention provides a method for calculating a corrected substrate height map of a first substrate using a height level sensor. The method comprises: sampling the first substrate by means of the height level sensor with the fi...
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WO/2021/249739A1 |
A patterning device pre-alignment sensor system is disclosed. The system comprises at least one illumination source configured to provide an incident beam along a normal direction towards a patterning device. The system further comprises...
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WO/2021/239461A1 |
Disclosed is a method of, and associated apparatuses for, performing a position measurement on an alignment mark comprising at least a first periodic structure having a direction of periodicity along a first direction. The method compris...
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WO/2021/239589A1 |
Conditioning device for conditioning an object in a conditioning volume, comprising: at least one support pin adapted to support the object; a first plate and a second plate forming outer borders of the conditioning volume; an actuator u...
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WO/2021/239448A1 |
Disclosed is a method for determining a focus parameter value used to expose at least one structure on a substrate. The method comprises obtaining measurement data relating to a measurement of said at least one structure, wherein the at ...
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WO/2021/235439A1 |
This pattern forming device comprises a pattern forming mechanism for forming a pattern on a substrate, and a mark detecting mechanism for detecting a mark formed on a substrate. The mark detecting mechanism includes: an objective lens s...
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WO/2021/233642A1 |
A method for generating an alignment signal is described. The method comprises detecting local dimensional distortions of an alignment mark and generating the alignment signal based on the alignment mark. The alignment signal is weighted...
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WO/2021/233626A1 |
Disclosed is a supercontinuum radiation source comprising a modulator being operable to modulate pump laser radiation comprising a train of radiation pulses to provide modulated pump laser radiation, said modulation being such to selecti...
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WO/2021/229992A1 |
Provided are a drawing method and the like with which it is possible to reduce the amount of drawing data used when a long, continuous wiring pattern is drawn on a substrate. The wiring pattern includes a first region in which the patter...
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WO/2021/231113A1 |
A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bond...
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WO/2021/228811A1 |
The invention provides a method of determining a position of a product feature on a substrate, comprising: obtaining a plurality of position measurements of one or more product features on a substrate, wherein the measurements are refere...
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WO/2021/224009A1 |
Disclosed is a substrate and associated patterning device. The substrate comprises at least one target arrangement suitable for metrology of a lithographic process, the target arrangement comprising at least one pair of similar target re...
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WO/2021/223940A1 |
Systems, apparatuses, and methods are provided for generating level data. An example method can include receiving first level data for a first region of a substrate. The first region can include a first subregion having a first surface l...
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WO/2021/219030A1 |
The present disclosure provides an intelligent correction device control system for a super-resolution photolithography precision mask, comprising: a sixteen-path pneumatic fine tuning mask deformation control subsystem which is used for...
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WO/2021/219017A1 |
An alignment and measurement system and method, and a photoetching machine. The alignment and measurement system comprises at least three sets of off-axis detection imaging optical paths, each of which comprises: a laser light source (10...
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WO/2021/219007A1 |
A dark-field moiré fringe-based alignment detection and control super-resolution photolithography device, comprising: a super-resolution photolithography mask (8) provided with a photolithography pattern area (28), a white light gap mea...
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WO/2021/213032A1 |
Disclosed in the present invention are a semiconductor mark and a forming method therefor. The semiconductor mark comprises: a front layer mark, the front layer mark comprising first graphics and second graphics, the second graphics bein...
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WO/2021/215915A1 |
A layered product (10) is provided with at least a lower product layer (120) comprising a first marker configuration(122) with at least a first marker (122a, 122b) and at least a higher product layer (130) that overlays the lower product...
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WO/2021/211154A1 |
A target and method for using the same in the measurement of misregistration between at least a first layer and a second layer formed on a wafer in the manufacture of functional semiconductor devices on the wafer, the functional semicond...
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WO/2021/204487A1 |
Disclosed is a method of determining a sampling scheme. The method comprises obtaining a parallel sensor description and identifying a plurality of candidate acquisition configurations based on said parallel sensor description and potent...
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WO/2021/206044A1 |
A pattern-forming device for forming a pattern in a predetermined region on a substrate moving in a first direction, the device comprising: a first alignment system that optically detects first substrate marks formed on the substrate and...
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WO/2021/196996A1 |
Disclosed are a semiconductor structure and a preparation method therefor. The semiconductor structure (100) comprises: a functional structure (11) and a first mark structure (121), which are located on a substrate (10), a feature size o...
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WO/2021/190396A1 |
Provided is a mask (1000), comprising a first boundary area (21) and a plurality of exposure pattern areas (10), wherein the first boundary area (21) comprises a region surrounding the plurality of exposure pattern areas (10); and the fi...
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WO/2021/193494A1 |
Provided are an exposure device and an exposure method with which high-precision circuit drawing is possible. This exposure device comprises a drawing head (4X) that moves in a prescribed direction relative to a substrate stage (5) and...
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WO/2021/156069A1 |
An apparatus for and method of sensing multiple alignment marks in which the optical axis of a detector is divided into multiple axes each of which can essentially simultaneously detect a separate alignment mark to generate a signal whic...
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WO/2021/151775A1 |
A compact sensor apparatus having an illumination beam, a beam shaping system, a polarization modulation system, a beam projection system, and a signal detection system. The beam shaping system is configured to shape an illumination beam...
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WO/2021/154762A1 |
A metrology target includes a first set of pattern elements compatible with a first metrology mode along one or more directions, and a second set of pattern elements compatible with a second metrology mode along one or more directions, w...
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WO/2021/151565A1 |
Disclosed is a method of determining a freeform shape impact parameter which describes the impact of a freeform shape of a substrate on a clamped substrate coordinate grid corresponding to said substrate subsequent to clamping onto a sub...
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WO/2021/150311A1 |
Embodiments of the present disclosure generally relate to imprint compositions and materials and related processes useful for nanoimprint lithography (NIL). In one or more embodiments, an imprint composition contains one or more types of...
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WO/2021/144066A1 |
A substrate, associated patterning device and a method. The substrate includes at least one periodic alignment mark and at least one neighboring structure. The alignment mark comprises at least a first part having a direction of periodic...
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WO/2021/146088A1 |
An overlay control system is disclosed. In embodiments, the system may include a controller configured to: acquire a set of feedback overlay measurements based on a plan of record (POR) sampling map on a second layer of samples of at lea...
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WO/2021/141706A1 |
A method of forming patterned features on a substrate is provided. The method includes positioning a plurality of masks arranged in a mask layout over a substrate. The substrate is positioned in a first plane and the plurality of masks a...
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WO/2021/134833A1 |
The present application provides an array substrate preparation method, array substrate, and liquid crystal display panel. A non-display area of the array substrate comprises a base substrate, an alignment mark, an insulating layer, a hy...
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WO/2021/133436A1 |
A semiconductor equipment architecture WGT for wafer shape and flatness measurement is disclosed. The semiconductor equipment architecture WGT includes a reflective air-bearing chuck and a hybrid wafer thickness gauge. Also disclosed are...
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WO/2021/133112A1 |
The present invention provides an optical system for performing photolithography, the optical system comprising: a light source which emits light of a first wavelength and light of a second wavelength, the first and second wavelengths be...
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WO/2021/122016A1 |
Disclosed is a metrology method relating to measurement of a structure on a substrate, said structure being subject to one or more asymmetric deviation. The method comprises obtaining at least one intensity asymmetry value relating to th...
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WO/2021/115735A1 |
Disclosed is a substrate, associated patterning device and a method for measuring a position of the substrate. The method comprises performing an alignment scan of an alignment mark to obtain simultaneously: a first measurement signal de...
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WO/2021/115574A1 |
The invention relates to a device and to a method for aligning substrates.
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