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WO/2023/199633A1 |
Provided are: a fine metal particle aggregate having a uniform particle-size distribution and exhibiting excellent transfer characteristics; a conductive film; a connection structure; and production methods for the same. A metal partic...
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WO/2023/195446A1 |
Provided is a transparent conductive film with a protection film, the transparent conductive film having excellent conductivity despite the protection film being releasable. A transparent conductive film with a protection film accordin...
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WO/2023/189000A1 |
This connection structure is suitable for high-density mounting and is obtained by connecting a first electronic component and a second electronic component via conductive particles and an insulating adhesive agent disposed between an el...
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WO/2023/188548A1 |
Provided is an electromagnetic shield film which has excellent moldability into a three-dimensional shape without exhibiting a decline in adhesion properties. An electromagnetic shield film equipped with a substrate film and an electroma...
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WO/2023/188748A1 |
The present invention addresses the problem of providing a strip-shaped copper alloy material that exhibits a high strength and that suppresses the production of burring during cutting. The present invention is a strip-shaped copper al...
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WO/2023/189993A1 |
Provided are silver microparticles that exhibit a large volumetric shrinkage and a high conductivity. The particle size of the silver microparticles as measured by BET method is 0.1-1 μm. The volume resistivity and volumetric shrinkage ...
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WO/2023/184593A1 |
A conductive film (100) and a display panel. The conductive film (100) comprises a conductive layer (2), the conductive layer (2) comprises a plurality of wires (21) which are spaced apart from and parallel to each other, and a stress di...
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WO/2023/190612A1 |
The present invention pertains to a laminate comprising a substrate, an underlayer, and a metal layer in the stated order, wherein the metal layer includes a plurality of portions that are at least partially discontinuous with each other...
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WO/2023/189635A1 |
One embodiment of the present disclosure provides a braided shield member which can suppress the emission of electromagnetic waves of a wide frequency band. The braided shield member (30) is formed by weaving multiple wire strands (40), ...
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WO/2023/189416A1 |
An electroconductive film 100, in plan view, includes particle regions 30 of a prescribed surface area, disposed regularly scattered, the particle regions including a projection of one electroconductive particle 20 or a projection of an ...
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WO/2023/189711A1 |
A connection structure in which an electrode of a first electronic component and an electrode of a second electronic component are aligned so as to face each other, and the first electronic component and the second electronic component a...
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WO/2023/181631A1 |
The present invention addresses the problem of providing a bioelectrode in textile form and a method for manufacturing the same, the bioelectrode being flexible, versatile, excellent in fastness, and resistant to conductivity decrease du...
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WO/2023/181664A1 |
The present invention provides tin oxide particles that contain phosphorus element. The content of the phosphorus element in the tin oxide particles is 0.1% by mass to 1.2% by mass. The lattice strain of the tin oxide is 0.40% to 0.60%. ...
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WO/2023/181977A1 |
A problem was presented in that the use of conventional, known organic-solvent-type electroconductive polymer compositions was limited by high surface resistance. The purpose of the present invention is to provide an electroconductive po...
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WO/2023/182329A1 |
Provided is a thermally-conductive electrical conducting layer excelling in thermal conductivity in the thickness direction. The thermally-conductive electrical conducting layer (1) comprises a binder component (11) and electrically-cond...
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WO/2023/176402A1 |
Provided is a block-like silver powder having a BET specific surface area of 0.5 m2/g or less, an average aspect ratio when 100 or more silver particle cross sections are observed of 1.2 or greater and less than 2.0, and an average ratio...
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WO/2023/177844A1 |
A stray current mitigation assembly includes a carbon conduction subassembly configured to be embedded in a subsurface adjacent an electrically conductive structure. The carbon conduction subassembly includes a carbon fiber fabric layer ...
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WO/2023/176575A1 |
Provided are: an electric wire conductor which is obtained by forming a twisted wire formed by twisting a plurality of wires into a flat shape, and which can ensure high flexibility; and an insulated electric wire and a wire harness incl...
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WO/2023/171693A1 |
Provided are a conductive composition that has excellent dispersion stability of metal particles and that makes it possible to easily record a conductive image having excellent conductivity even by simple post-processing, and a method fo...
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WO/2023/171634A1 |
Conductive particles P for an adhesive film for circuit connection, said conductive particles P each comprising a conductive parent particle 31 and child particles 32 covering the surface of the parent particle 31, wherein the ratio of t...
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WO/2023/171633A1 |
This electrically conductive particle P for an adhesive film for circuit connection comprises a mother particle 31 having electrical conductivity, and child particles 32 that cover the surface of the mother particle 31, wherein, with the...
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WO/2023/171631A1 |
Conductive particles P which have an individual dispersion ratio of at least 90.0% and are used to produce an adhesive film for circuit connection, said conductive particles P each comprising a conductive parent particle 31 and child par...
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WO/2023/172181A1 |
A wire for electrical transmission comprising: a core comprising at least one metal strand formed by a first metal, and a surrounding layer comprising a plurality of surrounding metal strands formed by a second metal, the surrounding met...
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WO/2023/171630A1 |
The present invention provides conductive particles P which have a monodispersity ratio of 90.0% or more and are used for the production of an adhesive film for circuit connection, and which comprise conductive mother particles 31 and ch...
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WO/2023/169429A1 |
Provided in the present application are a structural member and a preparation method therefor, and an electronic device. The preparation method for a structural member comprises: performing n instances of a formation treatment on a struc...
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WO/2023/167255A1 |
An aluminum-compressed electric wire (1) comprises: a twisted wire conductor (20) composed of a compressed twisted wire conductor (22) in which seven twisted wires of aluminum strands (10) are compressed, the twisted wire conductor (20) ...
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WO/2023/160156A1 |
The present disclosure relates to devices equipped with transparent film heaters and methods for preparing the devices and the transparent film heaters. The devices may include a substrate and a transparent film heater deposited on the s...
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WO/2023/157563A1 |
Provided is a transparent conductive film having excellent lightsome input, input stability, and clarity. The transparent conductive film, in which a transparent conductive film of an indium-tin composite oxide is laminated on at least...
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WO/2023/155833A1 |
The present invention relates to the technical field of flexible electronic materials and flexible circuits. Disclosed are a flexible electronic material, a breathable moisture-permeable electronic element, a flexible circuit, and a meth...
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WO/2023/157614A1 |
Provided are: a copper alloy sheet material with high tensile strength and a small temperature coefficient of resistance (TCR), thereby making it possible to increase the reliability of products to which said sheet material is applied, s...
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WO/2023/149294A1 |
Provided are conductive particles with which is it possible to make a crack in a conductive layer less likely to occur, and enhance the conduction reliability of an obtainable connection structure even when mounted at low pressure. Con...
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WO/2023/145472A1 |
This resin composition comprises: a curable resin (A); an acrylic monomer copolymer (B) having structures represented by formulas (1) to (3) and having a weight-average molecular weight of at least 10,000 and not more than 900,000; an in...
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WO/2023/145440A1 |
The present invention provides a method for producing a novel electrical wiring line which is suited to the demands for weight saving and space saving, and which can be produced at a low cost. A method for producing a film wire, wherei...
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WO/2023/145359A1 |
Provided are: a laminate in which at least one porous layer and at least one other layer are laminated, and which has excellent adhesion between the porous layer and the other layer; and a method for manufacturing said laminate. In the...
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WO/2023/145473A1 |
A resin composition according to the present invention contains: a core-shell rubber (A) having a core that contains a silicone polymer and/or an acrylic polymer and a shell that contains a poly(methyl methacrylate), said rubber having a...
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WO/2023/146017A1 |
Disclosed are a conductive composition including metal nanowires and a cross-linkable compound, a conductor, and an electrode and an electronic device which include the conductor.
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WO/2023/145664A1 |
Provided are conductive particles that can decrease connection resistance and increase conduction reliability when the conductive particles are used for electrical connection between electrodes. A conductive particle according to the p...
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WO/2023/145471A1 |
A resin composition according to the present invention contains: a molybdenum compound (A); a curable resin (B) that includes a maleimide compound (B1) and a benzoxazine compound (B2) having an allyl group; and an inorganic filler (C). T...
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WO/2023/145714A1 |
The purpose of the present invention is to provide a transparent conductive member in which a change in resistance value or color shade is suppressed even when irradiated with light for a long time. This transparent conductive member com...
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WO/2023/140011A1 |
The present invention addresses the problem of providing: a metal nanowire production method whereby it is possible to obtain a metal nanowire with low connection resistance; a metal nanowire; a dispersion liquid; and a conductive film. ...
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WO/2023/140262A1 |
Provided is an aromatic vinyl compound-aromatic polyene copolymer that satisfies all of conditions (1) to (4). (1) The number average molecular weight of the copolymer is at least 500 and less than 100,000. (2) The aromatic vinyl compoun...
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WO/2023/136204A1 |
Provided are substrate particles with which the connection resistance of an obtainable connection structure can be reduced and the conduction reliability can be enhanced even when mounted at low pressure. Substrate particles according ...
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WO/2023/136255A1 |
This carbon nanotube composite wiring (10) comprises a substrate (3), a carbon nanotube (1), and a metal thin film (2) formed on the carbon nanotube (1). In the carbon nanotube (1), the peak ratio (G/D) of the G band and the D band in th...
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WO/2023/136221A1 |
This wiring body comprises an electrode and a terminal, wherein: the terminal has a conductor pattern including a plurality of rectangular openings and a planar conductor portion having an area no less than the opening area of the openin...
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WO/2023/136363A1 |
This conductive member comprises a base material and a transparent conductive film formed on the base material, wherein the base material is heat labile, the transparent conductive film contains crystalline particles comprising indium ox...
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WO/2023/132639A1 |
The present invention relates to a graphene channel including a graphene film and a graphene nanoparticle film and to a biosensor and a wearable device, including same, and it is possible to amplify a pulse signal, to directly measure pu...
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WO/2023/125764A1 |
A conductive sheet, a conductive bar and a vehicle electrical connector. The conductive sheet comprises a conductive sheet body. The conductive sheet body is a flat strip-shaped structure, and the conductive sheet body meets the followin...
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WO/2023/120512A1 |
The present invention relates to an electroconductive multilayered product having a multilayer configuration of substrate/ITO layer/Ag layer, the multilayer configuration comprising a substrate, an ITO layer made of indium tin oxide form...
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WO/2023/120297A1 |
The present invention provides a conductive substrate which has excellent capabilities for inhibiting migration between conductive thin wires, and has excellent light resistance. The present invention also provides a conductive substrate...
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WO/2023/120109A1 |
The present invention addresses the problem of providing a conductive substrate and a method for manufacturing a conductive substrate, wherein the sulfuration resistance and light resistance of a conductive fine wire section is excellent...
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