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Matches 1 - 50 out of 1,065,259

Document Document Title
WO/2021/052635A3
A semiconductor structure comprises an n-doped first layer, a p-doped second layer doped with a first dopant, and an active layer arranged between the n-doped first layer and the p-doped second layer and having at least one quantum well....  
WO/2021/084783A1
A liquid-droplet-like semiconductor chip ink 200 contains a liquid 50 and semiconductor chips 40 having first electrodes and second electrodes on upper surfaces and lower surfaces, and is configured such that the second electrode side po...  
WO/2021/082170A1
Provided are an array substrate and a preparation method therefor, and a display panel. The thickness of an active layer in a GOA area of the substrate is set to be relatively small, thereby facilitating realizing of the requirements of ...  
WO/2021/084561A1
The present invention provides an apparatus for the deposition of thin films on a substrate, including large substrates, held preferably face-down, in a cartridge containing a liquid solution with at least a chemical precursor which, upo...  
WO/2021/085913A1
The present invention relates to a coupling-type focus ring whereby the focus ring is separated into a plurality of portions and assembled so as to enable the replacement of only a portion which has been used up as a result of etching by...  
WO/2021/081943A1
A chip stack packaging structure and a packaging method thereof, and an electronic device, related to the technical field of electronics, and used to solve the problem of partial delamination in large-dimension packaging structures. A ch...  
WO/2021/081975A1
A method for cleaning a substrate with pattern structures comprises the following steps: using gas-liquid atomization to clean a substrate surface (601); using TEBO megasonic to clean the substrate surface (602); and drying the substrate...  
WO/2021/086440A1
Methods for reducing manufacturing cost and improving the reliability of non-volatile memories using NAND strings with polysilicon channels and p-type doped source lines are described. A NAND string may include a polysilicon channel that...  
WO/2021/086577A1
Methods for processing a substrate are provided herein. The method, for example, includes selectively depositing a first layer of metal within at least one feature on a substrate; depositing a second layer of metal atop the first layer o...  
WO/2021/085685A1
A material deposition arrangement for depositing a material on a substrate in a vacuum deposition chamber is described. The material deposition arrangement comprises a crucible configured to evaporate a material through an opening, a dis...  
WO/2021/082648A1
A display substrate and a manufacturing method therefor, and a display device. The display substrate comprises: a plurality of sub-pixels, each sub-pixel comprising a light-emitting region and a non-light-emitting region, and each sub-pi...  
WO/2021/085837A1
Provided are: a composition for the wet etching of polysilicon, the composition comprising a phosphorus-containing acid and an annular alcohol; and a method for manufacturing a semiconductor device using same.  
WO/2021/084369A1
Provided is a semiconductor device with little variation in properties. The present invention has a first insulator, transistors on the first insulator, a second insulator on the transistors, a third insulator on the second insulator, a ...  
WO/2021/085463A1
This electronic component conveying device comprises a rotating conveying unit, a first drive unit, and a second drive unit. The rotating conveying unit conveys an electronic component along a circular conveying path. The first drive uni...  
WO/2021/085212A1
[Problem] To prevent particles removed from a substrate from re-attaching to the substrate. [Solution] A substrate cleaning apparatus provided with a substrate holding unit for holding a substrate, a gas nozzle for ejecting a cleaning ga...  
WO/2021/082061A1
A display panel and a preparation method therefor. A pixel definition layer (60) and an organic light-emitting layer (70) are prepared on a substrate (10) provided with a first auxiliary cathode layer (30) and a second auxiliary cathode ...  
WO/2021/084601A1
In the present invention, a high-frequency line substrate (2-1) is mounted on a printed board (2-2). The printed board (2-2) is provided with a first high-frequency line. The high-frequency line substrate (2-1) is provided with a second ...  
WO/2021/087098A1
Various embodiments provide for systems and techniques for the successful fabrication of thin metal oxide (TMO)-on-glass layer stacks via direct deposition. The resulting samples feature epitaxial, ultra-thin strontium titanate (STO) on ...  
WO/2021/085556A1
A semiconductor element which contains gallium nitride and is provided with a semiconductor layer having a first surface that comprises a first region and a second region that is either a band-like protrusion protruding beyond the first ...  
WO/2021/086788A1
Processing methods may be performed to produce semiconductor structures that may include a high-k dielectric material. The methods may include forming a silicon layer over a semiconductor substrate. The semiconductor substrate may includ...  
WO/2021/083971A1
The invention relates to a magazine system (1) for production lines for producing sheet-like substrates, in particular wafers, solar cells or printed circuit boards, having at least one substrate magazine (2) with two mutually opposite a...  
WO/2021/083617A1
Embodiments herein describe methods, devices, and systems for reducing an electric field at a clamp-reticle interface using an enhanced electrostatic clamp. In particular, the electrostatic clamp includes a clamp body, an electrode layer...  
WO/2021/084708A1
A resin composition for provisional fixation for provisionally affixing a support for substrate conveyance to an organic substrate, said resin composition containing a thermoplastic resin, a thermosetting resin and an inorganic filler. I...  
WO/2021/082516A1
Provided are a light-emitting diode chip, a growth substrate and an LED chip transfer apparatus. The light-emitting diode chip (10) comprises: a chip main body (100), wherein an electrode (104) is arranged at one side of the chip main bo...  
WO/2021/082065A1
A flexible display device substrate and a manufacturing method. The flexible display device substrate comprises: a first flexible substrate, toughening layers, a second flexible substrate and interwoven structure layers. The second flexi...  
WO/2021/086491A1
An integrated device that includes a substrate, an interconnect portion and an interconnect structure. The interconnect portion is located over the substrate. The interconnect portion includes a plurality of interconnects and at least on...  
WO/2021/083304A1
A substrate stripping method and an epitaxial wafer, relating to the technical field of semiconductors. The method comprises: providing a substrate (1), the substrate (1) having a recess, and the recess being distributed on a first surfa...  
WO/2021/082337A1
A method for improving the tip discharge defect and a manufacturing method for a semiconductor device. The method for improving the tip discharge defect comprises: providing a wafer structure, the wafer structure having a device area (11...  
WO/2021/084934A1
A method for processing a multilayer substrate in which a first substrate and a second substrate are bonded to one another, the method including the formation of a peripheral edge modified layer along the boundary between a peripheral ed...  
WO/2021/087132A1
Methods and apparatuses for depositing material into high aspect ratio features are described herein. Methods involve depositing an oxide material using a hydrogen-containing oxidizing chemistry. Methods may also involve thermally treati...  
WO/2021/084778A1
One aspect of the present disclosure is a method for evaluating the ease of cutting of a film-like adhesive under low-temperature conditions in which cooling expansion is performed, said method including: a step for preparing a specimen ...  
WO/2021/086860A1
Exemplary deposition methods may include delivering a silicon-containing precursor and a carrier precursor to a processing region of a semiconductor processing chamber. The methods may include forming a plasma of the silicon-containing p...  
WO/2021/085213A1
[Problem] To prevent reattachment of particles that have been removed from a substrate. [Solution] A substrate cleaning apparatus according to the present invention is provided with: a substrate holding part that holds a substrate; a gas...  
WO/2021/086700A1
A system includes optics for ultraviolet light or electrons. The optics are situated in a chamber and include a surface to control a path of photons or electrons. The system also includes a lubricated component that is distinct from the ...  
WO/2021/086480A1
A through-wafer via substrate includes a substrate having an intermediate layer and a bonding layer formed on a surface of the intermediate layer. A via cavity extends through the bonding layer and into the intermediate layer, and a stre...  
WO/2021/086745A1
Disclosed are techniques and systems for automatically determining and correcting the levelness of a wafer handling robot end effector. The systems may use a tilt sensor or a gravitational field sensor which may be calibrated to the wafe...  
WO/2021/086835A1
Exemplary methods of semiconductor processing may include forming a silicon oxide material on exposed surfaces of a processing region of a semiconductor processing chamber. The methods may include forming a silicon nitride material overl...  
WO/2021/085756A1
A donor substrate according to an embodiment of the present invention includes: a substrate; a resin layer arranged on one surface of the substrate; a plurality of first protrusions on the resin layer; and an alignment mark arranged on t...  
WO/2021/084902A1
Provided is a method for manufacturing a chip-mounted substrate, the method comprising: preparing a laminate substrate comprising a plurality of chips, a first substrate to which the plurality of chips are bonded temporarily, and a secon...  
WO/2021/086813A1
Methods and systems for generating X-ray illumination from a laser produced plasma (LPP) employing a low atomic number, cryogenic target are presented herein. A highly focused, short duration laser pulse is directed to a low atomic numbe...  
WO/2021/085558A1
A semiconductor device, having: an Si substrate (1); a first transistor (111) formed on the Si substrate (1), the first transistor (111) having a first source electrode (11), a first gate region (13), and a first drain electrode (14); an...  
WO/2021/084959A1
Provided are: an imaging device capable of reducing noise; and an electronic device using said imaging device. This imaging device is equipped with: a light receiving element; and a readout circuit for reading out an electrical signal ob...  
WO/2021/085436A1
Provided is a semiconductor integrated circuit comprising: a P-type substrate; an embedded insulating film provided on the substrate; a P-type active layer provided on the embedded insulating film; a cathode region formed in the active l...  
WO/2021/085078A1
This silicon carbide semiconductor device has: a silicon carbide substrate; a first electrode; and a second electrode. The silicon carbide substrate has a first main surface, a second main surface, a first impurity region, a second impur...  
WO/2021/086015A1
Provided are a CMP slurry composition for polishing a tungsten pattern wafer, and a method for polishing a tungsten pattern wafer by using same, the CMP slurry composition comprising: a polar solvent and/or a nonpolar solvent; an abrasiv...  
WO/2021/085158A1
The present invention addresses the problem of properly shortening a processing step for processing a substrate in which a silicon layer and a silicon germanium layer are alternatively stacked. The present invention provides a method f...  
WO/2021/067330A3
An electrical component is provided by metallizing holes that extend through a glass substrate. The electrical component can be fabricated by forcing a suspension of electrically conductive particles suspended in a liquid medium through ...  
WO/2021/084188A1
A direct bonding method comprising the following steps: - supplying a first substrate (10) and a second substrate (20), the first substrate (10) being covered with a first hydrophilic surface (11) and the second substrate (20) being cove...  
WO/2021/085049A1
A charged particle beam device 1 comprises: a plurality of detectors 7 that detect signal particles 9 released by a sample 8 as a result of irradiation by a charged particle beam 3, and convert the particles into an output electrical sig...  
WO/2021/083032A1
A packaging structure (1) and a manufacturing method therefor. The packaging structure (1) comprises a first carrier board (100), a first electronic component (101), a second electronic component (101), a second carrier board (11) and fi...  

Matches 1 - 50 out of 1,065,259