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WO/2019/050525A1 |
The subject matter of the present disclosure may be embodied in devices, such as flexible wiring, that include: an elongated flexible substrate; multiple electrically conductive traces arranged in an array on a first side of the elongate...
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WO/2019/049720A1 |
A superconducting device (1) is provided in a magnet device (2) including a magnet part (3) that generates a magnetic field. The superconducting device (1) has a superconducting bulk part (4) disposed outside the magnet part (3). The sup...
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WO/2019/045763A1 |
A method of fabricating a device is presented. The method includes forming a multilayer stack (101', 102', 103') on a substrate (10', 100') which has a principal surface. The multilayer stack includes a supporting layer (102') formed ove...
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WO/2019/044783A1 |
Provided is a high-temperature superconductor wire connection in which high-temperature superconductor wires comprising high-temperature superconductor layers are connected to each other; wherein facing first and second high-temperature ...
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WO/2019/045762A1 |
A method for forming at least part of a quantum information processing device is presented. The method includes providing a first electrically-conductive layer formed of a first electrically-conductive material (100') on a principal surf...
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WO/2019/038528A1 |
According to a first aspect of the present invention, there is provided a method of forming a superconduting joint between ReBCO tapes. Two or more ReBCO tapes are provided, each having an exposed ReBCO region. A bridge is provided, comp...
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WO/2019/038409A1 |
A superconducting logic element (1), comprising: a superconducting tunnel junction (10) comprising a first (20) and a second (30) superconductor; a first insulating ferromagnet (40) in contact with the first superconductor (20), configur...
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WO/2019/032115A1 |
Embodiments of the present disclosure propose methods of fabricating quantum circuit assemblies that include Josephson Junctions connected below the plane of supporting circuitry. A exemplary quantum circuit assembly includes supporting ...
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WO/2019/025019A1 |
A technique relates to a superconducting qubit. A Josephson junction includes a first superconductor and a second superconductor formed on a non-superconducting metal. A capacitor is coupled in parallel with the Josephson junction.
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WO/2019/023577A1 |
The various embodiments described herein include methods, devices, and systems for fabricating and operating transistors. In one aspect, a transistor includes: (1) a semiconducting component configured to operate in an on state at temper...
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WO/2019/013386A1 |
The present invention relates to a superconducting cable having a machined surface and a manufacturing method therefor, and the technical matter of the present invention relates to including the steps of: removing burrs formed at the edg...
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WO/2019/010090A1 |
Majorana-based qubits based on the formation of superconducting islands, some parts of which are topological (T) and some parts of which are non-topological (S), and techniques for fabricating such qubits are disclosed. In one embodiment...
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WO/2019/001753A1 |
A mixed semiconductor-superconductor platform is fabricated in phases. In a masking phase, a dielectric mask is formed on a substrate, such that the dielectric mask leaves one or more regions of the substrate exposed. In a selective area...
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WO/2018/236374A1 |
Described herein are qubit devices that employ superconductive materials and ways of protecting such materials from oxidation. In one aspect of the present disclosure, a qubit device that includes at least one quantum circuit component/e...
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WO/2018/235988A1 |
The present invention principally relates to a biaxial die assembly, which is for aligning a plurality of stacked conductors, comprising: a pair of die bodies; a recessed portion which is recessed on each of the die bodies such that, on ...
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WO/2018/236102A1 |
The present invention relates to a lamination structure of a superconducting wire. The present invention provides the superconducting wire having a metal substrate, a buffer layer, a superconducting layer, and a stabilizer layer which ar...
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WO/2018/231396A1 |
Laminated superconductor wires (100) are disclosed, comprising a high temperature superconductor (HTS) layer (75a) having two cap layers (72a, 104a) in direct contact with opposite surfaces thereof, a first lamination layer (96a) affixed...
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WO/2018/231909A1 |
A method of fabricating a semiconductor structure is provided. The method includes evaporating at least one precursor and depositing an epitaxial film containing a halide perovskite derived from the at least one precursor on a single cry...
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WO/2018/232332A1 |
The invention is directed to a photodetector which includes a superconducting nanowire composed of niobium-germanium, a protective layer configured to inhibit oxidation of the superconducting nanowire, and a current source configured to ...
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WO/2018/227083A1 |
A multi-filament high temperature superconducting cable having improved AC current carrying capacity, quench resistance and flexibility. The multi-filament cable is formed from a plurality of stacked exfoliated filaments which provide cu...
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WO/2018/224876A1 |
A technique relates to forming a sidewall tunnel junction. A first conducting layer is formed using a first shadow mask evaporation. A second conducting layer is formed on a portion of the first conducting layer, where the second conduct...
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WO/2018/226586A1 |
A method includes generating a bias signal from a first device, and applying the bias signal to a second device, the first device having (a) a superconducting trace and (b) a superconducting quantum interference device (SQUID), in which ...
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WO/2018/221524A1 |
Provided is a thermal-insulated multiple pipe for superconducting power transmission, having high thermal insulation properties and having no damage to spacers even when laid using the reel-lay method. A thermal-insulated multiple pipe f...
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WO/2018/221522A1 |
Provided is a thermal-insulated multiple pipe for superconducting power transmission having excellent thermal insulation properties and highly suppressing heat incursion from outside caused by radiation, even when not using super insulat...
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WO/2018/221523A1 |
Provided is a thermal-insulated multiple pipe for superconducting power transmission having excellent thermal insulation properties, having highly suppressed heat incursion from outside caused by radiation, even when not using super insu...
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WO/2018/211764A1 |
This superconducting wire material is provided with a first wire material having a first superconducting material layer, a second wire material having a second superconducting material layer, and a superconducting material joining layer....
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WO/2018/212041A1 |
A quantum bit device according to the present invention is provided with: a first quantum bit substrate 10 that has, on the surface thereof, a first superconductive wire 13 disposed so as to have a part magnetically coupled with a first ...
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WO/2018/211766A1 |
This superconducting wire material is provided with a first wire material having a first superconducting material layer, a second wire material having a second superconducting material layer, and a joining layer. At least a portion of th...
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WO/2018/213024A1 |
A method is provided of forming a superconductor interconnect structure. The method comprises forming a dielectric layer overlying a substrate, forming an interconnect opening in the dielectric layer, and moving the substrate to a deposi...
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WO/2018/211321A1 |
A technique relates to a superconducting chip. Resonant units have resonant frequencies, and the resonant units are configured as superconducting resonators. Josephson junctions are in the resonant units, and one or more of the Josephson...
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WO/2018/211480A1 |
The sheath (3) is a material, which consists of aluminium (Al) matrix, in which nanometric aluminium oxide particles (Al203) are homogenously dispersed, wherein the content of Al2O3 is 0.25 to 5 vol.% and the balance is Al. It is preferr...
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WO/2018/211765A1 |
This superconducting wire material is provided with a first wire material containing a first superconducting material layer, a second wire material containing a second superconducting material layer, and a first superconducting material ...
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WO/2018/207727A1 |
This superconducting wire is provided with: a superconducting laminate in which a superconducting layer is formed on a tape-like substrate, with an intermediate layer being interposed therebetween; and a stabilization layer which covers ...
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WO/2018/207448A1 |
The objective of the present invention is to provide an MgB2 superconductive thin film wire material allowing for lower costs than in prior art while maintaining superconductive properties that are equal to or greater than those of the M...
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WO/2018/197426A1 |
The invention relates to a superconducting conductor element (1) comprising: - an elongated strip conductor (3) having at least one first support substrate (17a) and a first superconducting layer (19a) applied to a first surface (30) of ...
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WO/2018/190064A1 |
In order to avoid the issue of exponential increase in an expected value for calculation time relative to the magnitude of a problem, this processing method for quantum annealing calculation for solving discrete optimization problems inc...
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WO/2018/191041A1 |
Thermal management for superconducting interconnects is described. An interconnect may have a first end coupled to a superconducting system and a second end coupled to a non-superconducting system. The interconnect may include a supercon...
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WO/2018/189500A1 |
The present invention provides a process for producing a LnM2Cu3Ox high-temperature superconductive powder, the process comprising: i) providing an aqueous solution of Ln, M and Cu and at least one mineral acid; ii) adding at least one s...
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WO/2018/185306A1 |
The invention relates to a component for electric, magnetic, or optical applications, comprising at least two adjacent layers (GB1, GB2) with a common boundary region (GFB). The first layer has graphite with a Bernal crystal structure (g...
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WO/2018/176685A1 |
Disclosed is a coaxial sleeve superconducting apparatus, comprising a transfer sleeve device (1a) and a transfer inner tube (1b). The upper end of the transfer inner tube (1b) extends to the outer side of the transfer sleeve device (1a),...
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WO/2018/171823A1 |
The invention relates to a method for producing a Majorana material superconductor hybrid structure. The superconductive material is applied onto the Majorana material using a shadow mask, wherein - a first mask (2, 3) for a structured a...
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WO/2018/169433A2 |
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WO/2018/160309A1 |
One example includes a memory circuit. The memory circuit includes a memory array in which contiguous rows of the memory array are organized as a write-bypass portion that comprises a first portion of the rows and a main memory portion t...
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WO/2018/159832A1 |
A modulation circuit comprising a ring circuit having a first contact, a second contact, a third contact, and a fourth contact, wherein a first resonator circuit is connected to the first contact and the third contact, and a second reson...
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WO/2018/160187A1 |
Described herein are qubit devices having one or more Josephson Junctions which include hexagonal boron nitride (hBN) as a tunnel barrier layer provided between a base electrode layer and a top electrode layer of each Josephson Junction,...
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WO/2018/160674A1 |
Techniques for operating a mechanical oscillator as a quantum memory are described. According to some aspects, a qubit may be coupled to a piezoelectric material such that the electric field of the qubit causes stress within the piezoele...
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WO/2018/152210A1 |
A superconducting composition of matter including overlapping first and second regions. The regions comprise unit cells of a solid, the first region comprises an electrical insulator or semiconductor, and the second region comprises a me...
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WO/2018/144413A1 |
Superconducting devices with enforced directionality and related methods are provided. In one example, a device including a first Josephson junction transmission line (JTL) for propagating a first set of quantum signals in a first direct...
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WO/2018/144601A1 |
Various techniques and apparatus permit fabrication of superconductive circuits. A superconducting integrated circuit comprising a superconducting stud via, a kinetic inductor, and a capacitor may be formed. Forming a superconducting stu...
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WO/2018/122461A1 |
A superconducting junction (100) comprises: a first layer (104) and a second layer (106) of superconducting material; a tunneling layer (108) of insulating material disposed between the first layer (104) and the second layer (106) of the...
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