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WO/2022/158363A1 |
Provided is an elastic wave device capable of suppressing a lateral mode while increasing the freedom of material. An elastic wave device 1 of the present invention is provided with: a piezoelectric substrate 2 including a piezoelectri...
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WO/2022/158028A1 |
This piezoelectric vibrator is provided with a piezoelectric vibration element (10), a base member (30), and a pair of electrically conductive holding members (36a, 36b) which electrically connect a pair of connecting electrodes (16a, 16...
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WO/2022/158091A1 |
This piezoelectric oscillator comprises a piezoelectric vibrating element having an excitation electrode and a connection electrode electrically connected to the excitation electrode, a base member having an electrode pad, and a conducti...
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WO/2022/159814A1 |
An acoustic wave device includes a support substrate; a piezoelectric layer on the support substrate; a first electrode and a second electrode on the piezoelectric layer in a lamination direction of the support substrate and the piezoele...
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WO/2022/157029A2 |
Aspects of the disclosure relate to wireless communication, and high-frequency filters with resonators. One example is a frequency band filter circuit having a split resonator. The split resonator comprises a resonator including a first ...
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WO/2022/156722A1 |
The present invention provides an electronic device and a formation method therefor. A transmitting end resonance structure and a receiving end sealing cover cavity are prepared on a first wafer, and a transmitting end sealing cover cavi...
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WO/2022/158249A1 |
Provided is an elastic wave device which is unsusceptible to leaking elastic waves in a direction that is perpendicular to a lamination direction of a piezoelectric substrate. This elastic wave device 1 comprises: a piezoelectric subst...
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WO/2022/152178A1 |
Disclosed in the present invention are a filter, a duplexer, a multiplexer, and an electronic device. In the embodiments of the present invention, at least two resonators in a filter have a dual-layer bottom electrode structure, and an e...
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WO/2022/153948A1 |
Provided is an elastic wave device that can suppress a transverse mode in an arbitrary frequency range. This elastic wave device 1 comprises: a piezoelectric substrate 2 that includes a support substrate 4 and a piezoelectric body laye...
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WO/2022/153789A1 |
This circuit module (10) is provided with: a substrate (20) that has a first main surface (201); an electronic component (30) of an acoustic wave filter, said electronic component (30) being mounted on the first main surface (201); an in...
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WO/2022/153943A1 |
Provided is an elastic wave device capable of sufficiently suppressing ripples caused by Rayleigh waves. This elastic wave device has a piezoelectric layer 5 laminated directly or indirectly on a support substrate 3, and a first IDT el...
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WO/2022/150752A1 |
A strain compensated heterostructure comprising a substrate comprising silicon carbide material; a first epitaxial layer comprising single-crystal aluminum nitride material formed on a top surface of the substrate; a second epitaxial lay...
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WO/2022/149541A1 |
The piezoelectric oscillation device is equipped with at least a core (5). The core (5) includes: a crystal oscillator (50) which has a three-layer structure and in which an oscillation part (11) is hermetically sealed; and a heater IC (...
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WO/2022/145059A1 |
This film structure (10) comprises: a substrate which is an Si substrate or an SOI substrate; a buffer film which is formed on the substrate and contains ZrO2; and a piezoelectric film (11) which is formed on the buffer film. With respec...
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WO/2022/145385A1 |
Provided is a filter device less likely to experience deterioration in the amount of attenuation on a side having a higher frequency than the passband. A filter device 11 is provided with a first series arm resonator S11 provided to a ...
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WO/2022/145320A1 |
A high frequency circuit (10) is provided with a first power amplifier (21), a second power amplifier (22), a first filter element (31), a second filter element (32), a module substrate (70), and a metal member (8). The first filter elem...
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WO/2022/145412A1 |
The present invention decreases the size of a high frequency module. A high frequency module (200) is provided with a mounting substrate (9), a first electronic component (1), a second electronic component (2), and a third electronic com...
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WO/2022/145204A1 |
An electronic device (100, 100A, 100B) of the present disclosure comprises a substrate (10), a support body (40), and a conductive film (41). The substrate (10) is a piezoelectric substrate or a chemical compound semiconductor substrate ...
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WO/2022/145802A1 |
The present invention provides a surface acoustic wave resonator and a surface acoustic wave filter which can approach an ideal reflection condition with respect to surface acoustic waves even without a reflector so as to have a reduced ...
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WO/2022/145635A1 |
The present invention aims to provide a method for calculating information about characteristics of a SAW resonator by using a SAW transmission line model, and a recording medium readable by a computing device having the method recorded ...
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WO/2022/145202A1 |
An electronic device (100) comprises a substrate (10), a base substrate (20), a metal connection body (30), a support body (40), a metal body (50), and a via (60). The substrate (10) is a piezoelectric substrate or a chemical compound se...
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WO/2022/143968A1 |
Provided are a micro-electro-mechanical system (MEMS) device and method for fabrication thereof, comprising: providing a logic chip, comprising a substrate (10) and a complementary metal–oxide–semiconductor (CMOS) circuit (11) locate...
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WO/2022/145418A1 |
Provided is a high-frequency module in which isolation can be ensured between a first filter and a second filter that are capable of simultaneous communication. A high-frequency module (1) is provided with: a mounting board (16); a first...
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WO/2022/141392A1 |
A filter (100), and a method for preparing the filter (100). The filter (100) comprises: a substrate (10); a series resonator (20), wherein the series resonator (20) comprises a first Bragg reflection layer (201) and a first piezoelectri...
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WO/2022/145306A1 |
Provided is a filter device with which it is possible to realize a broadband passband and suppress the degradation of filter characteristics. This filter device (2) comprises a filter substrate (2), and a ladder-type filter (30) mounted ...
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WO/2022/145203A1 |
An electronic device (100) comprises a substrate (10), a base substrate (20), a metal connection body (30), a metal body (50), and a via (60). The substrate (10) is a piezoelectric substrate or a chemical compound semiconductor substrate...
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WO/2022/143286A1 |
Provided is a bulk acoustic resonator, comprising: a substrate (100); an acoustic mirror; a bottom electrode (130); a top electrode (140); and a single-crystal piezoelectric layer (120), which is disposed between the bottom electrode (13...
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WO/2022/144564A1 |
The present disclosure relates to Bulk Acoustic Wave, BAW, devices. In particular, the disclosure is concerned with a BAW device including at least one BAW resonator and a frame. The frame may be arranged next to or around the BAW resona...
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WO/2022/143982A1 |
Disclosed are a multiplexer, a method for improving the isolation of a multiplexer, and a communication device, wherein there is better isolation between filters in the multiplexer. The multiplexer includes two or more filters connected ...
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WO/2022/134860A1 |
Disclosed are a novel FBAR filter and a preparation method therefor. The method comprises: etching a groove in a preparation substrate; preparing a piezoelectric material and a bottom electrode in the groove, and first preparing a thin s...
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WO/2022/138552A1 |
Provided is an elastic wave device that can increase heat dissipation from a cavity part in a support member. This elastic wave device 10 comprises a support member 13 having a support substrate 16, a piezoelectric layer 14, an IDT ele...
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WO/2022/137892A1 |
A high-frequency module (1A) comprises: a module substrate (91) that has main surfaces (91a and 91b) facing one another; a transmission filter (63T) that has a base surface (63a) and a top surface (63b) facing one another, and allows hig...
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WO/2022/135252A1 |
The present invention relates to a bulk acoustic resonator and a manufacturing method therefor. The resonator comprises: a substrate, an acoustic mirror, a bottom electrode, a top electrode, a piezoelectric layer, which is arranged betwe...
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WO/2022/138739A1 |
This invention curbs the occurrence of cracking in a piezoelectric layer. This elastic wave device is provided with: a support member having a support substrate; a piezoelectric layer containing lithium niobate or lithium tantalate which...
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WO/2022/134861A1 |
Disclosed are a frequency-tunable film bulk acoustic resonator and a preparation method therefor. The resonator comprises a substrate, an air gap, a sandwiched structure formed by electrodes and piezoelectric layers, and an electrode lea...
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WO/2022/138827A1 |
Provided is a filter device that has a wider pass-band and is reduced in size. A filter device 1 of the present invention comprises a plurality of resonators including at least one series-arm resonator and at least one parallel-arm res...
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WO/2022/134195A1 |
Disclosed in the present application are a surface acoustic wave resonator and a manufacturing method therefor. The surface acoustic wave resonator comprises a piezoelectric substrate, an interdigital transducer located on a surface of t...
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WO/2022/138457A1 |
Provided is an elastic wave device that makes it possible to increase heat dissipation in configurations in which a support member includes a cavity section. The elastic wave device 10 comprises: a support member 13; a piezoelectric la...
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WO/2022/140653A1 |
An acoustic wave device includes a cavity in a substate, an overlapping region in which portions of adjacent first and second interdigitated electrodes oppose each other, a first gap region that is in between a first busbar and the overl...
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WO/2022/138514A1 |
The present invention lowers the profile of a high frequency module. A high frequency module (100) is provided with a mounting substrate (9), a first electronic component (1), and a second electronic component (2). The mounting substrate...
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WO/2022/134196A1 |
Disclosed by the present application are a thin-film bulk acoustic wave resonator, a fabrication method therefor, and a filter. The thin-film bulk acoustic wave resonator comprises: a substrate and a piezoelectric thin-film stacking stru...
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WO/2022/138328A1 |
Provided is a surface acoustic wave device whereby breakage of IDT electrodes and peeling of the IDT electrodes off from a piezoelectric layer can be suppressed. A surface acoustic wave device 10 is provided with: a support member 13; ...
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WO/2022/138140A1 |
Provided is a composite filter device which can suppress the occurrence of ripples in a pass band of another band pass filter connected in common. This composite filter device comprises: a ladder-type filter 10 having at least one seri...
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WO/2022/137624A1 |
A crystal oscillator 1 comprising: a crystal oscillation element 10 that has a crystal piece 11, excitation electrodes 14a, 14b, and connection electrodes 16a, 16b; and a substrate 30 that has a substrate body 31, substrate electrodes 33...
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WO/2022/137646A1 |
Provided is a composite substrate having excellent heat resistance while confining the energy of elastic waves in a piezoelectric layer. The composite substrate according to an embodiment of the present invention has a piezoelectric laye...
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WO/2022/138443A1 |
Provided is an elastic wave device that has a wide fractional bandwidth. An elastic wave device 1 that comprises a high acoustic velocity member 3, a low acoustic velocity layer 4 that is layered on the high acoustic velocity member 3,...
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WO/2022/131309A1 |
The present invention suppresses accumulation of heat. An elastic wave device according to the present invention is provided with: a supporting substrate; a piezoelectric layer which contains lithium niobate or lithium tantalate, while b...
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WO/2022/131133A1 |
The present invention addresses the problem of improving isolation. In this high-frequency module (100), a first electronic component (1) and a second electronic component (2) are mounted on a principal surface (91) of a mounting substra...
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WO/2022/131213A1 |
Provided is a piezoelectric vibration device in which a crystal vibrating plate (10) has a cut-out portion (10a) provided between a vibrating portion (11) and an outer frame portion (12). A metal film (28) is formed on a first major surf...
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WO/2022/130733A1 |
The present invention improves isolation between a plurality of electronic components. A high frequency module (100) comprises: a mounting substrate (10); a first electronic component (201) and a second electronic component (202); a meta...
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