Document |
Document Title |
WO/2023/110081A1 |
A surface acoustic wave resonator element (1) comprising a transducer arrangement (2)comprising an active area (3), two conductive areas (4), a first interface area (5), and a second interface area (6), each interface area extending betw...
|
WO/2023/112652A1 |
Provided is an elastic wave device with which polarization reversal can be suppressed. This elastic wave device 10 comprises: a package substrate 2 having a first principal surface 2a; and an elastic wave element chip 1 mounted on the ...
|
WO/2023/112380A1 |
Provided are a resonator and a resonating device which make it possible to suppress occurrence of a combination of main mode vibration and spurious mode vibration. A resonator 10 is provided with: a vibration unit 110 including three o...
|
WO/2023/106778A1 |
This electronic apparatus capable of transmitting or receiving wireless power comprises: a wireless power transfer (WPT) coil; and a processor operatively connected to the WPT coil, wherein the processor may: control a first ping signal ...
|
WO/2023/107987A1 |
An filter (1300) includes first and second shunt resonators (Shl,Sh2), at least one series resonator (Slx4) connected to the first and second shunt resonators in an acoustic ladder filter circuit, and a first ground contact pad (GND1). T...
|
WO/2023/108006A1 |
Acoustic resonator devices and filters are disclosed. An acoustic resonator (400) includes a substrate and a piezoelectric plate (410) having front and back surfaces, the back surface attached to the substrate. A decoupling dielectric la...
|
WO/2023/104415A1 |
Certain aspects of the present disclosure provide a filter circuit and techniques for filtering using the filter circuit. The filter circuit generally includes a first filter stage (401) having a first acoustic wave resonator (410) coupl...
|
WO/2023/106334A1 |
Provided is an acoustic wave device with which electrical characteristics can be stabilized in a configuration in which an IDT is provided within a cavity portion. An acoustic wave device 10 according to the present invention comprises...
|
WO/2023/105845A1 |
A vibration unit (110) comprises a first part (111) that is a partial area of a main surface of a substrate (50) in a plan view, and a second part (112) that is another area of the main surface of the substrate (50) in the plan view. The...
|
WO/2023/100816A1 |
Provided is a filter device that makes it possible to easily and more accurately suppress deterioration of filter properties. A filter device 1 according to the present invention comprises: a piezoelectric substrate 4 including a piezo...
|
WO/2023/102349A1 |
Methods, devices, and systems are disclosed to utilize certain types of parametric nonlinearities in some solid-state structures to achieve an energy transfer between mechanical modes of motion of distinct frequency ranges for various ty...
|
WO/2023/100608A1 |
The present invention provides an elastic wave device wherein capacitive coupling between an inductor and a member on which the inductor is provided can be suppressed. An elastic wave device 1 according to the present invention is prov...
|
WO/2023/100670A1 |
Provided is a filter device having increased heat dissipation. A filter device 10 of the present invention comprises series-arm resonators S3, a parallel-arm resonator, and an external connection terminal (ground terminal 3C). At least...
|
WO/2023/097531A1 |
The embodiments of the present application relate to the technical field of semiconductors. Provided are a bulk acoustic wave resonator, a filter and an electronic device, by means of which the performance of the filter can can improved....
|
WO/2023/100851A1 |
A piezoelectric blank of a piezoelectric vibration element according to the present invention includes a vibrating portion and a fixed portion constituting mutually different regions in a plan view. A third surface on a first side of the...
|
WO/2023/096612A1 |
The invention relates to an integrated acoustophoretic microfluidic device (EAMC) in which integrated two or more step operations to be applied to micro and/or biological particles can be performed in a single microfluidic system using t...
|
WO/2023/097182A1 |
Filter devices and methods of fabrication are disclosed. An acoustic filter device includes a substrate (720) and a piezoelectric plate (710), a first portion of the piezoelectric plate spanning a first cavity (740B) in the substrate and...
|
WO/2023/090172A1 |
Provided is an elastic wave device with which intermodulation distortion can be suppressed. The elastic wave device 1 comprises a piezoelectric layer having a crystal axis, and an IDT electrode 3 provided on the piezoelectric layer. If...
|
WO/2023/091813A1 |
Aspects of acoustic resonators and methods of manufacture of acoustic resonators are described, including acoustic resonators with thinner layers of piezoelectric material. In one example, a method of manufacturing an acoustic resonator ...
|
WO/2023/090434A1 |
To suppress a size. An elastic wave device comprises a first piezoelectric layer, a second piezoelectric layer stacked on the first piezoelectric layer in a first direction, and an IDT electrode. The IDT electrode includes a first bus ba...
|
WO/2023/090238A1 |
This multiplexer (1) comprises a shared terminal (91), an inductor (40) having one end connected to the shared terminal (91), a filter (10) connected to the other end of the inductor (40), and filters (20 and 30) connected to the shared ...
|
WO/2023/085408A1 |
Provided is an elastic wave device capable of suppressing unwanted waves at a frequency lower than and around a resonance frequency. An elastic wave device 10 according to the present invention comprises: a support member including a s...
|
WO/2023/085189A1 |
Provided is a filter device capable of reducing losses on a high-frequency region side within a passband. A filter device 1 comprises a piezoelectric substrate, and a plurality of series-arm resonators and at least one parallel-arm res...
|
WO/2023/085362A1 |
An elastic wave device 10 comprises: an elastic wave element 11; a bump 12 electrically connected to the elastic wave element 11; an underbump metal layer 13 provided between the elastic wave element 11 and the bump 12; a wiring substrat...
|
WO/2023/085368A1 |
Provided is an elastic wave device in which the functional electrode is unlikely to sustain damage. This elastic wave device 10 is equipped with: a support member 13 which includes a support substrate 16; a piezoelectric layer 14 provi...
|
WO/2023/082186A1 |
The embodiments of the present application relate to the technical field of wireless communications. Provided are a resonator and a preparation method therefor, and a filter, which can improve a quality factor of a resonator by means of ...
|
WO/2023/085210A1 |
This elastic wave device has a multilayer film, a piezoelectric film, and an IDT electrode. The multilayer film is configured by alternately layering a first layer and a second layer that has a higher acoustic impedance than that of the ...
|
WO/2023/085364A1 |
An elastic wave device 10 comprises: an elastic wave element 11; a bump 12 electrically connected to the elastic wave element 11; an underbump metal layer 13 provided between the elastic wave element 11 and the bump 12; a wiring substrat...
|
WO/2023/085348A1 |
Provided are a crystal element and a crystal device that have a further improved drive level dependency (DLD) characteristic. The crystal element comprises a crystal piece (121), and a pair of electrodes (122a, 122b) positioned on both s...
|
WO/2023/085347A1 |
Provided is an elastic wave device that can suppress unnecessary waves within the band between the resonance frequency and the anti-resonance frequency, and can reduce insertion loss. An elastic wave device 10 according to the present ...
|
WO/2023/085110A1 |
A module (100) comprises a substrate (110), a first component (120), a sealing resin (150), and a shield film (160). The substrate (110) has a first surface (111). The first component (120) is mounted on the first surface (111). The seal...
|
WO/2023/082521A1 |
The present invention belongs to the technical field of film bulk acoustic resonators. Disclosed is a method for rapidly forming a cavity structure of a micro-acoustic film resonator. The method comprises: etching a groove in a silicon s...
|
WO/2023/085238A1 |
A crystal oscillation device (Xtl) with a thermistor comprises: a package (1) including an upper accommodating portion (11A) and a lower accommodating portion (11B); a crystal oscillating plate (2) accommodated in the upper accommodating...
|
WO/2023/081769A1 |
A stacked die XBAR filter device (600) includes a first die (630) containing one or more XBARs on a first surface, a second die (640) containing one or more XBARs on a second surface, and one or more conductive vias (V1IN, V1OUT) through...
|
WO/2023/080607A1 |
Proposed is a laminated common mode filter in which a ground pattern is interposed between coil patterns to form additional capacitance. The proposed laminated common mode filter comprises: an upper electrode layer composed of a laminate...
|
WO/2023/078959A1 |
The invention relates to a compact and robust encapsulation system (1) for protection of a surface wave device. The encapsulation system (10) comprises a SAW device (3) and a sealing bead (9) which seals a second substrate (11) to the ba...
|
WO/2023/080142A1 |
Parallel arm resonators (301) include a parallel arm resonator (3011) and a parallel arm resonator (3012). The parallel arm resonators (301) are connected to a first terminal side of a serial arm resonator (201). The parallel arm resonat...
|
WO/2023/080167A1 |
Provided is a filter device that, in a configuration in which the resonant frequency of one or more of serial arm resonators is located outside a passband, can prevent a reduction in attenuation near the resonant frequency. A filter de...
|
WO/2023/074795A1 |
This module (100) comprises a substrate (110), a first component (120), and a sealing resin (150). The substrate (110) has a first surface (111). The first component (120) is mounted on the first surface (111). The sealing resin (150) se...
|
WO/2023/072540A1 |
The invention relates to a high-frequency filter device, comprising a signal input, which is designed for receiving a high-frequency signal. The high-frequency filter device also has a plurality of filter units, which are designed to fil...
|
WO/2023/070332A1 |
A filter manufacturing method and a filter, relating to the technical field of wireless communications. The filter manufacturing method comprises: providing a substrate structure (S110); manufacturing and forming a circuit structure on a...
|
WO/2023/071516A1 |
An XBAR filter (100), comprising a piezoelectric substrate (11), at least two interdigital transducers (12) formed on the piezoelectric substrate (11), and at least two insulating layers (13), wherein the insulating layers (13) and the i...
|
WO/2023/074400A1 |
Provided is a filter device in which it is possible to improve attenuation characteristics. In the filter device 1, at least two filters including first and second filters 11, 12 are configured on a piezoelectric substrate 2. A first i...
|
WO/2023/074373A1 |
In the present invention, an elastic wave resonator (10) comprises an IDT electrode (11), a first reflector (31), and a second reflector (32). The IDT electrode (11) has a plurality of comb-toothed electrode fingers (11a, 11b). The first...
|
WO/2023/070214A1 |
An example silicon MEMS resonator device includes a support structure, a resonator element with at least one associated eigenmode of vibration, at least one anchor coupling the resonator element to the support structure, at least one dri...
|
WO/2023/070457A1 |
Embodiments of the present disclosure provide a bulk acoustic wave resonator and a filter. The bulk acoustic wave resonator comprises: a piezoelectric layer; and an interdigital transducer (IDT), which is provided on the piezoelectric la...
|
WO/2023/074615A1 |
A crystal oscillator plate (1) comprises an AT-cut crystal oscillator plate, and as a whole, has a rectangular, plate-like shape. The crystal oscillator plate (1) comprises an oscillating part (11), holding parts (13, 13t) connected to t...
|
WO/2023/074616A1 |
A thermistor-mounted piezoelectric vibration device (1) is provided with a sand device (2), and a thin-plate thermistor (5) which is mounted on an outside surface of a first sealing member (20) in the sand device (2). The thin-plate ther...
|
WO/2023/074463A1 |
Provided is an elastic wave device that not only affords improved linearity but also enables miniaturization. An elastic wave device 1 has a piezoelectric film 4 directly or indirectly layered on a support substrate 2 and comprises: a ...
|
WO/2023/068506A1 |
A multi-layer flexible printed circuit board according to an embodiment of the present invention comprises: a ground electrode region comprising a ground electrode pattern arranged on one surface of the multi-layer flexible printed circu...
|