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WO/2019/011748A1 |
A MEMS sensor (1) with a media access opening (MO) in its carrier board (CB) is disclosed having an integrally filter mesh (MSH) closing the media access opening. The mesh may be applied in unstructured form over the whole surface of the...
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WO/2019/011720A1 |
A MEMS microphone is provided comprising a carrier board and a MEMS chip mounted thereon over a sound opening. A filter chip comprises a bulk material with an aperture covered and closed by a mesh. The mesh comprises a layer of the filte...
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WO/2019/004103A1 |
This method for producing a hollow structure comprises: a step for forming a sacrificial layer on a first film; a step for forming a second film on the sacrificial layer; a step for forming an etching opening that penetrates through at l...
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WO/2019/004933A1 |
Various embodiments may provide an acoustic device. The acoustic device may include a substrate, an electrically conductive first membrane, a first spacer holding the first membrane to form a first acoustic chamber between the substrate ...
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WO/2018/237267A1 |
Aspects of the technology described herein relate to ultrasound circuits that employ a differential ultrasonic transducer element, such as a differential micromachined ultrasonic transducer (MUT) element. The differential ultrasonic tran...
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WO/2018/234132A1 |
The invention relates to an in-ear receiver (1), in particular a headset and/or hearing aid, comprising a housing (2) that has at least one ear channel portion (3) which is inserted into an ear canal (10) of a wearer when the in-ear rece...
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WO/2018/223389A1 |
A MEMS microphone, a manufacturing method thereof and an electronic apparatus are disclosed. The MEMS microphone comprises: a MEMS microphone device including a MEMS microphone chip and a mesh membrane (402) monolithically integrated wit...
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WO/2018/226731A1 |
A MEMS microphone system with encapsulated movable electrode is provided. The MEMS microphone system comprises a MEMS sensor having an access channel, a plug, and first and second members. The access channel configured to receive the plu...
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WO/2018/220345A1 |
The application describes MEMS transducers having a patterned membrane electrode which incorporates a plurality of openings or voids. At least a portion of the peripheral edge of the opening is provided with a plurality of discontinuitie...
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WO/2018/220344A1 |
The application describes MEMS transducers having a patterned membrane electrode which incorporates a plurality of openings or voids. A conductive element is provided on the surface of the underlying membrane within the opening.
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WO/2018/215669A2 |
A micromechanical acoustic transducer comprises, according to a first aspect, a first bender transducer with a free end and a second bender transducer with a free end which are situated in a common plane, wherein the free end of the firs...
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WO/2018/213781A1 |
Provided is an energy harvesting system, including: a first electrode; a second electrode; a non-metalized mono-charged electret diaphragm disposed between the first and second electrodes; a base; a spring extending between the base and ...
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WO/2018/209727A1 |
Disclosed in the present invention is a microelectromechanical systems (MEMS) microphone, comprising a substrate and a diaphragm and a back pole that are positioned above the substrate. A plurality of comb tooth parts are formed at the e...
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WO/2018/201471A1 |
A MEMS microphone, comprising a packaging structure that is enveloped by a PCB substrate (1) and a housing (2), wherein the packaging structure is provided with a MEMS acoustoelectric chip (3) therein, and the PCB substrate (1) is provid...
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WO/2018/197838A1 |
The application describes MEMS devices and associated methods of fabrication. The MEMS devices comprise a filter configured and arranged to inhibit the entry of particles into at least a region of the interior of the substrate cavity fro...
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WO/2018/197836A1 |
The present disclosure describes techniques for altering the epoxy wettability of a surface of a MEMS device. Particularly applicable to flip-chip bonding arrangements in which a top surface of a MEMS device is adhered to a package subst...
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WO/2018/199554A1 |
The present invention relates to a microphone having a rigid backplate structure and a method for manufacturing the same. The microphone comprises a membrane comprising a driving electrode and a backplate comprising a fixed electrode. Th...
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WO/2018/195230A1 |
Briefly, in accordance with one or more embodiments, an electrostatic acoustic transducer comprises a substrate comprising a first material to function as a first electrode, a dielectric layer coupled with the first material, wherein the...
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WO/2018/178637A1 |
This application describes an apparatus (300) for monitoring for blockage of an acoustic (1 10) port of a microphone device (100). The apparatus has a spectrum peak detect block (301) for receiving a microphone signal (SMIC) and determin...
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WO/2018/178638A1 |
This application relates to transducer apparatus (300, 400), especially for MEMS capacitive transducers. The apparatus has a voltage bias generator (102) for receiving a supply voltage (VDD) and generating a bias voltage (VB) for biasing...
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WO/2018/177816A1 |
It is proposed to integrate a temperature-sensing element in or on the ASIC die of a MEMS microphone to enable an audio mode and a temperature-sensing mode in parallel. A method for easily switching between these two modes and for output...
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WO/2018/178639A1 |
This application relates to an apparatus (300) for monitoring an operating temperature condition of a microphone device (100) having an acoustic port (1 10). The apparatus includes a spectrum peak detect block (301) for receiving a micro...
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WO/2018/172741A1 |
The application relates to MEMS microphone transducers having a vent structure provided in the membrane layer and an opening formed at the vent structure for tuning the frequency response of the microphone.
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WO/2018/172756A1 |
A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within t...
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WO/2018/175159A1 |
An electronic device with directional MEMS microphone assembly is provided, including a MEMS microphone capsule with a PCB affixed thereto, and a housing affixed to the PCB. The microphone assembly includes a first internal port and a se...
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WO/2018/167272A1 |
The invention relates to an amplifier unit (1) for a MEMS sound converter (2), which is operable as a microphone and as a loudspeaker, having at least one audio amplifier (3) for sound reproduction and/or sound recording. According to th...
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WO/2018/166777A1 |
The microphone comprises a housing (1, 2), which has an inner volume (12) filled with a gas, an opening (10) of the housing, an acoustic sensor (3) arranged in the housing, a diaphragm (13) of the acoustic sensor located above the openin...
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WO/2018/162263A1 |
A surface mountable condenser microphone (1) comprising a diaphragm (7) spaced by a spacer from a conductive capacitor layer (14), which is arranged on a surface of a back plate (15), wherein the back plate (15) is realized by a ceramic ...
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WO/2018/154324A1 |
This application relates to methods and apparatus for operating MEMS sensors, in particular MEMS capacitive sensors (CMEMS) such as a microphones. An amplifier apparatus (300) is arranged to amplify an input signal (VINP) received at a s...
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WO/2018/137275A1 |
Disclosed is an MEMS microphone, comprising a substrate having a back cavity; the substrate is provided with a plate capacitor structure constituted by a vibrating diaphragm, a back electrode, and a support portion; a pressure relief dev...
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WO/2018/134568A1 |
There is provided a MEMS microphone as a microelectromechanical transducer comprising a flexible membrane, the flexible membrane comprising an electromagnetic waveguide. There is further provided a microelectromechanical system comprisin...
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WO/2018/136079A1 |
In some examples, an acoustic input device includes a housing comprising a plurality of acoustic ports, and a plurality of single-port acoustic transducers within the housing to receive respective acoustic waves from an environment outsi...
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WO/2018/128673A1 |
An improved compact electroacoustic transducer and loudspeaker system. The electroacoustic transducer (or array of electroacoustic transducers) can generate the desired sound by the use of pressurized airflow. The electroacoustic transdu...
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WO/2018/129562A1 |
An integrated transparent ultrasonic audio speaker and touchscreen panel, includes a first transparent layer comprising a first base layer and a first conductive layer; and a second transparent layer disposed adjacent the first transpare...
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WO/2018/128072A1 |
The present invention provides a capacitive micromachined ultrasonic transducer (CMUT) capable of achieving both high frequency vibration of a membrane and low voltage operation. The CMUT has: a lower electrode (12) formed on a substrate...
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WO/2018/126832A1 |
Disclosed are a condenser microphone with mutually switched bi-directional and non-directional functions, and an electronic device, which relate to the technical field of microphone structures. In the condenser microphone and the electro...
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WO/2018/121701A1 |
An electrostatic speaker structure, comprising a tensioned diaphragm and two plates with openings, a conductive electrode layer being formed on both plates, characterized in that: the plate comprises a metal mesh grid and a ring-shaped r...
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WO/2018/125839A1 |
A microelectromechanical system (MEMS) includes a diaphragm with a first surface and a second surface. The first surface is exposed to an environmental pressure. The second surface comprises a plurality of fingers extending from the seco...
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WO/2018/117525A1 |
Disclosed is an audio reception apparatus utilizing a current converter, the audio reception apparatus being capable of converting current corresponding to an audio signal outputted by a microphone to voltage, and of eliminating noise co...
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WO/2018/110878A1 |
The present invention relates to a microphone having a horizontal tensile structure and a method for manufacturing the microphone, comprises a membrane comprising a driving electrode and a back plate comprising a fixed electrode, and the...
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WO/2018/108754A1 |
The present invention relates to an acoustic microelectronic device comprising a carrier (1), a set of at least one membrane (3) suspended on one side (21) of the carrier (1) above a cavity via an anchoring zone (31), and at least one ac...
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WO/2018/108482A1 |
The invention relates to a MEMS microphone having good acoustic properties and a reduced failure probability due to faulty electrical connections. For this purpose, the microphone has a channel that connects a sound opening to a MEMS chi...
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WO/2018/106513A1 |
A microelectromechanical system (MEMS) device includes at least one substrate, a lid, a MEMS component, a sensor, and a power supply. The lid is coupled to the substrate so that the substrate and the lid cooperatively define an interior ...
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WO/2018/103208A1 |
Disclosed in the present invention are an MEMS microphone chip, and MEMS microphone. The microphone chip comprises a substrate, a back electrode, and a vibration diaphragm. The back electrode and vibration diaphragm respectively form two...
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WO/2018/106514A1 |
This disclosure provides methods, systems, and apparatuses, for a microelectromechanical (MEMS) acoustic microphone circuit. In particular, the circuit includes a high pass filter formed by a combination of a capacitive microphone and a ...
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WO/2018/102293A1 |
A MEMS may include a backplate comprising first and second electrodes electrically isolated from one another and mechanically coupled to the backplate in a fixed relationship relative to the backplate, and a diaphragm configured to mecha...
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WO/2018/100373A1 |
A MEMS transducer comprising: a flexible membrane, the flexible membrane comprising a first membrane electrode; a back plate, the back plate comprising a first back plate electrode; wherein the back plate is supported in a spaced relatio...
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WO/2018/102291A1 |
A MEMS microphone may include a backplate comprising first and second electrodes electrically isolated from one another and mechanically coupled to the backplate in a fixed relationship relative to the backplate and a diaphragm configure...
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WO/2018/094963A1 |
Provided are a micro-silicon microphone and a manufacturing method thereof for solving a technical problem in which sensitivity and a manufacturing process of a micro-silicon microphone are affected by stress of the micro-silicon microph...
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WO/2018/097086A1 |
Provided is an electrostatic type transducer (1) in which an electrostatic type unit (10) is formed so as to be flat and wound into a roll, from a first laminate sheet (110) and a second laminate sheet (120). The first laminate sheet (11...
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