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WO/2023/185445A1 |
The present application relates to a differential capacitive MEMS microphone and a manufacturing method therefor. The microphone comprises: a substrate (110) comprising a second backplane (112); a first support layer (124) provided on th...
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WO/2023/185106A1 |
A micro-electro-mechanical system microphone and an electronic device. The micro-electro-mechanical system microphone comprises a substrate, a diaphragm and a back electrode plate. The diaphragm has a fixed portion and a suspension porti...
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WO/2023/177057A1 |
A multi-frequency capacitive micromachined ultrasonic transducer and a manufacturing method therefor are disclosed. The ultrasonic transducer according to various embodiments may comprise: a first transducer cell for outputting an ultras...
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WO/2023/166942A1 |
A MEMS element according to the present invention comprises: a substrate (1) provided with a back chamber (9); a vibration film (3) that includes a movable electrode and that is joined to the top of the substrate (1); and a back plate (7...
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WO/2023/160974A1 |
The invention relates to a loud speaker and a method, wherein the loudspeaker (100) comprises a rolled actuator (101) having a wound film composite (102), wherein the film composite comprises a first layer and a second layer, each having...
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WO/2023/160719A1 |
A vibration sensor, an electronic device, and a vibration detection method. The vibration sensor comprises a circuit board assembly, a housing, a chip assembly, a vibration pickup assembly, and a through hole. A back cavity is formed in ...
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WO/2023/161469A1 |
One aspect of the invention relates to a MEMS converter which comprises a vibratable membrane for generating or receiving pressure waves in a vertical emission direction. The vibratable membrane is held by a support and has vertical sect...
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WO/2023/162019A1 |
Provided is a MEMS element. A backplate (7) that includes a fixed electrode (5) and a vibrating membrane (3) which includes a movable electrode are disposed on a substrate (1) provided with a back chamber (9) so as to face one another wi...
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WO/2023/161113A1 |
In a first aspect, the invention relates to a MEMS microphone for detecting acoustic signals. The MEMS microphone has a vibratable microphone diaphragm which is excited to vibrate by sound waves which pass through a sound entry opening. ...
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WO/2023/152559A1 |
The present disclosure provides a Capacitive Micromachined Ultrasound Transducer cell, comprising a membrane (203, 303, 403), a substrate (204, 304, 404), a top electrode (201, 301, 401) in contact with the membrane (203, 303, 403), a bo...
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WO/2023/149541A1 |
This acoustic element comprises: a first electrode base (12); a second electrode base (11) facing the first electrode base; first electrode-side protrusions (12aq-1, 12aq, 12aq+1, ...) provided on the first electrode base and having a fi...
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WO/2023/144366A1 |
The present invention relates to a vibration sensor comprising a pressure detecting arrangement for detecting generated pressure variations, wherein the pressure detecting arrangement comprises a MEMS die and a signal processor, wherein ...
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WO/2023/144365A1 |
The present invention relates to vibration sensor comprising a pressure detecting arrangement for detecting generated pressure variations, wherein the pressure detecting arrangement comprises a MEMS die and a signal processor, wherein th...
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WO/2023/134861A1 |
This invention relates to an apparatus for differentially driving an electrostatic drive unit of a microelectromechanical sound-generating device implemented in a microelectromechanical system (MEMS). The drive unit has a movable element...
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WO/2023/119710A1 |
Provided is an electrostatic induction type vibration element that suppresses contact between interdigitated electrodes and that can withstand external impacts. Specifically provided is an electrostatic induction type vibration element h...
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WO/2023/122044A1 |
Embodiments for constant charge or capacitance for capacitive micro-electro-mechanical system (MEMS) sensors are presented herein. A MEMS device comprises a sense element circuit comprising a bias resistance, a charge-pump, and a capacit...
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WO/2023/116864A1 |
A bone voiceprint sensor, comprising a housing, a PCB and a built-in assembly. A closed cavity is formed between the housing and the PCB. The built-in assembly is arranged in the closed cavity. The built-in assembly comprises a base, a v...
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WO/2023/120354A1 |
This ceramic substrate comprises: at least one first layer having a first through-hole; and at least one second layer positioned to be superposed on the first layer. The second layer has a plurality of second through-holes each having a ...
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WO/2023/071600A9 |
Embodiments of the present application provide an electronic device, which may comprise: a shell, and a circuit board disposed in the shell, a pickup hole penetrating through an inside and an outside of the shell being formed on the shel...
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WO/2023/105871A1 |
This electroacoustic converter 2 comprises a casing 20, a partition member 30 disposed inside the casing 20, a first electroacoustic conversion unit 100, and a second electroacoustic conversion unit 200. The first electroacoustic convers...
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WO/2023/097377A1 |
A system comprising sound wave sensors for high fidelity sound wave detection from any 3D directions and identification of 3D coordinates of sound sources, means to separate the sound emanations of each sound source with good to high fid...
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WO/2023/089607A1 |
Operating an electrostatic acoustic device simultaneously as a speaker and as a microphone. The electrostatic acoustic device includes a membrane and an electrode disposed proximate to the membrane. An input varying audio signal is input...
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WO/2023/087647A1 |
An MEMS microphone and a manufacturing method therefor. The MEMS microphone comprises: a substrate (110); a backplate (130) arranged on the substrate (110); a plurality of support columns (144) arranged on the substrate (110); and a diap...
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WO/2023/078212A1 |
An electrostatic micro-electro-mechanical system transducer, a manufacturing method, and an electronic device. The electrostatic micro-electro-mechanical system transducer comprises: a first electrode (36); a second electrode (32) relati...
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WO/2023/078137A1 |
Provided in the present invention are a preparation method for a groove having an arc-shaped base angle, and a preparation method for a MEMS microphone. A groove pattern in a photoresist layer can be accurately copied, by means of a plas...
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WO/2023/071960A1 |
Provided in the present application is a sound collection method for a microphone. A microphone comprises a laser self-mixing apparatus and a vibrating diaphragm apparatus, wherein the vibrating diaphragm apparatus comprises a diaphragm,...
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WO/2023/073024A1 |
A loudspeaker device (200) is provided. The loudspeaker device (200) comprises a micro-electromechanical unit (100). The micro-electromechanical unit (100) comprises a diaphragm (10) having a planar extension. The diaphragm (10) comprise...
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WO/2023/075756A1 |
An ultrasound device for use with various types of imaging. In some embodiments, the ultrasound device may comprise a circuitry substrate and a plurality of transducer chips coupled to the circuitry substrate. In some embodiments, each t...
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WO/2023/066630A1 |
The present invention relates to a microfluidic device, a corresponding assembly, and a corresponding operating method. The microfluidic device is provided with: a substrate (S) having a front side (VS) and a rear side (RS) and a rear si...
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WO/2023/067965A1 |
[Problem] To provide an acoustic induction-type semiconductor element and an acoustic element integrated circuit that can exhibit a high sensitivity even in a case of making the element size smaller. [Solution] This acoustic induction-ty...
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WO/2023/066324A1 |
Disclosed in the present application are a microphone structure, a packaging structure, and an electronic apparatus. The microphone structure comprises a base component and a functional assembly, wherein the base component is provided wi...
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WO/2023/061444A1 |
Disclosed are a micro-electromechanical system (MEMS) structure and an MEMS microphone comprising same. The MEMS structure comprises a back plate; and a diaphragm located on one side of the back plate, wherein the diaphragm and the back ...
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WO/2023/047417A1 |
A method for designing a low voltage capacitive micromachined ultrasonic transducer (CMUT) is provided. The method includes starting from a base silicon wafer includes starting with a N-type Silicon Wafer and growing base oxide by patter...
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WO/2023/047096A1 |
An electrostatic transducer (200) comprises first and second flexible conductive membranes (204, 206); and first and second conductive stators (208, 210). The membranes (204, 206) and the stators (208, 210) are assembled in a layered con...
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WO/2023/047097A1 |
An electrostatic transducer (200) comprises first and second flexible conductive membranes (204, 206); and first and second conductive stators (208, 210). The membranes (204, 206) and the stators (208, 210) are assembled in a layered con...
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WO/2023/015486A1 |
Provided in the present disclosure is a microphone. The microphone may comprise at least one acoustoelectric converter and an acoustic structure. The acoustoelectric converter may be used for converting a sound signal into an electrical ...
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WO/2023/015485A1 |
Disclosed in the present application is a microphone, comprising: a housing structure and a vibration pickup portion, the vibration pickup portion generating vibrations in response to vibrations of the housing structure; a vibration tran...
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WO/2023/015478A1 |
Disclosed in the embodiments of the present description is a vibration sensing apparatus, comprising: an acoustic transducer; and a vibration assembly, which is connected to the acoustic transducer, wherein the vibration assembly is conf...
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WO/2023/005952A1 |
The present disclosure discloses a micro-electromechanical system microphone, a microphone body, and an electronic device. The micro-electromechanical system microphone comprises: a substrate; a back electret which comprises a support st...
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WO/2023/004008A1 |
An outdoor speaker system including a housing configured to accommodate a speaker unit, a top panel, a bottom panel, a front panel, and at least one side panel. The housing is encased by the top, bottom, front, and at least one side pane...
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WO/2023/282270A1 |
The purpose of the present invention is to provide a laminate obtained by stacking an organopolysiloxane cured film that is a dielectric layer and an electrode layer/substrate layer, wherein the adhesion of an interface of the cured film...
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WO/2022/266783A1 |
Disclosed is a piezoelectric MEMS actuator, comprising one or more execution units. Each of the execution units comprises: a silicon thin film; a first piezoelectric layer and a first electrode structure located on a first surface of the...
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WO/2022/262177A1 |
Provided in the embodiments of the present description are a vibration sensor, comprising an acoustic transducer and a vibration assembly, the vibration assembly being connected to the acoustic transducer, and the vibration assembly bein...
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WO/2022/262226A1 |
One or more of the embodiments of the present specification relate to a vibration sensor. The vibration sensor comprises: a vibration assembly, the vibration assembly comprising a mass element and an elastic element, and the mass element...
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WO/2022/262176A1 |
One or more embodiments of the description relate to a vibration sensor. The vibration sensor comprises: a vibration assembly, the vibration assembly comprising a mass element and an elastic element, and the mass element being connected ...
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WO/2022/258498A1 |
The present invention relates to a system for monitoring user presence relative to an electronic device, and related method and computer implemented software. The electronic device including at least one acoustic transducer being configu...
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WO/2022/258574A1 |
:A system is disclosed for monitoring pollination of plants carrying one or more flowers. The system comprises a plurality of microphones for monitoring an area comprising said one or more flowers. Each microphone out of the plurality of...
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WO/2022/252178A1 |
Disclosed are a fin structure speaker and a method for forming same. The fin structure speaker comprises a surrounding frame and a plurality of speaker fins located in the surrounding frame. Each speaker fin comprises: a fin substrate; a...
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WO/2022/242101A1 |
Provided in the present application are a vibration diaphragm control circuit, a vibration diaphragm control method, a chip and an electronic device. The vibration diaphragm control circuit comprises: N input signal transmission circuits...
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WO/2022/240878A1 |
Illustrative embodiments enable a MEMS transducer to quickly recover from, acoustic overload events by quickly resetting signal processing circuitry downstream from a MEMS transducer. An acoustic overload sensor detects occurrence of an ...
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