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WO/2022/235884A1 |
An acoustic resonator device is formed using sacrificial polysilicon pillar by forming a polysilicon pillar on a substrate and depositing a dielectric layer to bury the polysilicon pillar and planarizing the surface of the dielectric lay...
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WO/2022/227383A1 |
A sound production method and structure which amplify amplitude by utilizing hydraulic transmission. Amplitude amplification is achieved by means of the non-compressibility of liquid volume of the hydraulic transmission and an inverse pr...
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WO/2022/222315A1 |
A sensing device (600), comprising a sensor (610) that is used for converting sound signals into electrical signals, the sensor (610) having a first resonant frequency; and a resonance system, the resonance system comprising a vibration ...
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WO/2022/217402A1 |
Provided in the present invention are an MEMS loudspeaker and a manufacturing method therefor, and an electronic device. The MEMS loudspeaker has better performance. An actuator of the loudspeaker is provided with a plurality of strip-sh...
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WO/2022/217403A1 |
An MEMS speaker and an electronic device. The MEMS speaker has better performance. The MEMS speaker has an upper bottom surface (C2) and a lower bottom surface (C1) parallel to each other with a side wall (D1) therebetween; one or more o...
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WO/2022/201316A1 |
The present invention provides a MEMS device including: a substrate 1 having an opening 1a; a vibrating membrane 3 formed on the substrate 1 via an insulating film 2, a slit 3a being intermittently formed along an edge in the peripheral ...
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WO/2022/202726A1 |
A sensor element comprising: a support (10) having a recess portion (10a) formed therein; and a sensing portion (30) disposed on the support (10) and having a floating region (21b) configured by the recess portion (10a). The sensing port...
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WO/2022/194880A1 |
Embodiments of the present disclosure describe MEMS sound transducers for generating sound, comprising an actuator which is separated from a surrounding structure by one or more gaps and is designed to perform a relative movement between...
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WO/2022/192840A1 |
A method of designing and forming at least one element of an acoustic transducer. The method includes receiving one or more required operating parameters of the at least one element of the acoustic transducer for an application, iterativ...
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WO/2022/183824A1 |
The present disclosure relates to a micro-electro-mechanical system microphone and an electronic device. The micro-electro-mechanical system microphone comprises: an upper housing; a base, comprising a sound hole and forming a housing of...
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WO/2022/183828A1 |
Provided are an MEMS sensor and an electronic device. The MEMS sensor (100) comprises: a vibrating diaphragm layer (10), which comprises a fixing portion (11) and a sensitive portion (12) capable of vibrating relative to the fixing porti...
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WO/2022/183157A1 |
A microphone assembly (100) comprising a housing (107), a single flexible diaphragm (101), and a rigid backplate (102). The backplate (102) is coated with a parylene configured to help reduce the flatness deviation of the backplate (102)...
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WO/2022/173566A1 |
A microelectromechanical system (MEMS) microphone includes a cavity to receive an acoustic signal. The acoustic signal causes movement of a diaphragm relative to one or more other surfaces, which in turn results in an electrical signal r...
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WO/2022/173372A1 |
An electro-acoustic transducer (100, 300, 405, 500, 530, 560) is disclosed. The electro-acoustic transducer comprises a membrane (105, 305, 515, 575), a magnet (115, 315), a substrate (140, 340) and at least one optical device (145a-d, 3...
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WO/2022/173371A1 |
An electro-acoustic transducer (100, 300, 405, 500, 530, 560) is disclosed. The electro-acoustic transducer comprises a membrane (105, 305, 515, 575), a magnet (115, 315) and at least one laser (145a-d, 345a-d, 505a-b, 510a-b, 535a-b, 54...
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WO/2022/169355A1 |
An amplifier for a dual backplate MEMS microphone (1) comprising at least a first source follower (6) which has a gate for connection to a first backplate (2) of the dual backplate MEMS microphone (1), and a load circuit(10) connected to...
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WO/2022/164521A1 |
A device includes a micro-electromechanical system (MEMS) element configured to sense acoustic signals. The device also includes a circuitry configured to enable the microphone element to sense the acoustic signals. The circuitry is furt...
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WO/2022/161945A1 |
The present invention relates to a sound and vibration sensor comprising pressure generating arrangement adapted to generate pressure variations in a first and a second rear volume in response to vibrations of the sound and vibration sen...
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WO/2022/157254A1 |
A loudspeaker system (10) comprises: - a transducer (20), which is designed to convert an electrical signal into sound waves and which has a clamped diaphragm (30), which diaphragm is designed to be deflected by means of the electrical s...
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WO/2022/156329A1 |
The present application discloses a sensing chip and a MEMS sensor. The sensing chip comprises: a back electrode, the back electrode being provided with protrusions protruding from the surface of the back electrode; and a diaphragm, the ...
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WO/2022/156200A1 |
The present invention relates to a differential-capacitance type MEMS microphone and a manufacturing method therefor. The microphone comprises: a first diaphragm; a first back plate, disposed above the first diaphragm; a second back plat...
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WO/2022/155384A1 |
In one embodiment of an audio system, a transducer can be coupled to a passive acoustic directional amplifier to provide various benefits and improvements, including improvements to: speech intelligibility, signal-to-noise ratio, effecti...
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WO/2022/149486A1 |
[Problem] To provide an ultrasound device, an impedance matching layer, and an electrostatic drive device for achieving a sheet-shaped airborne ultrasound device that is high-output and high-efficiency and can also be made to be transpar...
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WO/2022/142507A1 |
The present invention relates to an MEMS microphone and a diaphragm structure thereof. The diaphragm structure comprises: a first diaphragm made of a conductive material, with an edge of the first diaphragm being connected to a support l...
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WO/2022/141571A1 |
Provided is an acoustic transducer, comprising a base, a fixed member, a movable member, a first electrode and a second electrode, wherein the base is provided with a cavity and comprises a first surface arranged towards the cavity; the ...
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WO/2022/140921A1 |
A vibration sensor (100), comprising: a housing structure (110,510,610,710,810,910,1010,1110,1510,1710) and an acoustic transducer (120,520,620,720,820,920,1020,1120,1220,1320,1420,1520,1720)
which is physically connected to the housing...
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WO/2022/142291A1 |
A vibration sensor (100, 200, 600, 700, 800, 900, 1100, 1200), comprising: a vibration receiver (110, 210, 710, 810, 910, 1110, 1210), comprising a housing (211, 611, 711, 811, 911, 1111, 1211) and a vibration unit (212, 612, 712, 812, 9...
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WO/2022/144801A1 |
Some demonstrative embodiments include apparatuses, systems and/or methods of testing an acoustic device, an acoustic component, and/or a device or system including one or more acoustic devices. For example, an acoustic device tester may...
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WO/2022/135004A1 |
Disclosed by the present application are a capacitive sensor chip, sensor, and electronic device. The capacitive sensor chip comprises: a substrate; a diaphragm, said diaphragm being disposed on the surface of said substrate; a back elec...
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WO/2022/135003A1 |
Disclosed are an MEMS sensor chip, a microphone and an electronic device. The MEMS sensor chip comprises a substrate, an induction assembly and an annular protective layer, wherein the substrate has a cavity; the induction assembly compr...
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WO/2022/135213A1 |
The present application discloses an MEMS sensor chip, a microphone and an electronic device. The MEMS sensor chip comprises a substrate, a sensing assembly and an annular protective layer; the sensing assembly comprises a first annular ...
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WO/2022/127540A1 |
Disclosed are an MEMS chip, an MEMS microphone, and an electronic device. The MEMS chip comprises a substrate, a capacitor structure and a connecting piece. One side of the substrate is provided with a first insulating layer, the substra...
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WO/2022/131818A1 |
An electronic device is provided. The electronic device comprises: a printed circuit board having a plurality of printed circuit boards stacked thereon, and including a hole penetrating the plurality of printed circuit boards; a micropho...
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WO/2022/121882A1 |
Disclosed in the present application is an electronic device, comprising: a housing; a display module, the display module and the housing enclosing to form an accommodating cavity; and a sensing module, which is located in the accommodat...
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WO/2022/116644A1 |
The present application relates to the technical field of terminals, and provides an anti-vibration sound reception device, a terminal, a signal processing method and a signal processing module. The device comprises a base plate, a cover...
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WO/2022/117197A1 |
The invention relates to a MEMS component comprising a layer stack having a plurality of MEMS layers arranged in a layer sequence direction. The MEMS component comprises a movable element which is formed in a first MEMS layer and is arra...
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WO/2022/110415A1 |
Provided in the present application is a MEMS microphone chip, comprising a base having a back cavity, a diaphragm provided on the base, and a backplane covering the diaphragm and having an inner cavity spaced apart from the diaphragm, w...
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WO/2022/110416A1 |
Provided in the present application is a piezoelectric MEMS microphone, comprising at least one piezoelectric MEMS unit, the piezoelectric MEMS unit comprising a substrate, the substrate comprising an annular peripheral wall enclosing an...
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WO/2022/110270A1 |
Provided is an MEMS microphone chip. The MEMS microphone chip comprises a base having a back cavity, and a capacitor structure arranged on the base, wherein the capacitor structure comprises a vibrating diaphragm fixed to the base, and a...
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WO/2022/110397A1 |
Provided by the present application are a silicon microphone and a processing method therefor. The silicon microphone comprises a base formed with a back cavity, a diaphragm, and a back plate. Through holes are provided in the back plate...
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WO/2022/110421A1 |
The present application relates to the technical field of microphones, and in particular relate to a MEMS microphone and a working control method therefor. The MEMS microphone comprises a first MEMS microphone unit, a second MEMS microph...
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WO/2022/110420A1 |
Provided are a piezoelectric MEMS microphone, and an array thereof and a preparation method therefor. The piezoelectric MEMS microphone comprises a substrate having a back cavity, and a piezoelectric vibrating diaphragm fixed on the subs...
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WO/2022/110442A1 |
The present application provides a piezoelectric MEMS microphone, comprising at least one piezoelectric MEMS unit. The piezoelectric MEMS unit comprises: a substrate, which comprises an annular peripheral wall defining an accommodation c...
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WO/2022/104864A1 |
The utility model provides an MEMS microphone, comprising a first circuit board, a frame provided on the first circuit board, and a second circuit board provided on the frame, wherein the first circuit board, the frame and the second cir...
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WO/2022/104932A1 |
Provided is a piezoelectric microphone, comprising: a substrate having an accommodation cavity; and a cantilever beam fixed to the substrate. The cantilever beam comprises a fixed portion fixed at the substrate and a free portion extendi...
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WO/2022/105007A1 |
A MEMS microphone chip, the MEMS microphone chip comprising a substrate having a rear cavity, a diaphragm disposed on the substrate, and a back plate covering the diaphragm and having an inner cavity an an interval from the diaphragm. Th...
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WO/2022/104930A1 |
A MEMS sensor (100), and a metal lead (40) electrically connecting a MEMS chip (20) and an ASIC chip (30). The metal lead (40) comprises a first solder joint (41) provided on the MEMS chip (20), a first extension portion (43) extending f...
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WO/2022/104931A1 |
A MEMS microphone chip, comprising a substrate having a rear cavity, a diaphragm disposed at an interval from the substrate, and a back plate disposed on the side of the diaphragm away from the substrate. A cavity in communication with t...
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WO/2022/099537A1 |
Disclosed in the present invention is a microelectromechanical system (MEMS) ultrasonic transducer-based miniature loudspeaker, comprising: a single or a plurality of MEMS ultrasonic transducers, configured to send an ultrasonic pulse or...
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WO/2022/100551A1 |
The present invention provides an MEMS piezoelectric microspeaker, a microspeaker unit, and an electronic device. The MEMS piezoelectric microspeaker comprises: an MEMS piezoelectric actuator for generating a speaker sound wave; and a mi...
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