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WO/2022/006816A1 |
The present invention provides an MEMS piezoelectric loudspeaker, comprising a load plate and an actuator. The load plate is polygonal, circular or elliptical. Each branch of the actuator is strip-shaped and is arranged along an extendin...
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WO/2022/007191A1 |
Provided in the present invention is a method for fabricating a loudspeaker. The method comprises the following steps: step S1, etching a piston connecting rod and a first cavity; step S2, depositing a support layer; step S3, surface pla...
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WO/2022/005837A1 |
An image capture device is equipped with a microphone assembly that eliminates the need for a complex drain channel that facilitates water flow away from a microphone after submersion. The image capture device includes a housing, a micro...
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WO/2022/000853A1 |
The utility model provides a vibration sensor, comprising: a circuit board having a receiving cavity and being provided with a through hole; a housing cover being fixed to the circuit board in a covering manner and covering the through h...
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WO/2022/000599A1 |
Provided in the present invention is an MEMS microphone chip. Said chip comprises a base having a back cavity formed in the middle, a vibrating diaphragm provided on the base, and a back plate provided on the side of the vibrating diaphr...
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WO/2022/000630A1 |
The present application provides a vibration sensor and an audio device having same. The vibration sensor comprises: a circuit board assembly, comprising a bottom wall and a side wall extending from the bottom wall; a housing covering th...
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WO/2022/000794A1 |
Disclosed is a vibration sensor, the vibration sensor comprising a circuit board, an inner housing, an outer housing, a MEMS microphone and a vibrating diaphragm assembly. The circuit board is provided with a board cavity and a first thr...
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WO/2022/000644A1 |
Provided is a microphone, comprising a protective structure having an accommodation space and an ASIC chip and MEMS chip accommodated in the protective structure. A sound hole penetrates the protective structure. The protective structure...
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WO/2022/000793A1 |
The present utility model provides a vibration sensor, comprising a circuit board, a housing, a vibration assembly and an MEMS microphone; the vibration assembly comprises a gasket, a diaphragm and a mass block; the gasket, the diaphragm...
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WO/2022/000792A1 |
Provided in the present application is a vibration sensor, comprising a circuit board, an outer shell fixed on the circuit board and with the circuit board enclosing an accommodating cavity, a diaphragm assembly accommodated in the accom...
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WO/2022/000852A1 |
The present utility model provides a vibration sensor. The vibration sensor comprises: a circuit board having a resonant cavity, one side of the circuit board being provided with a through hole penetrating through the circuit board; a ho...
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WO/2022/000791A1 |
The present utility model provides a vibration sensor. The vibration sensor comprises a circuit board, a housing which is fixed to the circuit board in a covering manner and defines a resonant cavity together with the circuit board, an M...
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WO/2022/000636A1 |
Provided is a piezoelectric ultrasonic transducer comprising: a substrate, and a diaphragm arranged facing the substrate at an interval, wherein the diaphragm comprises a first surface close to the substrate, and a second surface away fr...
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WO/2021/258464A1 |
A transducer (10), comprising a first housing (100), a second housing (200), a connecting member (300), an annular member (400), a first capacitor structure (600), and a second capacitor structure (800). The annular member (400), the fir...
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WO/2021/258478A1 |
Disclosed in the present application is a transducer. The transducer comprises: a first housing, a second housing, a connecting member, an annular member, a first capacitance structure and a second capacitance structure, wherein an inner...
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WO/2021/253501A1 |
Provided are an absolute pressure sensing micro electromechanical system microphone, a microphone unit and an electronic device. The absolute pressure sensing micro electromechanical system microphone comprises: a vibrating diaphragm; a ...
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WO/2021/253499A1 |
Provided in the embodiments of the present disclosure are a capacitive micro-electro-mechanical system microphone, a microphone unit, and an electronic device. The capacitive micro-electro-mechanical system microphone comprises a back el...
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WO/2021/253498A1 |
Provided in the embodiments of the present description are a capacitive microelectromechanical system microphone, a microphone unit and an electronic device. The capacitive microelectromechanical system microphone comprises: a back polar...
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WO/2021/248930A1 |
Provided are a silicon-based microphone apparatus and an electronic device. The silicon-based microphone apparatus comprises: a circuit board, wherein at least two sound inlets are formed on the circuit board; a shielding shell that cove...
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WO/2021/248928A1 |
Provided in the present application are a silicon-based microphone device and an electronic device. The silicon-based microphone device comprises: a circuit board, a shielding shell and at least two differential silicon-based microphone ...
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WO/2021/248512A1 |
Provided is a piezoelectric MEMS microphone, comprising: a base having a back chamber; and a piezoelectric diaphragm fixed to the base and suspended above the back chamber. The piezoelectric diaphragm comprises a first electrode layer, a...
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WO/2021/248929A1 |
Provided in the embodiments of the present application are a silicon-based microphone device and an electronic device. The silicon-based microphone device comprises: a circuit board, provided with at least two sound inlets; a shielding h...
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WO/2021/249125A1 |
A method for manufacturing a sensor (100), comprising: providing a first PCB (200) comprising multiple first board units, a second PCB (300) comprising multiple board surrounding units, and a third PCB (400) comprising multiple second bo...
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WO/2021/237808A1 |
The present utility model provides a piezoelectric MEMS microphone, comprising a substrate, a diaphragm mounted on the substrate, and a protective flat plate spaced apart from the diaphragm. Reinforcing ribs are provided on the protectiv...
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WO/2021/243378A1 |
An electrostatic headphone is provided, comprising a first ear cup assembly, a second ear cup assembly, and a headband assembly coupled to each of the first ear cup assembly and the second ear cup assembly. Each ear cup assembly comprise...
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WO/2021/242001A1 |
According to an embodiment, an electronic device comprises: a housing; an assembly frame in the housing; a printed circuit board disposed on the assembly frame; a transducer which is disposed on the printed circuit board and includes a d...
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WO/2021/243367A1 |
A segmented stator plate for an electrostatic transducer is provided. The segmented stator plate may have multiple electrically separate sections that can be independently operated and are usable to generate sound and/or detect sound wav...
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WO/2021/237800A1 |
Disclosed in the present application is a MEMS microphone. The MEMS microphone is characterized in that a packaging housing is directly fixed on a flexible substrate to form an accommodating space; a MEMS chip and an ASIC chip are respec...
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WO/2021/232767A1 |
The embodiments of the present disclosure disclose a signal processing method and device for an MEMS microphone, and an MEMS microphone. Said method comprises: acquiring a first electrical signal obtained by converting a received optical...
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WO/2021/223886A1 |
The invention relates to a MEMS with a layer structure, comprising a cavity which is provided in the layer structure and which is fluidically coupled to the outer surroundings of the layer structure by at least one opening in the layer s...
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WO/2021/226268A1 |
A microelectromechanical (MEMS) microphone with membrane trench reinforcements and method of fabrication is provided. The MEMS microphone includes a flexible plate and a rigid plate mechanically coupled to the flexible plate. The MEMS mi...
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WO/2021/216058A1 |
In at least one embodiment, a microphone assembly including an enclosure, a first printed circuit board (PCB) and a microphone assembly is provided. The microphone assembly includes a sub-casing, a micro-electro-mechanical systems (MEMS)...
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WO/2021/208137A1 |
The present invention relates to the technical field of acoustic-electric conversion, and provides a piezoelectric MEMS microphone. The piezoelectric MEMS microphone comprises a substrate having a back cavity and a piezoelectric vibratin...
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WO/2021/202025A1 |
A condenser microphone with at least two microphone capsules, each including a diaphragm and a backplate. The backplates of both the first capsule and second capsule having an electret bias. The first capsule having a first polar pattern...
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WO/2021/196583A1 |
The present application relates to the field of televisions, and provides a television with an AIoT sound effect. A loudspeaker box is provided at the ground side of the television; a preset number of medium-high audio loudspeakers are r...
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WO/2021/199880A1 |
According to the present invention, an earphone 1 includes: a resonance circuit 122 that outputs an adjustment signal in which a signal component included in an electric signal output by a sound source device 2 and having a predetermined...
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WO/2021/189585A1 |
The present utility model provides a microelectromechanical systems microphone chip, comprising a substrate having a back cavity, and a back electrode plate and a diaphragm which are respectively supported and fixed on the substrate, mut...
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WO/2021/192417A1 |
An ultrasonic transducer according to the present invention is provided with a first acoustic transducer (110), a second acoustic transducer (120), and a bottomed cylindrical housing (130). The second acoustic transducer (120) further ha...
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WO/2021/184403A1 |
The present invention provides a MEMS microphone. The MEMS microphone of the present invention comprises a housing having a packaging cavity, a MEMS chip and an ASIC chip; the MEMS microphone further comprises a conductive dust-proof mes...
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WO/2021/184591A1 |
Disclosed are a processing method for an MEMS microphone, and an MEMS microphone. The method comprises: depositing a polycrystalline silicon reference layer on a substrate; performing dry etching on the polycrystalline silicon reference ...
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WO/2021/174571A1 |
The present invention provides a piezoelectric MEMS microphone, comprising: a base having a back chamber, and a piezoelectric diaphragm arranged directly opposite to the back chamber. The piezoelectric diaphragm comprises a support porti...
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WO/2021/174586A1 |
Provided by the present utility model is a microphone. The present utility model comprises a housing provided with a first cavity. The housing comprises a circuit board used for electrical connection and a first casing fixed to the circu...
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WO/2021/174588A1 |
The utility model provides a MEMS microphone, comprising: a base, an inner metal casing covering one side of the base and forming a protective space with the base, a MEMS chip and an ASIC chip that are fixed to the base, and an outer met...
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WO/2021/174587A1 |
Provided is a MEMS microphone. The MEMS microphone comprises a shell with an accommodating space, and a MEMS chip and an ASIC chip that are accommodated in the accommodating space. The shell comprises a substrate used for installing the ...
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WO/2021/174585A1 |
An MEMS sensor package structure comprises: a package housing (11); a package substrate (12) forming an accommodation space with the package housing; an MEMS chip (13) and an ASIC chip (14) accommodated in the accommodation space; and an...
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WO/2021/173688A1 |
A microphone assembly includes a housing defining an acoustic cavity having a sound inlet for transmitting a sound in to the acoustic cavity. A micro-electro-mechanical (MEMS) microphone is located at least partially within the housing a...
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WO/2021/168902A1 |
A MEMS chip assembly, said assembly comprising a substrate (20) and a MEMS chip (10) mounted on the substrate (20); the MEMS chip (10) comprises a base (1) having a cavity (3), and a sensing part (2) arranged on the base (1), and the MEM...
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WO/2021/164087A1 |
The present invention provides a miniature loudspeaker, comprising a substrate, a piston and connecting rod assembly, a driving device, a first charge injection device, and a second charge injection device. An accommodating cavity penetr...
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WO/2021/167620A1 |
A capacitive transducer or microphone includes a first substrate of one or more layers and which includes a first surface, a first cavity in the first surface, and a mesa diaphragm that spans the first cavity. The capacitive transducer o...
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WO/2021/152922A1 |
A sound pickup device (1) comprises a diaphragm (102) that vibrates in response to the acoustic pressure of an inputted sound, an acoustic member (11) having a sound channel (131) that is formed in order to guide a sound to the diaphragm...
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