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WO/2021/141065A1 |
The purpose of the present disclosure is to provide a fluoropolymer electret material, etc., exhibiting hardness.　The electret material contains a fluoropolymer, said fluoropolymer containing as main ingredient a monomer unit represent...
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WO/2021/142140A1 |
A robust MEMS transducer includes a kinetic energy diverter disposed within its frontside cavity. The kinetic energy diverter blunts or diverts kinetic energy in a mass of air moving through the frontside cavity, before that kinetic ener...
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WO/2021/140380A1 |
Presented herein are acoustic port covers for attachment to electronic devices. An electronic device includes a housing having at least one acoustic port extending through the housing. An acoustic port cover in accordance with embodiment...
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WO/2021/134208A1 |
A microphone assembly including an acoustic transducer that generates an electrical signal responsive to acoustic activity, and an integrated circuit electrically coupled to the acoustic transducer and that receives the electrical signal...
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WO/2021/134683A1 |
Disclosed are a MEMS microphone and an array structure. The MEMS microphone comprises a substrate provided with a back cavity, and a piezoelectric vibrating diaphragm fixed on the substrate, the piezoelectric vibrating diaphragm comprisi...
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WO/2021/135129A1 |
Disclosed are a dust-proof structure, a microphone structure, and an electronic device. The dust-proof structure comprises: a carrier, a through hole being formed in the middle of the carrier, and the carrier being subjected to hydrophob...
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WO/2021/135126A1 |
Disclosed are a dustproof structure, a microphone packaging structure and an electronic device, the dustproof structure comprising: a carrier layer, wherein a through hole is formed at the center of the carrier layer; a film body layer, ...
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WO/2021/135118A1 |
Disclosed are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a carrier and a grid part; the carrier is of a hollow structure; the grid part comprises a filter screen an...
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WO/2021/135125A1 |
Disclosed are a dustproof structure for a MEMS device and a MEMS microphone packaging structure. The dustproof structure for a MEMS device comprises a grid film and a carrier, wherein the grid film is provided with a fixed connection are...
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WO/2021/134308A1 |
Provided in the present invention is a condenser microphone, comprising a fixed support, a vibration part, and elastic connection parts connected between the vibration part and the fixed support. An accommodating part is provided in the ...
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WO/2021/134686A1 |
Provided in the present utility model is a MEMS speaker, which comprises a base penetratingly provided with an accommodating cavity, and a piston membrane, a transmission member, a flexible guide mechanism, a connecting column, and a dri...
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WO/2021/135107A1 |
Disclosed in the present disclosure are a dustproof structure, a microphone encapsulation structure, and an electronic device. The dustproof structure comprises a carrier and a grid part; the carrier is a hollow structure, a buffer part ...
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WO/2021/135120A1 |
Disclosed in the present invention are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a carrier and a mesh part; the mesh part comprises a filter screen and a fixing pa...
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WO/2021/135112A1 |
Disclosed is a MEMS device, comprising a substrate, a MEMS chip layer and a grid film; the substrate is provided with a first surface and a second surface, and a penetrating first through hole is formed on the substrate; the MEMS chip la...
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WO/2021/134203A1 |
The present utility model provides a bone conduction microphone, comprising: a substrate, a spring plate provided opposite to the substrate and spaced apart from the substrate, and a cavity enclosure wall provided between the substrate a...
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WO/2021/135119A1 |
Disclosed are a dustproof structure for a MEMS device and a MEMS microphone packaging structure. The dustproof structure comprises a grid film, a first carrier and a second carrier, wherein the first carrier is provided with a through fi...
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WO/2021/135115A1 |
Disclosed are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a support and a grid part. The support is of a hollow structure. The grid part comprises a filter screen an...
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WO/2021/135121A1 |
Disclosed in the present invention are a dustproof structure for an MEMS device and an MEMS microphone packaging structure. The dustproof structure comprises a mesh membrane and a support; the support is of a columnar frame structure, th...
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WO/2021/135111A1 |
Disclosed in the present invention are a dustproof structure for an MEMS device and an MEMS microphone packaging structure. The dustproof structure for an MEMS device comprises a mesh membrane and a support; the mesh membrane has a fixed...
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WO/2021/135113A1 |
Disclosed are a dustproof structure, a microphone packaging structure, and an electronic device. The dustproof structure comprises a carrier and a grid part; the carrier is of a hollow structure; the grid part is arranged at one end of t...
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WO/2021/135109A1 |
Disclosed are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a carrier and a grid part, wherein the carrier is of a hollow structure, the carrier comprises a plurality ...
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WO/2021/135116A1 |
Disclosed are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a carrier and a grid part, wherein the carrier is of a hollow structure; the grid part comprises a filter s...
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WO/2021/135108A1 |
Disclosed in the present invention are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises a support and a mesh portion; the support has a hollow structure, the support comp...
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WO/2021/135122A1 |
Disclosed are a dust-proof structure, a microphone packaging structure and an electronic device. The dust-proof structure comprises: a carrier, a through-hole being formed at the middle portion of the carrier; and a membrane, wherein the...
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WO/2021/134202A1 |
Provided in the present utility model is a bone conduction microphone, comprising: a housing provided with a receiving cavity and an acoustoelectric conversion component contained in the receiving cavity; the housing comprises a lower co...
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WO/2021/134334A1 |
The present application provides an MEMS microphone, comprising a substrate having a back cavity and a capacitance system arranged on the substrate. The capacitance system comprises a diaphragm, and a back plate spaced apart from the dia...
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WO/2021/135128A1 |
Disclosed in the present invention are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises: a mesh structure; a support part, the support part comprising a connecting part a...
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WO/2021/134333A1 |
The present invention provides an MEMS microphone. The MEMS microphone comprises a substrate having a back cavity and a capacitor system provided on the substrate; the capacitor system comprises a diaphragm and a back plate which is spac...
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WO/2021/134671A1 |
Provided are a piezoelectric MEMS microphone, and a preparation method for the piezoelectric MEMS microphone. The piezoelectric MEMS microphone comprises several piezoelectric MEMS units, each piezoelectric MEMS unit comprising a substra...
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WO/2021/134679A1 |
Provided in the present invention is a capacitance system, comprising a fixed substrate having an accommodating cavity, a moving substrate arranged in the accommodating cavity, an elastic piece arranged opposite the moving substrate, and...
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WO/2021/135110A1 |
Disclosed are a dustproof structure and a MEMS microphone packaging structure used for a micro-electro-mechanical system (MEMS) device; the dustproof structure used for a MEMS device comprises a mesh membrane and a carrier having a cylin...
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WO/2021/135124A1 |
Disclosed are a dustproof structure, a microphone packaging structure and an electronic device. The dustproof structure comprises: a carrier, wherein the carrier is made of a metal material, and a through hole is provided in the middle o...
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WO/2021/128638A1 |
Disclosed is a MEMS chip, said MEMS chip comprising: a substrate having a rear cavity, and a plate capacitor set arranged on the substrate; the plate capacitor set at least comprises a first plate capacitor structure and a second plate c...
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WO/2021/128637A1 |
Disclosed is a MEMS chip. The chip comprises a substrate layer having a back cavity, and a plate capacitor structure composed of a diaphragm layer, a first insulating layer, and a back electrode layer is disposed on the substrate layer. ...
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WO/2021/128418A1 |
The embodiments of the present invention disclose a microphone packaging structure and an electronic device. The packaging structure comprises: a housing, a cavity being formed inside the housing, at least a part of the housing comprisin...
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WO/2021/119873A1 |
The present invention provides a MEMS microphone, comprising a substrate having a rear cavity, and a piezoelectric diaphragm fixed on said substrate; the piezoelectric diaphragm comprises a main diaphragm fixed on the base and a piezoele...
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WO/2021/125087A1 |
This ultrasound device comprises a cavity layer and a functional layer. The cavity layer comprises a first surface and a plurality of cavities that are open in the first surface and arranged along the first surface. The functional layer ...
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WO/2021/108421A1 |
A method is disclosed of fabricating a MEMS device that includes one or more wafers configured as pump or valve. The pump or valve includes an inlet port to receive fluid and an outlet port to release the fluid within the pump or valve. ...
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WO/2021/098014A1 |
An active noise reduction acoustic unit (1) and a sound-generating body; the active noise reduction acoustic unit (1) comprises a housing and substrate (11); the substrate (11) is provided within the housing, and the substrate (11) separ...
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WO/2021/093761A1 |
The present application discloses a sound pickup array, a sound pickup device, and a sound pickup performance optimization method. The sound pickup array comprises a plurality of sound pickups. Each of the sound pickups comprises a forwa...
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WO/2021/095898A1 |
The present invention provides an ultrasonic wave transmission structure which is provided on the path of ultrasonic waves to amplify incident ultrasonic waves. To this end, disclosed is a feature comprising: a plurality of rings provide...
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WO/2021/088241A1 |
Disclosed is a dustproof and anti-air-blowing micro-electro-mechanical microphone chip, comprising a substrate, and a diaphragm and a back plate sequentially arranged on the upper side of the substrate. Air release valves are arranged on...
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WO/2021/082051A1 |
A method for manufacturing a micro-nano structure assembly, comprising: providing a filter membrane; providing an MEMS sensor, wherein the MEMS sensor is provided with an opening and can perform sensing by means of the opening; and bondi...
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WO/2021/082270A1 |
Disclosed in the present invention are a sensor encapsulation structure and an electronic apparatus. The sensor encapsulation structure comprises a substrate and a encapsulation shell arranged on the substrate, with a cavity being enclos...
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WO/2021/082055A1 |
A method for manufacturing an MEMS sensor assembly, comprising: providing a filter membrane (104), comprising coating a buffer material on one surface of a substrate (100) where a heat release adhesive layer (106) covers to form a buffer...
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WO/2021/085686A1 |
The present invention relates to a directional microphone apparatus. The directional microphone apparatus comprises: a first substrate; a second substrate having a first sound hole facing the first substrate; spacing materials located be...
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WO/2021/080068A1 |
The present invention relates to a microphone package. The microphone package comprises: a substrate; a MEMS transducer located on the substrate and converting, into an electrical signal, a sound applied from the outside; a signal proces...
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WO/2021/056607A1 |
An MEMS chip and an electronic device. The chip comprises a substrate (11) provided with a back cavity (12), and a back electrode and a sensing film arranged on the substrate (11), wherein the back electrode and the sensing film are loca...
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WO/2021/056606A1 |
A MEMS chip and an electronic device, the MEMS chip comprising a substrate (11) having a back cavity (12), and a back electrode and two sensing films (14, 16) arranged on the substrate (11), the back electrode and the two sensing films (...
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WO/2021/051854A1 |
A preparation method for an MEMS microphone, comprising the following steps: providing a silicon substrate having a silicon surface; forming a closed chamber on the silicon substrate; arranging multiple sound holes at intervals on the si...
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