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Matches 1 - 50 out of 6,889

Document Document Title
WO/2021/082051A1
A method for manufacturing a micro-nano structure assembly, comprising: providing a filter membrane; providing an MEMS sensor, wherein the MEMS sensor is provided with an opening and can perform sensing by means of the opening; and bondi...  
WO/2021/082270A1
Disclosed in the present invention are a sensor encapsulation structure and an electronic apparatus. The sensor encapsulation structure comprises a substrate and a encapsulation shell arranged on the substrate, with a cavity being enclos...  
WO/2021/082055A1
A method for manufacturing an MEMS sensor assembly, comprising: providing a filter membrane (104), comprising coating a buffer material on one surface of a substrate (100) where a heat release adhesive layer (106) covers to form a buffer...  
WO/2021/085686A1
The present invention relates to a directional microphone apparatus. The directional microphone apparatus comprises: a first substrate; a second substrate having a first sound hole facing the first substrate; spacing materials located be...  
WO/2021/080068A1
The present invention relates to a microphone package. The microphone package comprises: a substrate; a MEMS transducer located on the substrate and converting, into an electrical signal, a sound applied from the outside; a signal proces...  
WO/2021/056607A1
An MEMS chip and an electronic device. The chip comprises a substrate (11) provided with a back cavity (12), and a back electrode and a sensing film arranged on the substrate (11), wherein the back electrode and the sensing film are loca...  
WO/2021/056606A1
A MEMS chip and an electronic device, the MEMS chip comprising a substrate (11) having a back cavity (12), and a back electrode and two sensing films (14, 16) arranged on the substrate (11), the back electrode and the two sensing films (...  
WO/2021/051854A1
A preparation method for an MEMS microphone, comprising the following steps: providing a silicon substrate having a silicon surface; forming a closed chamber on the silicon substrate; arranging multiple sound holes at intervals on the si...  
WO/2021/047962A1
A membrane structure (1) comprises a substrate (2) having a main surface (4) and a rear surface (24). A plurality of pillars (10) are arranged on the main surface (4) of the substrate (2) and have a support area (12) facing away from the...  
WO/2021/038288A1
The present disclosure relates to a CMUT transducer (200) comprising: - a conductive or semiconductor substrate (201) coated with a stack of one or a plurality of dielectric layers (203, 213); - a cavity (205, 215) formed in said stack; ...  
WO/2021/038761A1
Provided is an electrostatic transducer that makes it possible to connect a lead wire to a flexible electrode sheet reliably, easily, and at low cost. An electrostatic transducer (1) is provided with: a flexible electrode sheet (12); a l...  
WO/2021/036653A1
Disclosed is a high-sensitivity piezoelectric microphone, comprising a wafer substrate with a cavity, and a plurality of cantilever beams of a piezoelectric laminated structure, wherein each of the cantilever beams comprises a fixed end ...  
WO/2021/038552A1
Techniques described herein generally relate to generating an audio signal with a speaker. In some examples, a speaker device is described that includes a membrane and a shutter. The membrane can be configured to oscillate along a first ...  
WO/2021/031107A1
Provided is a piezoelectric MEMS microphone, comprising a base having a chamber, a piezoelectric diaphragm installed on the base, and a restriction member connected to the base and the piezoelectric diaphragm. The base comprises an annul...  
WO/2021/031105A1
The present invention provides a piezoelectric MEMS microphone, comprising a substrate having a cavity, a piezoelectric vibration diaphragm mounted on the substrate, and a limiting member covering the outside of the piezoelectric vibrati...  
WO/2020/086852A9
An improved loudspeaker system that produces an improved audio quality for stereophonic sound, which can be described as 3D audio. In one embodiment, the improved loudspeaker utilizes at least three stacks of electrostatic transducer car...  
WO/2021/031104A1
The present invention provides a piezoelectric MEMS microphone, comprising a substrate having a cavity and a piezoelectric vibrating diaphragm provided on the substrate. The substrate comprises an annular base and a support column provid...  
WO/2021/031299A1
A method for sensing vibration by a vibration sensing device and the vibration sensing device. The vibration sensing device comprises: a housing (26), a cavity being formed inside the housing (26); a pressure generating device, the press...  
WO/2021/025378A1
Provided is a microphone module for a vehicle. A microphone module for a vehicle according to one embodiment of the present invention comprises: a circuit board having a circuit unit and a microphone mounted thereon; a housing including ...  
WO/2021/019296A1
The present disclosure relates to a method of manufacturing a CMUT transducer (200), comprising the steps of: a) forming a first dielectric layer (103) on a first substrate (101); b) forming a second dielectric layer (207) on a second su...  
WO/2021/018469A1
An artificial cochlea device (100, 300) for processing audio signals by electro-mechanical amplitude changes includes a micro-electro- mechanical system, MEMS, microphone (118) comprising a membrane (102), and an electro-mechanical feedb...  
WO/2021/016458A1
A MEMS AE transducer system is provided that takes advantage of the low power consumption and lightweight characteristics of MEMS AE transducers, while also achieving higher sensing sensitivity. To address the problem of low sensitivity ...  
WO/2021/010072A1
[Problem] To provide an electrostatic-type sound pressure-electrical signal conversion device which enables three-dimensional deformation and has a sheet shape with a low driving voltage. [Solution] In a sound pressure-electrical signal ...  
WO/2021/002540A1
The present invention relates to a microphone and, more particularly, to a MEMS microphone. A microphone according to an example of the present invention comprises: a case including a side wall and an upper wall, and having an open lower...  
WO/2021/000070A1
Provided in the present invention is a MEMS microphone, comprising a base having a rear cavity and a capacitor system arranged on the base, the capacitor system comprising a backplate and a diaphragm, the backplate and the diaphragm bein...  
WO/2021/000163A1
Disclosed are a bone-conduction MEMS microphone and a mobile terminal. The bone-conduction MEMS microphone comprises: an MEMS microphone chip with a back cavity, a mass block, a shell, and a circuit board, wherein the MEMS microphone chi...  
WO/2021/000069A1
Provided is a combined piezoelectric and capacitive MEMS microphone, comprising a base having a back cavity, and a capacitance system arranged on the base, wherein the capacitance system comprises a backplane and a vibrating diaphragm, t...  
WO/2020/258171A1
Provided in the present utility model are a vibration sensor and an audio device. The vibration sensor comprises a cavity with an inner wall as well as an elastic piece, a mass piece and an MEMS chip with a back cavity all arranged in th...  
WO/2020/258172A1
Provided are a vibration sensor, an audio apparatus, and a method for assembling a vibration sensor. The vibration sensor comprises a cavity having an inner wall, a spacer provided within the cavity, an elastic film, and a MEMS chip havi...  
WO/2020/258174A1
The present application provides a vibration sensor and an audio device. The vibration sensor comprises a cavity having a sidewall, an elastic film mounted on the sidewall, and an MEMS chip having a back cavity. The MEMS chip is received...  
WO/2020/259530A1
An acoustic reflector (4000) and an acoustic electronics device are disclosed. The acoustic reflector (4000) is for being used inside an enclosure (1000) of an acoustic electronics device, which is made of thermal conductive material and...  
WO/2020/237651A1
An MEMS capacitive sensor and a preparation method thereof. The sensor comprises a first electrode structure (200), and the first electrode structure (200) comprises a first conductive region (230a) located in a central region, and an in...  
WO/2020/228543A1
Disclosed is an MEMS device, comprising a substrate, and a first sacrificial layer (200), a first conductive film (300), a second sacrificial layer (400) and a second conductive film (500) that are stacked on the substrate (100) in seque...  
WO/2020/229466A1
The invention relates to an acoustic bending transducer system (1, 2) with a plurality of bending transducers (3, 4, 5), which are designed in such a way that deformable elements (31, 32, 41; 32, 34, 42; 31, 32, 3'1, 3'2) of the bending ...  
WO/2020/225808A1
An acoustic device including a membrane having an edge. A membrane support is attached to the edge of the membrane. A central region of the membrane is unsupported by the support. A first electrode and the membrane support are manufactur...  
WO/2020/225573A1
An electrostatic transducer, a diaphragm (2) therefor, and corresponding methods of manufacture are disclosed. The electrostatic transducer is preferably for use in a motor vehicle. A composite laminated diaphragm (2) is manufactured by ...  
WO/2020/224513A1
A method for manufacturing a micro electro mechanical system (MEMS) device, comprising: providing a substrate (100), forming a first sacrificial layer (200) on a front surface of the substrate (100), and forming a functional structure (3...  
WO/2020/217855A1
Provided is an electrostatic transducer that enables improvement of detection accuracy or driving precision while allowing flexibility. This electrostatic transducer (1) is provided with: an insulator sheet (11); at least one electrode s...  
WO/2020/212540A1
The invention relates to a micromechanical acoustic transducer comprising a plurality of bending transducers suspended on one side. Each of the plurality of bending transducers is designed for deflection in an oscillation plane and said ...  
WO/2020/209947A1
A mounting system which includes a pocket for receiving a digital recorder or a wireless transmitter and a connector for connecting to the body of a microphone device, such as a hand held microphone. The pocket is made of a polyurethane ...  
WO/2020/206628A1
The present disclosure relates to microphone devices. One microphone assembly includes a transducer and a housing. The microphone assembly includes an integrated circuit coupled to the transducer. The housing includes a port, a base, and...  
WO/2020/205852A1
A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate, the acoustic transducer configured to generate an electrical signal responsive to acoustic activity. An integrated circuit is disposed on t...  
WO/2020/194870A1
Disclosed is a transducer device that is configured to be able to extend the scope of uses thereof. This transducer device (1) is provided with: a transducer element (11); elastic bodies (12a, 12b) which clamp the transducer element (11)...  
WO/2020/196863A1
Provided is an electrostatic transducer which has a reduced film thickness and offers increased detection accuracy or operation accuracy. The electrostatic transducer (1) is provided with: an insulator sheet (11); a first electrode sheet...  
WO/2020/193288A1
The invention relates to a MEMS comprising a substrate having a cavity. The MEMS comprises a moveable layer assembly arranged in the cavity and having a first bar, a second bar and a third bar arranged between the first bar and second ba...  
WO/2020/186884A1
The present invention relates to a microphone and an electronic device. The microphone comprises an encapsulation housing having an inner cavity, and a MEMS microphone chip and an ASIC chip provided in the inner cavity of the encapsulati...  
WO/2020/189129A1
Provided is an electroacoustic transducer having adjustable frequency properties. In an electrostatic electroacoustic transducer (1), an oscillator (10) is disposed between a fixed pole (20U) and a fixed pole (20L). The periphery of the ...  
WO/2020/185998A1
Disclosed herein is an audio system having servo-controlled audio speaker and an amplifier. Interposed between the audio speaker and the amplifier is a feedback circuit configured to provide a feedback signal to the amplifier regarding e...  
WO/2020/174524A1
[Problem] To provide an electrostatic sound wave generation device and an electrostatic speaker that make it less likely that dust, water, humidity, or the like will enter the interior of the device, and make it possible to reduce consum...  
WO/2020/175839A1
A semiconductor apparatus according to the present technology comprises: a readout circuit for reading a first signal generated by detecting an input signal according to a detection signal, to generate a readout signal; and a detection c...  

Matches 1 - 50 out of 6,889