| Document |
Document Title |
|
WO/2024/043976A1 |
In various aspects, the disclosure relates to methods of adhering a liquid metal composite to a substrate. The method can include applying a pretreatment to a surface of the substrate to form an activated surface. In some aspects, the pr...
|
|
WO/2024/042449A1 |
One or more systems, devices, and/or methods of use provided herein relate to signal filters for scalable quantum computing architectures. According to one embodiment, a device can comprise a circuit board comprising a plurality of layer...
|
|
WO/2024/043695A1 |
A circuit board according to an embodiment comprises: a first insulating layer; and a first circuit pattern layer comprising a pad disposed on the first insulating layer, wherein the pad comprises a first metal layer at least partially e...
|
|
WO/2024/043977A1 |
Vertical launch impedance matched through-hole vias to ensure proper impedance matching is maintained after a printed circuit board connector is attached to a printed circuit board. A conductive via having a center aperture and a via bod...
|
|
WO/2024/043083A1 |
One aspect of the present invention is a resin composition comprising: a preliminary reaction product (A) obtained by preliminarily reacting a mixture that includes a polyphenylene ether compound (a1) and a carbodiimide compound (a2), th...
|
|
WO/2024/043572A1 |
This display device comprises: a light emitting element disposed in a display region on a substrate; a pad part disposed in a pad region on the substrate and including a plurality of output pads; a driving chip; and a control signal wire...
|
|
WO/2024/043084A1 |
An aspect of the present invention relates to a resin composition comprising: a polyphenylene ether compound (A); a reactive compound (B) having an unsaturated double bond in the molecule; and at least one additive (C) selected from the ...
|
|
WO/2024/043664A2 |
|
|
WO/2024/040725A1 |
A backlight module (B) and a display device. The backlight module (B) comprises an outer frame unit (2), a light guide plate (4) disposed in the outer frame unit (2), a light-emitting unit (5), a plurality of fixing adhesives (6) for fix...
|
|
WO/2024/041303A1 |
A circuit board and an electronic device, for solving the problem that molten solder is prone to flowing into a via hole (102). The circuit board comprises a substrate (100); the substrate (100) comprises a first plane and a second plane...
|
|
WO/2024/043418A1 |
Disclosed are an IC type jumper package which can greatly increase the freedom of wiring design even when using a single-sided printed circuit board, and a printed circuit board having same. The jumper package comprises one or more condu...
|
|
WO/2024/043222A1 |
This photosensitive surface treatment agent contains a compound represented by formula (M1). In formula (M1), R1 represents a linear, branched, or cyclic alkyl group having 1-6 carbon atoms, and Y1 represents a single bond or a linear or...
|
|
WO/2024/041382A1 |
The present disclosure relates to a display module, which comprises a display panel and a flexible circuit board bound and connected to the display panel. The display panel comprises a display area, a binding area and a bendable area loc...
|
|
WO/2024/043476A1 |
An electronic device according to one embodiment controls both a first conductive pattern and a second conductive pattern in a first time period indicated by a control signal transmitted from an external electronic device that differs fr...
|
|
WO/2024/036770A1 |
A semiconductor package substrate (300), a manufacturing method for the semiconductor package substrate (300), and a semiconductor package structure (1300). The semiconductor package substrate (300) comprises: a substrate (310); and a go...
|
|
WO/2024/039208A1 |
An electronic device according to various embodiments of the present disclosure may comprise: a housing; a first printed circuit board arranged in the housing; a second printed circuit board arranged in the housing; a battery arranged be...
|
|
WO/2024/038761A1 |
The purpose of the present invention is to provide a cured product having excellent impact resistance. A cured product according to one mode of the present invention is obtained by curing a curable composition containing a (meth)acrylic ...
|
|
WO/2024/037499A1 |
A circuit board assembly and a manufacturing method therefor. The circuit board assembly comprises: a substrate (10), the substrate (10) comprising a plurality of layers of daughter boards (11) which are stacked, a first conductive layer...
|
|
WO/2024/039041A1 |
An electronic device, according to one embodiment of the present disclosure, may comprise: a first support member having a flat plate shape; a first circuit board disposed on one surface of the first support member; a fixing member dispo...
|
|
WO/2024/039228A1 |
A circuit board according to an embodiment comprises: a first insulating layer; a second insulating layer disposed on the first insulating layer; and a circuit pattern layer disposed between the first insulating layer and the second insu...
|
|
WO/2024/039109A1 |
According to various embodiments disclosed herein, an electronic device may include a housing having a first opening. The electronic device may include: a key button at least partially exposed to the outside via the first opening; and a ...
|
|
WO/2024/038394A1 |
A printed circuit board comprises a substrate as well as resistors and electrical connections disposed on the substrate. The substrate couples to a video graphics array connector that has pins, including video pins and return pins. A vid...
|
|
WO/2024/034463A1 |
Provided is a resin composition that not only exhibits high adhesiveness against less rough surfaces and has excellent dielectric properties, but also can stably sustain the high adhesiveness even after a heat load is applied thereto. Th...
|
|
WO/2024/034455A1 |
Provided is an inductor component with which deterioration in performance can be suppressed, and a high inductance value can be obtained while realizing increased thinness. This inductor component comprises: an element including a magnet...
|
|
WO/2024/035176A1 |
A semiconductor package substrate according to an embodiment comprises: an insulating layer having a top surface and a bottom surface; and a through electrode penetrating the top surface and the bottom surface of the insulating layer, wh...
|
|
WO/2024/034303A1 |
According to the present invention, a substrate has a component mounting surface that faces a first surface of an electronic component package, and the electronic component package is mounted on the substrate. One or a plurality of condu...
|
|
WO/2024/034703A1 |
The present invention relates to a printed circuit board and a manufacturing method thereof. A printed circuit board according to the present invention comprises: a substrate having a first layer to an n-th layer stacked in layers; a via...
|
|
WO/2024/032944A1 |
The present invention relates to a self-locking portable power distributor for devices for breadboards. The distributor receives a stabilized +5V voltage through a USB connector of any version and type from any external device which devi...
|
|
WO/2024/035111A1 |
A circuit board according to an embodiment comprises an insulating layer and an electrode part disposed in the insulating layer, the electrode part comprising: a first electrode; a second electrode disposed on the first electrode; and fi...
|
|
WO/2024/033021A1 |
An elongate conductor arrangement (1) for electrical connection to a medical device (27) is proposed, comprising an elongate sheet substrate (3) and at least two conductor lines (5). Therein, the elongate sheet substrate (3) comprises a ...
|
|
WO/2024/033240A1 |
A printed circuit board formed of at least two layers. A first layer is thermally conductive and a second layer is thermally insulating. Both layers provide structural support and/or mechanical rigidity to the printed circuit board. A pl...
|
|
WO/2024/034516A1 |
Provided is an electroconductive paste that makes it possible to improve screen printability, maintain tacking properties, and efficiently dispose solder particles on an electrode.　The electroconductive paste according to the present i...
|
|
WO/2024/033883A1 |
The present invention is a method of fabricating a flexible pressure sensor array and a sensor or sensor array. A sensor array can provide a pressure map in addition to a magnitude of pressure; hence providing tactile information of the ...
|
|
WO/2024/035076A1 |
A foldable electronic device according to an exemplary embodiment of the present disclosure may comprise a foldable housing, a flexible display module, a first flexible printed circuit board, and a first non-conductive member. The foldab...
|
|
WO/2024/034884A1 |
A printed circuit board comprises: a first via and a second via which are provided between a first circuit unit and a second circuit unit provided on the upper surface of an insulating layer, and penetrate the insulating layer; a first s...
|
|
WO/2024/032428A1 |
Disclosed in the present invention are a double-layer flexible circuit board, an electronic product, and a conduction method. The double-layer flexible circuit board comprises a middle insulating layer and metal circuit layers located at...
|
|
WO/2024/034276A1 |
The present invention provides a method for manufacturing a metal foil clad laminated sheet having excellent mass productivity and in which peeling of a resin composition layer and a metal foil is suppressed, as well as a resin compositi...
|
|
WO/2024/033055A1 |
The invention relates to an electronic assembly (10) for a high-voltage battery of a motor vehicle, comprising a circuit board (14) populated with electronic components (12), the bottom (18) of said circuit board having arranged on it an...
|
|
WO/2024/032628A1 |
A printed circuit board and a preparation method. An inner layer of the printed circuit board comprises at least one group of coaxial metalized via holes, each group of the coaxial metalized via holes comprising a coaxial large hole (M0)...
|
|
WO/2024/033302A1 |
The invention relates to a printed circuit board assembly which has a printed circuit board with an upper face (11), a lower face (12), multiple metal layers (13), and multiple electrically insulating layers (14). The printed circuit boa...
|
|
WO/2023/241079A9 |
A contact lens (100), containing a lens body (1), an electronic element (2) and a circuit structure (3). The lens body (1) contains an optical portion (11) and an annular wearing portion (12) surrounding the optical portion (11), wherein...
|
|
WO/2024/033655A1 |
Aspects of the present invention relate to a power supply unit (31) configured to be integrated into a vacuum pressure gauge (1). The vacuum pressure gauge (1) having a vacuum pressure sensor (3). The power supply unit (31) includes a mo...
|
|
WO/2024/034278A1 |
The present invention provides a circuit module wherein a lower circuit board overlaps with a part of an upper circuit board when viewed in the vertical direction. The upper circuit board, the lower circuit board and a sealing member for...
|
|
WO/2024/033223A1 |
The invention relates to an electrical device, comprising: - a component (LM), which is at least partly covered with a gel (VG); - a circuit board (LP) having an end face (SS), to which a metal layer (MS) is applied, which at least partl...
|
|
WO/2024/035151A1 |
A circuit board according to an embodiment comprises a first insulating layer, a second insulating layer arranged on the first insulating layer, and a circuit pattern layer arranged between the first and second insulating layers, wherein...
|
|
WO/2024/034398A1 |
Provided is a resin composition exhibiting excellent high frequency characteristics and heat resistance reliability. The resin composition comprises: (A) a polyphenylene ether resin that has, at a terminal end, a functional group includi...
|
|
WO/2024/032237A1 |
The embodiments of the present application provide a pre-foamed material and a preparation method therefor, a foamed material and a foaming device thereof, a modified polymer, and related uses thereof. The pre-foamed material comprises a...
|
|
WO/2023/241078A9 |
A contact lens (100), comprising a lens body (1), an electronic element (2) and a circuit structure (3). The lens body (1) comprises an optical portion (11) and an annular wearing portion (12) surrounding the optical portion (11), wherei...
|
|
WO/2024/034896A1 |
The present invention relates to a ceramic substrate and a method for manufacturing same, the ceramic substrate comprising: a ceramic base material; a first electrode pattern and a second electrode pattern formed on the upper and lower s...
|
|
WO/2024/034246A1 |
The present invention provides an adhesive base material with a wiring line, the adhesive base material being capable of suppressing the occurrence of a crack or buckling in a wiring pattern that is formed on an adhesive layer. An adhesi...
|
