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WO/2024/035076A1 |
A foldable electronic device according to an exemplary embodiment of the present disclosure may comprise a foldable housing, a flexible display module, a first flexible printed circuit board, and a first non-conductive member. The foldab...
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WO/2024/034884A1 |
A printed circuit board comprises: a first via and a second via which are provided between a first circuit unit and a second circuit unit provided on the upper surface of an insulating layer, and penetrate the insulating layer; a first s...
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WO/2024/032428A1 |
Disclosed in the present invention are a double-layer flexible circuit board, an electronic product, and a conduction method. The double-layer flexible circuit board comprises a middle insulating layer and metal circuit layers located at...
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WO/2024/034276A1 |
The present invention provides a method for manufacturing a metal foil clad laminated sheet having excellent mass productivity and in which peeling of a resin composition layer and a metal foil is suppressed, as well as a resin compositi...
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WO/2024/033055A1 |
The invention relates to an electronic assembly (10) for a high-voltage battery of a motor vehicle, comprising a circuit board (14) populated with electronic components (12), the bottom (18) of said circuit board having arranged on it an...
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WO/2024/032628A1 |
A printed circuit board and a preparation method. An inner layer of the printed circuit board comprises at least one group of coaxial metalized via holes, each group of the coaxial metalized via holes comprising a coaxial large hole (M0)...
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WO/2024/033302A1 |
The invention relates to a printed circuit board assembly which has a printed circuit board with an upper face (11), a lower face (12), multiple metal layers (13), and multiple electrically insulating layers (14). The printed circuit boa...
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WO/2023/241079A9 |
A contact lens (100), containing a lens body (1), an electronic element (2) and a circuit structure (3). The lens body (1) contains an optical portion (11) and an annular wearing portion (12) surrounding the optical portion (11), wherein...
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WO/2024/033655A1 |
Aspects of the present invention relate to a power supply unit (31) configured to be integrated into a vacuum pressure gauge (1). The vacuum pressure gauge (1) having a vacuum pressure sensor (3). The power supply unit (31) includes a mo...
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WO/2024/034278A1 |
The present invention provides a circuit module wherein a lower circuit board overlaps with a part of an upper circuit board when viewed in the vertical direction. The upper circuit board, the lower circuit board and a sealing member for...
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WO/2024/033223A1 |
The invention relates to an electrical device, comprising: - a component (LM), which is at least partly covered with a gel (VG); - a circuit board (LP) having an end face (SS), to which a metal layer (MS) is applied, which at least partl...
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WO/2024/035151A1 |
A circuit board according to an embodiment comprises a first insulating layer, a second insulating layer arranged on the first insulating layer, and a circuit pattern layer arranged between the first and second insulating layers, wherein...
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WO/2024/034398A1 |
Provided is a resin composition exhibiting excellent high frequency characteristics and heat resistance reliability. The resin composition comprises: (A) a polyphenylene ether resin that has, at a terminal end, a functional group includi...
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WO/2024/032237A1 |
The embodiments of the present application provide a pre-foamed material and a preparation method therefor, a foamed material and a foaming device thereof, a modified polymer, and related uses thereof. The pre-foamed material comprises a...
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WO/2023/241078A9 |
A contact lens (100), comprising a lens body (1), an electronic element (2) and a circuit structure (3). The lens body (1) comprises an optical portion (11) and an annular wearing portion (12) surrounding the optical portion (11), wherei...
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WO/2024/034896A1 |
The present invention relates to a ceramic substrate and a method for manufacturing same, the ceramic substrate comprising: a ceramic base material; a first electrode pattern and a second electrode pattern formed on the upper and lower s...
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WO/2024/034246A1 |
The present invention provides an adhesive base material with a wiring line, the adhesive base material being capable of suppressing the occurrence of a crack or buckling in a wiring pattern that is formed on an adhesive layer. An adhesi...
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WO/2024/033102A1 |
Power module (1) having at least one fixed printed circuit board (4) and power electronics components (2) with connected busbars (5), wherein the power electronics components (2) are in contact with at least one flexible printed circuit ...
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WO/2024/029436A1 |
A metal according to the present invention comprises gallium and bismuth, and may be a liquid metal or comprise a liquid metal and a solid metal at 35°C. The metal may comprise 0.01-30 mass% bismuth. The metal may also comprise one or m...
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WO/2024/029138A1 |
Provided is a composite component device comprising two or more composite component layers including an electronic component layer and a rewiring layer provided to the electronic component layer, wherein: the two or more composite compon...
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WO/2024/029313A1 |
A module (101) comprises: a substrate (1) that has a first surface (1a); a first component (31) that is mounted on the first surface (1a); a first sealing resin layer (61) that is disposed so as to cover a side surface of the first compo...
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WO/2024/030483A1 |
An electrical connector system that can be used to couple a smart garment sensor harness to a control component. Embodiments include a connector plug on an electrical wire cable of the sensor harness and a connector socket on the control...
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WO/2024/031099A1 |
A system configured to control a virtual representation of a user within a virtual environment is disclosed herein. The system can include a foot base configured to receive a user input. The foot base can include a flexible circuit inclu...
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WO/2024/027191A1 |
Provided in the present disclosure are a modification method for a polyphenyl ether resin, a laminated film composite material, a laminated film, and a substrate. The modification method for a polyphenyl ether resin involves the use of a...
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WO/2024/029860A1 |
The present invention relates to a molded electric circuit product for a wearable device, comprising: a plate spring having a predetermined shape and elasticity; external silicone surrounding the inner and outer surfaces of the plate spr...
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WO/2024/028689A1 |
A method, comprising: providing (100) a thermoplastic material with a plurality of electrically conductive particles dispersed therein, the conductive thermoplastic material having a first melting point; providing (102) a rigid support h...
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WO/2024/029979A1 |
A multi-layered flexible printed circuit board of the present disclosure may comprise: a first flexible printed circuit board (FPCB) including a first curved area in which a conductive layer for signal transfer is arranged, wherein the f...
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WO/2024/029536A1 |
Provided is a physical quantity measuring device capable of measuring with high accuracy. A physical quantity measuring device (1) has a first substrate (10) and a second substrate (20) and measures a physical quantity of a measurement o...
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WO/2024/029628A1 |
This wiring board comprises: a first insulating layer; a second insulating layer; a first ground conductor; and a first signal conductor. The first insulating layer has a first upper surface and a first lower surface. The second insulati...
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WO/2024/029729A1 |
An electronic device comprising: a flexible display disposed on a first housing, a second housing, and a hinge structure; a first FPCB disposed on the first housing and the hinge structure; a second FPCB disposed on the second housing an...
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WO/2024/027778A1 |
Provided in the embodiments of the present application is an electronic device. In the electronic device, a metal structural member and a circuit board are stacked and spaced apart, a first conductive member being located between the cir...
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WO/2024/027480A1 |
A middle frame structure, comprising a middle frame provided with a through hole, and a first circuit board, a second circuit board and an adapter board, which are arranged on the middle frame. The through hole is located between the fir...
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WO/2024/027244A1 |
The present application provides a circuit board, a circuit board assembly and an electronic device. The circuit board is used for disposing a first device or a second device, characterized in that the circuit board comprises a mainboard...
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WO/2024/022607A1 |
A process of forming an electric circuit on an insulating ceramic substrate or on an insulating ceramic layer (25) of a substrate (21) that includes depositing a conductive material (23) over a surface of the ceramic substrate or layer; ...
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WO/2024/023010A1 |
An optical system (100) for a lithography machine (1), comprising a circuit board (200) that is made of a composite material (210), wherein a vacuum-tight housing (220) is formed by the composite material (210) in an interior of the circ...
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WO/2024/021629A1 |
The present application provides a film body and a dielectric structure. The film body comprises: a flexible substrate layer (100); and a metal circuit layer (200). The metal circuit layer (200) is provided in the flexible substrate laye...
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WO/2024/022449A1 |
Embodiments of the present application provide a printed circuit board and an electronic device comprising same. The printed circuit board comprises: a plurality of conductive layers; and at least one insulating layer. The plurality of c...
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WO/2024/024365A1 |
A product substrate (100) manufacturing method comprises a first step, a second step, and a third step in this order. In the first step, an intermediate substrate (1) comprising a frame (2), a mounting portion (3), a first joint (4), and...
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WO/2024/024030A1 |
This edible conductive structure comprises: conductive layers (101) composed of an edible conductive material; and hydrophobic layers (102) composed of an edible hydrophobic material. The conductive layers (101) and the hydrophobic layer...
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WO/2024/024525A1 |
Provided are an epoxy resin composition exhibiting excellent low-dielectric properties, an epoxy resin giving the epoxy resin composition, and a method for producing the epoxy resin. The epoxy resin is characterized by comprising an epox...
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WO/2024/020852A1 |
According to various embodiments, a processing subsystem includes a first printed circuit board (PCB); a processor mounted directly on a first side of the first PCB; and one or more power components. The one or more power components are ...
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WO/2024/024184A1 |
The present disclosure provides an electronic control device that can improve electromagnetic compatibility, while preventing a conductive connection part from unnecessarily extending on the surface of a circuit board. This electronic co...
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WO/2024/024160A1 |
[Problem] To enhance freedom of design and prevent the joining of two coil patterns, in a composite electronic component having a structure in which an electronic component is embedded. [Solution] A composite electronic component 1 compr...
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WO/2024/024027A1 |
Provided is a core substrate (601) for constituting an interposer (700) on which a semiconductor element (811) is mounted, an inductor being built into the core substrate (601) . The core substrate (601) comprises a ceramic substrate (10...
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WO/2024/024509A1 |
This current conduction member comprises a mesh-shaped part (14) that includes a mesh (14A) formed by a plurality of electroconductive lines (21A) extending along two directions. The plurality of electroconductive lines (21A) are arrange...
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WO/2024/022077A1 |
The present disclosure relates to a display panel, comprising a display substrate and a flexible circuit board. The display substrate comprises a display area, a binding area, and a bending area positioned between the display area and th...
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WO/2024/024901A1 |
Disclosed is a polyimide precursor composition containing, in prescribed amounts, a polyimide precursor having a repeating unit represented by general formula (I), and at least one imidazole compound as an optional component. By using th...
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WO/2024/021184A1 |
Provided in the present invention is a flexible circuit board. The flexible circuit board of the present invention comprises a substrate, conductive layers formed on the substrate and having gaps, a first cover film covering the substrat...
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WO/2024/024945A1 |
The present invention provides a circuit board comprising: an insulating substrate having a first surface and a second surface located on the opposite side from the first surface; a first region which is located on the first surface and ...
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WO/2024/025348A1 |
According to one embodiment, an electronic apparatus comprises: a printed circuit board including a first non-conductive layer, a conductive pattern disposed on the first non-conductive layer, and a second non-conductive layer, which enc...
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