| Document |
Document Title |
|
WO/2024/075816A1 |
This wiring board comprises a base portion, a dielectric board, and a first signal conductor. The base portion has a first upper surface, a first lower surface, a first side surface, and a first opening portion having an opening in the f...
|
|
WO/2024/076143A1 |
An electronic device according to one embodiment of the present disclosure comprises: a camera module having a viewing angle formed in a first direction; and a recess for accommodating the camera module, wherein: the camera module includ...
|
|
WO/2024/075791A1 |
Provided are a dielectric and a method of manufacturing the same that reduce the frequency dependency of relative permittivity in a terahertz high-frequency band (110 to 330 GHz) of the relative permittivity. In the dielectric, the slope...
|
|
WO/2024/075864A1 |
The present disclosure relates to a printed circuit board capable of improving heat dissipation performance, comprising: a substrate; a solder formed in a predetermined area of the substrate; and a heat transfer metal layer formed betwee...
|
|
WO/2024/075735A1 |
This RFID module comprises: a first substrate having a first main surface and a second main surface that face each other; an RFIC chip disposed on the first main surface-side of the first substrate; a first radiation element disposed on ...
|
|
WO/2024/075456A1 |
This circuit board comprises a fluorine resin layer, a to-be-adhered layer, and an adhesive layer adhering the fluorine resin layer with the to-be-adhered layer. The fluorine resin layer includes polytetrafluoroethylene and a first inorg...
|
|
WO/2024/075218A1 |
In the present invention, an optical device (1) includes a feedthrough substrate (2). The feedthrough substrate (2) is connected to one end of a flexible substrate (3). A cap (4) is fitted onto one end of the flexible substrate (3). The ...
|
|
WO/2024/074743A1 |
The invention relates to a microthruster applicable to space engineering that comprises printed circuit boards (PCBs) connected to each other, wherein the first board comprises a fuel tank (1) and an outlet nozzle (2) and the second boar...
|
|
WO/2024/074905A1 |
Methods, systems, and apparatus for logical reverse computing and circular compression and decompression. In one aspect, a method for compressing a classical binary data input includes obtaining a classical binary data input; performing ...
|
|
WO/2024/076113A1 |
An electronic device according to an embodiment of the present invention may comprise: a housing including a first surface, a second surface, and a lateral surface surrounding a space between the first surface and the second surface; a p...
|
|
WO/2024/076211A1 |
A semiconductor package according to an embodiment comprises: a first insulating layer; a second insulating layer disposed on the first insulating layer; a third insulating layer disposed on the second insulating layer; a fourth insulati...
|
|
WO/2024/075629A1 |
One aspect of the present invention relates to a resin composition comprising: (A) a preliminary reaction product obtained by preliminarily reacting a mixture that includes a maleimide compound (a1) and a phosphorus-containing compound (...
|
|
WO/2024/076040A1 |
According to various embodiments, an electronic device may include a base plate, a side frame connected to the base plate, a front cover covering one side of the base plate, a back cover covering one side of the side frame and provided o...
|
|
WO/2024/075758A1 |
Provided are a composition for obtaining fluororesin sheets excellent in terms of low permittivity, low loss, and low thermal expansion, a fluororesin sheet, and a method for producing the fluororesin sheet. The composition comprises: a ...
|
|
WO/2024/075398A1 |
The present invention reduces the device size of an imaging device that performs rotation correction. This camera module comprises a lens group, a translational actuator, a rotational actuator, and a mounting board. In this camera modu...
|
|
WO/2024/070835A1 |
This glass substrate includes a glass layer and an opening open on a first main surface side of the glass layer. The thickness of the glass layer is 10 to 300 μm inclusive, and there is no burr at a first main surface-side edge of the o...
|
|
WO/2024/070245A1 |
Provided is a surface-treated copper foil having a copper foil and a surface-treatment layer formed on at least one surface of the copper foil. The surface-treatment layer has a peak material volume Vmp of 0.010-0.080 µm3/µm2 and has a...
|
|
WO/2024/067249A1 |
A circuit board (120), a backlight module (220), a display module, and an electronic device. The circuit board (120) comprises at least two sub-boards (10) spaced apart from each other; the sub-boards (10) extend in a first direction (y)...
|
|
WO/2024/070087A1 |
Provided is a joint structure for a flexible printed-wiring board, with which it is possible to enhance the short circuit-suppressing effect. The present invention is characterized in that: an FPC 10 comprises a base film 100, a plural...
|
|
WO/2024/070246A1 |
Provided is a surface-treated copper foil including a copper foil and a surface-treated layer formed on at least one surface of the copper foil. The average depth Svk in valley parts in the surface-treated layer is 0.35 to 0.63 μm.
|
|
WO/2024/070529A1 |
This capacitor element 1 comprises: a capacitor unit 10 that includes an anode plate 11 having a porous part 11B on at least one main surface of a core part 11A, a dielectric layer 13 provided on the surface of the porous part 11B, and a...
|
|
WO/2024/070247A1 |
Provided is a surface-treated copper foil that has a copper foil and a surface-treated layer which has been formed on at least one surface of the copper foil. The peak material volume Vmp of the surface-treated layer is 0.022-0.060 μm3/...
|
|
WO/2024/072097A1 |
An embodiment comprises: a fixed part; and a moving part that includes a first circuit board, a second circuit board disposed below the first circuit board, and an image sensor, and moves, in a direction perpendicular to an optical axis ...
|
|
WO/2024/066782A1 |
The present application relates to the technical field of electronic products. Provided are a circuit board assembly and an electronic device, which are used for solving the problem of high-density layouts of surfaces of circuit boards. ...
|
|
WO/2024/071069A1 |
A wiring board according to the present disclosure comprises: an insulating board that has a first surface and a second surface which is positioned on the reverse side from the first surface; and a solder resist that is positioned on the...
|
|
WO/2024/068546A1 |
The invention relates to an electrical device with at least one circuit carrier comprising a carrier substrate made of an electrical insulation material. On at least one outer face of the circuit carrier, an electrical conductor structur...
|
|
WO/2024/070026A1 |
The present invention concerns a method for manufacturing a package of a power semiconductor and a package comprising a power semiconductor. The package comprises: conducting layers over each electrode of the power semiconductor, nanowir...
|
|
WO/2024/071129A1 |
Provided are: an epoxy resin composition that exhibits excellent low dielectric properties and excellent copper foil peeling strength and interlayer adhesive strength in printed wiring board uses; and an active ester resin that provides ...
|
|
WO/2024/070959A1 |
This wiring board comprises a substrate, a signal line positioned on the substrate, and a waveguide-type waveguide path positioned on the substrate. The signal line has a first end portion, which is one end in a direction in a signal tra...
|
|
WO/2024/070808A1 |
Provided is a photosensitive film provided with a photosensitive resin composition layer comprising a photosensitive resin composition, in which the photosensitive resin composition layer has a thickness of 20 μm or more, the photosensi...
|
|
WO/2024/070495A1 |
Provided are: a resin composition capable of ensuring adhesion of a fluororesin, when employed in a substrate material in which the fluororesin is laminated on a metal substrate or the like, while enhancing the filling properties of an i...
|
|
WO/2024/066356A1 |
Disclosed are a differential arrangement structure (100) and a printed circuit board. The differential arrangement structure (100) comprises one or more differential units (10), wherein each differential unit (10) at least comprises a fi...
|
|
WO/2024/067668A1 |
The present application discloses a circuit board apparatus and an electronic device. The disclosed circuit board apparatus comprises a circuit board, a first chip, and a cooling element; the circuit board is provided with an accommodati...
|
|
WO/2024/068349A1 |
A method for fabricating a circuit board arrangement (14) comprises: providing a circuit board panel (140) forming at least one circuit board section (140A-140D), a remaining panel section (142) and at least one support portion (144A, 14...
|
|
WO/2024/066481A1 |
The present application provides a circuit board assembly and an electronic device. The circuit board assembly comprises a circuit board, a chip, a shielding cover and a conductive structure. The circuit board comprises a first surface a...
|
|
WO/2024/071083A1 |
This circuit board comprises a board, a first multilayered ceramic capacitor, and a second multilayered ceramic capacitor adjacent to the first multilayered ceramic capacitor. The dimension of the first multilayered ceramic capacitor in ...
|
|
WO/2024/072120A1 |
According to an embodiment of the present invention, an electronic device may comprise a wireless communication circuit, an antenna structure, a non-conductive dielectric, and a conductive path. The antenna structure may comprise a print...
|
|
WO/2024/070619A1 |
The present invention addresses the problem of providing a laminate that has excellent level difference conformability and excellent adhesion when the laminate is bonded to an object having a level difference by thermocompression. The pr...
|
|
WO/2024/072050A1 |
An electronic device may be provided. The electronic device may comprise: a first housing including a first cover member and a frame positioned inside the first cover member; a second housing including a second cover member at least part...
|
|
WO/2024/072343A1 |
The invention is related with a Cu(Ag) film production method in an electrochemical coating method in a mixture of green components such as choline chloride and ethylene glycol, achieved Cu(Ag) film can be used in the coating of circuit ...
|
|
WO/2024/070531A1 |
A capacitor element 1 comprises: capacitor parts 10 each comprising an anode plate 11 including a porous part 11B disposed on at least one main surface of a core 11A, a dielectric layer 13 disposed on the surface of the porous part 11B, ...
|
|
WO/2024/066646A1 |
A printed circuit board via hole structure and a printed circuit board. The printed circuit board via hole structure comprises signal holes (200) and at least one ground via hole (100). The signal holes and the ground via hole penetrate ...
|
|
WO/2024/070628A1 |
A bonded structure which comprises a first conductive member, a second conductive member, and a solder bonding part for bonding the first conductive member and the second conductive member to each other, wherein at least one of the first...
|
|
WO/2024/070319A1 |
The purpose of the present invention is to provide a glass substrate with which it is possible to form a through-electrode provided with excellent transmission characteristics, and a multilayer wiring substrate equipped with such a glass...
|
|
WO/2024/072186A1 |
A semiconductor package according to an embodiment comprises: an insulation layer; a plurality of electrode parts including a through-part extending therethrough from the upper surface of the insulation layer to a partial area thereof; a...
|
|
WO/2024/070320A1 |
The purpose of the present invention is to provide: a glass substrate in which it is possible to form a through-electrode having favorable transmission properties; and a multilayer wiring substrate equipped with said glass substrate. A...
|
|
WO/2024/068536A1 |
The invention relates to a switching apparatus (1) for a printed circuit board (14), the switching apparatus (1), for applying signal lines to a board-to-board connector (8), comprising: - a plurality of connection pins (2) for a board-t...
|
|
WO/2024/072042A1 |
An electronic device according to one embodiment of the present disclosure may comprise: a housing; a circuit board disposed in the housing; a first component and a second component disposed on one surface of the circuit board; a shieldi...
|
|
WO/2024/070518A1 |
This wiring board comprises a first base material having a first main surface, a second base material having a second main surface, a first wire disposed on the first main surface, and a second wire disposed on the second main surface. T...
|
|
WO/2024/070883A1 |
A semiconductor module according to one aspect of the present disclosure comprises: a first substrate; a second substrate; and a third heat dissipation member. The first substrate is provided with a first semiconductor element on one mai...
|
