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Patent Searching and Data


Matches 1 - 50 out of 157,488

Document Document Title
WO/2021/090730A1
Provided is a resin composition having excellent dielectric properties, high adhesiveness to low-roughness surfaces, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene et...  
WO/2021/091144A1
The invention, which relates to a connecting element (1) for connecting a circuit board (2) to a heat sink (3) and a method for establishing the connection, is intended to solve the problem of identifying a simple and inexpensive solutio...  
WO/2021/091264A1
An electronic device includes a housing including a front surface, a rear surface, and a side surface which at least partially surrounds a space between the front surface and the rear surface, a first antenna disposed in the space, a sec...  
WO/2021/091824A1
A process of fabricating an electromagnetic circuit includes providing three laminate sheets, forming a first feature in a first laminate sheet of the three laminate sheets, and forming a second feature in a second laminate sheet of the ...  
WO/2021/090630A1
An insulating resin composition comprising an organic material and an inorganic filler, wherein the organic material contains an epoxy resin, a curing agent, a phosphate ester compound having one or more hydroxyl group per molecule, a he...  
WO/2021/088336A1
Disclosed by the present application is a fabrication method for PCB that has an internally embedded ceramic piece and a PCB thereof. According to the present application, a ceramic piece (12) is semi-embedded into a PCB (10), and a semi...  
WO/2021/091743A1
A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive c...  
WO/2021/090785A1
Provided is an electronic device capable of holding, with high positional accuracy, an electronic element on a metal wiring pattern formed on a deformable base material and maintaining electrical bondage by suppressing melting and flowin...  
WO/2021/089286A1
The invention relates to an assembly (1) of light sources comprising: an integrated circuit (2) with a connection pad (23), a light-emitting part with micro-LEDs (3) and an active surface (4), a fan-out encapsulation (5) surrounding at l...  
WO/2021/090629A1
Provided is an insulating resin composition comprising an organic material and an inorganic filler, wherein the organic material comprises an epoxy resin, an amine-type curing agent, a phosphate ester compound having at least one hydroxy...  
WO/2021/091166A1
The present disclosure relates to a printed circuit board and an electronic apparatus including same. The printed circuit board according to an embodiment of the present disclosure may comprise: a first ground layer including at least on...  
WO/2021/092463A1
A method is provided for modifying a via from a PCB including a plurality of subassemblies comprising a plurality of layers. The method may include drilling a via of the PCB to form a through-hole to remove an unwanted material in the vi...  
WO/2021/089974A1
A method and apparatus for conducting heat away from a semiconductor die are disclosed. A board assembly is disclosed that includes a circuit board, a semiconductor die electrically coupled to the circuit board and a Chemical Vapor Depos...  
WO/2021/091109A1
Provided is an electronic device. The electronic device may include a housing; a first printed circuit board (PCB) disposed in an internal space of the housing and including a plurality of first conductive terminals; a second PCB arrange...  
WO/2021/088353A1
Disclosed is a low-dielectric polyimide circuit board, which is obtained by the following steps: adding a polyimide and a thermally conductive filler to dimethylformamide, and stirring same and mixing same until uniform, to obtain a poly...  
WO/2021/085964A1
An electronic device and oscillator structure are provided. The electronic device includes a printed circuit board, an oscillator configured to oscillate at a frequency corresponding to an operation clock of the electronic device, and a ...  
WO/2021/084783A1
A liquid-droplet-like semiconductor chip ink 200 contains a liquid 50 and semiconductor chips 40 having first electrodes and second electrodes on upper surfaces and lower surfaces, and is configured such that the second electrode side po...  
WO/2021/082734A1
Provided in embodiments of the present invention are a circuit board device and a processing method thereof, and a mobile terminal. The circuit board device comprises a circuit board, a functional device and multiple capacitors. The func...  
WO/2021/083056A1
Provided is a circuit board device, including a first circuit board (100) and an encapsulation module (200), the encapsulation module (200) includes an encapsulation substrate (210), a first electronic component (220), a plastic encapsul...  
WO/2021/083159A1
Disclosed are a battery protection board (62) and a manufacturing method therefor. The battery protection board (62) comprises: a hard board (11) and a flexible board (12), wherein the flexible board (12) and the hard board (11) are conn...  
WO/2021/084601A1
In the present invention, a high-frequency line substrate (2-1) is mounted on a printed board (2-2). The printed board (2-2) is provided with a first high-frequency line. The high-frequency line substrate (2-1) is provided with a second ...  
WO/2021/085587A1
This wiring board is provided with: an insulation board having a first surface; and a wiring conductor located in the insulation board. The insulation board includes a plurality of SiC bulk crystallites having different polytypes from on...  
WO/2021/085413A1
This mount board 1 has a base part 2a and a frame part 2b. The base part 2a has a first upper surface 6a including a first mount region 4a. The frame part 2b has: a second upper surface 6b including a second mount region 4b; and an inner...  
WO/2021/081867A1
A thin circuit board (100) and a manufacturing method therefor. The thin circuit board (100) comprises: a dielectric layer (40); an inner layer circuit substrate (30); and a metal layer (50) provided on at least one side of the inner lay...  
WO/2021/082164A1
Disclosed is a high-frequency, low-loss, adhesive-free flexible copper clad laminate (100), comprising two layers of copper foil (1) arranged at the top and bottom, fluorine resin films (2) respectively formed on inner surfaces of the tw...  
WO/2021/081588A1
An electronic module includes therein and/or on a surface thereof one or more sets of electronic circuitry. The one or more sets of electronic circuitry providing the electronic module with a first communications means for communicating ...  
WO/2021/085417A1
The present invention addresses the problem of providing a method for manufacturing a printed wiring board and a printed wiring board that do not cause fiber flocks when the printed wiring board is cut off and can prevent fuzzing. A meth...  
WO/2021/081957A1
The present application relates to the technical field of display, and disclosed are a display panel, a preparation method therefor, and a display device. The display panel comprises: a rigid base substrate; a flexible insulating layer, ...  
WO/2021/084914A1
A flexible printed board with a terminal according to the present invention is provided with: a flexible printed board which has a conductive path; and a terminal which is soldered to the flexible printed board. The flexible printed boar...  
WO/2021/084897A1
The purpose of the present invention is to improve the thermal performance of a heat-generating component. A heat-transfer-member-equipped substrate that comprises a substrate, a heat transfer member that is provided in a through hole in...  
WO/2021/082287A1
The present application relates to an electronic device and a camera module therefor. The camera module comprises a lens as well as a photosensitive element and a reflective prism provided on opposite sides of the lens, and also comprise...  
WO/2021/081825A1
An alternating current electric tool, comprising: a housing on which a handle portion for a user to hold is formed, an accommodating space being formed in the handle portion; an alternating current unit configured to access an alternatin...  
WO/2021/085191A1
The present invention provides a thermosetting resin composition that makes it possible to obtain a cured product having a low dielectric constant, a low dielectric dissipation factor, and high heat resistance. The thermosetting resin co...  
WO/2021/085490A1
Provided is a ceramic substrate comprising a first main surface, a second main surface, and an identification part for identifying the directions of the first main surface and the second main surface. Provided is a composite substrate co...  
WO/2021/083454A1
The invention relates to a circuit board with an upper face and a lower face, wherein the circuit board comprises at least two circuits, with each of the at least two circuits comprising at least one conductor track and at least one curr...  
WO/2021/084632A1
A thermosetting resin film and a thermosetting resin film with copper foil that enable formation of microcircuits with L/S = 15μm or less/15μm or less on a flexible printed circuit board; a manufacturing method of a laminate film for a...  
WO/2021/079817A1
An aspect of the present invention is a metal clad laminate comprising: an insulating layer including a cured product of a resin composition containing a polymer having a structural unit represented by formula (1) in the molecule thereof...  
WO/2021/079670A1
As an adhesive composition which exhibits excellent long term durability in moist heat environments and excellent adhesive properties, the present invention provides an adhesive composition for a flexible printed wiring board, which cont...  
WO/2021/079510A1
Provided is an optical semiconductor device in which a first conductive pattern (13) is provided to the upper surface of a sub-mount (7). A GND pattern (9) is provided to the lower surface side of the sub-mount (7). A lower surface elect...  
WO/2021/079659A1
Provided is an electrically conductive pillar that can bond a base material and a member to be bonded with a high bonding strength with a bonding layer interposed, and the method for manufacturing said electrically conductive pillar. I...  
WO/2021/081041A1
A touch sensor for a cursor control device includes a support layer, a first printed layer, and a second printed layer. The support layer includes a first surface and a second surface opposite from the first surface. The first printed la...  
WO/2021/079900A1
This disclosure provides a resin composition containing an inorganic filler and having excellent moldability. The resin composition contains a thermosetting resin (A) and an inorganic filler (B). The inorganic filler (B) contains a first...  
WO/2021/079450A1
This package (800) comprises a mounting surface (SM) where an electronic component (902) is mounted, a cavity (CV) which is located on the mounting surface (SM), and an attachment surface (SF) where a lid (907) for sealing the cavity (CV...  
WO/2021/080200A1
The present invention comprises: a circuit board; a laser diode mounted on the circuit board; a photodiode mounted on the circuit board; and a driving integrated circuit which is mounted on the circuit board and drives the laser diode an...  
WO/2021/078016A1
A flexible circuit board and an electronic device comprising the flexible circuit board. The flexible circuit board comprises a flexible substrate, at least one high-speed trace and a multilayer conductive reference layer; both the high-...  
WO/2021/079819A1
One aspect of the present invention provides a copper-clad laminate which is provided with: an insulating layer that contains a cured product of a resin composition containing a polymer that has a structural unit represented by formula (...  
WO/2021/079945A1
A substrate inspection method for inspecting a touch panel substrate P in which Y-electrodes and X-electrodes are disposed opposite each other. The substrate inspection method comprises: a first selecting step for selecting, when the num...  
WO/2021/080325A1
A printed circuit board according to an embodiment comprises: an insulating layer; and a via disposed in the insulating layer, the via comprising: a first pad disposed at the bottom of the insulating layer; a second pad disposed at the t...  
WO/2021/080305A1
A printed circuit board according to an embodiment comprises: a first insulating layer; a second insulating layer disposed on the first insulating layer and comprising a cavity; and a pad disposed on the first insulating layer and of whi...  
WO/2021/078647A1
An electronic card (1) comprising: - a first card portion (10) comprising lightning protection components (16), a first ground plane (17) and a first ground zone (18); - a second card portion (11) comprising functional components (22), a...  

Matches 1 - 50 out of 157,488