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WO/2024/044286A1 |
A solid-state circuit breaker (SSCB) includes an airgap operating mechanism including components and electronics including semiconductors and software algorithms that control the power and can interrupt extreme currents. The SSCB further...
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WO/2024/043691A1 |
A lidar device disclosed in embodiments may comprise: a main frame within which an accommodation part is provided; a plurality of transceivers which are disposed in the accommodation part, emit laser beams toward an object in different d...
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WO/2024/041809A1 |
The invention relates to an automation field device (10) having: - a field device housing (12); - field device electronics (15) that is placed in the field device housing and includes at least one printed circuit board (15a); - a PCB hol...
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WO/2024/041017A1 |
Provided in the present disclosure is an electronic device, comprising: a housing; a working assembly, installed in the housing, the working assembly comprising a circuit board and a heat dissipation component, and the circuit board comp...
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WO/2024/040867A1 |
Disclosed in embodiments of the present application is a liquid cooling system. The liquid cooling system comprises a liquid cooling tank, a server immersed in a coolant in the liquid cooling tank, a dry cooler, a heat exchanger, a refri...
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WO/2024/041364A1 |
A cooling system of a data center, which system belongs to the field of data centers. The system comprises: a cooling device, a first conveying device, a solar-powered heat collection device, a first phase-change material energy storage ...
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WO/2024/037386A1 |
A cooling system, which comprises: a cold source, configured to provide a coolant; an air cooling part, configured to use a gas for cooling an electronic device, the air cooling part comprising a first liquid inlet and a first liquid out...
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WO/2024/039375A1 |
In various embodiments, a cooling system comprises a central cooling unit, a memory storing a heat transfer control application, and a processor coupled to the memory that when executing the heat transfer control application determines a...
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WO/2024/036886A1 |
The embodiments of the present application relate to the technical field of heat dissipation. Provided are a vapor chamber and an electronic device. When the thickness of the vapor chamber is less than or equal to 0.3 mm, the thermal con...
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WO/2024/038704A1 |
[Problem] To reduce the cost of producing a plane contact type heat exchanger and reduce the size of the heat exchanger. [Solution] A plane contact type heat exchanger comprising: a cup plate 1 comprising a flat bottom 1a having a rim 1c...
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WO/2024/039087A1 |
Disclosed are a coupling member and a power electronic device including same. A coupling member according to an aspect of the present invention is a coupling member that is removably coupled to an external power electronic device, and in...
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WO/2024/037945A1 |
The present subject matter relates to an electric power converter, and more specifically, relates to improved fixation of a module in an electric power converter by means of an elastic member. An electric power converter (100), in accord...
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WO/2024/036525A1 |
Provided in the present application are a thermally conductive structure, an electronic device, and a terminal. The thermally conductive structure comprises a thermally conductive portion and an insulation ring, wherein the upper side an...
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WO/2024/037913A1 |
The invention relates to a converter (7) for converting a fed type of current into another, having at least one power module (1) and having at least one cooling body (3), wherein the power module (1) and the cooling body (3) are thermall...
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WO/2024/039451A1 |
A storage drive assembly is provided. The storage drive assembly includes a storage drive sized and shaped for insertion into a slot within a chassis, a latching mechanism coupled to a first end of the storage drive, the latching mechani...
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WO/2024/037278A1 |
The present application provides a heat dissipation apparatus, a circuit board, a communication device, a communication base station, and an electronic device. The heat dissipation apparatus comprises a substrate (100) and at least one h...
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WO/2024/039265A1 |
The invention relates to acoustics. An electrodynamic transducer comprises a frame having attached thereto two pairs of jaws which are adjustably positionable and fastenable along the longitudinal axis of the frame, a magnet system arran...
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WO/2024/037306A1 |
The present application relates to the technical field of cooling devices, and provides a cooling integrated system, which is used for cooling a computing device provided with a cooling channel. The cooling integrated system comprises a ...
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WO/2024/033674A1 |
A method and a cooling system which use a dissipation unit (E) having a heat sink (2) and a cover (3); wherein the heat sink (2) transmits by conduction the heat (H) of said source (C) to a porous body (14), which is inserted inside the ...
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WO/2024/034833A1 |
An electronic device according to one embodiment comprises: a housing; a first bracket including a through hole; a first display movable with respect to the first bracket; a printed circuit board; a fan disposed between the printed circu...
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WO/2024/033920A1 |
The present invention relates to a wall plate device embeddable within a wall or other fixed medium, comprising : a housing comprising a rear cover optionally in the form of a box and a front panel; a suction opening placed at the fronta...
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WO/2024/032630A1 |
A heat dissipation device and a method for controlling the surface temperature of a circuit board. The device comprises: a heat dissipation structure (101), which is arranged parallel to the top of the circuit board, and is configured to...
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WO/2024/034854A1 |
This electronic device comprises: a housing having a space therein and including a heat-dissipation passage penetrating from one side to another side; an electronic part disposed in the space; and a heat-dissipation member which is dispo...
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WO/2024/031900A1 |
The present application relates to the technical field of servers, and discloses a liquid-cooled server cabinet, comprising: a cabinet body, a server, a liquid collection tank, a distribution manifold, and a flow detection, regulation an...
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WO/2024/036163A1 |
A two-phased liquid-cooled electrical power apparatus includes a plurality of cooling circuits that recirculate and transition respective engineered fluids between liquid and vapor states around closed-loop fluid paths to cool a pluralit...
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WO/2024/033704A1 |
An assembly for stacking a plurality of circuit boards of an electronics package is provided. The assembly may comprise a chassis structure, a first plurality of printed circuit board (PCB), and a second plurality of PCBs, where the seco...
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WO/2024/034578A1 |
This substrate fixing structure secures, to a fixing destination member, a substrate comprising a heating component on a first surface so that a second surface faces the fixing destination member side. A first spacer is disposed between ...
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WO/2024/034635A1 |
Provided is a container device capable of cooling an electric power device contained therein. A container device 1 comprises a housing 10, and a container unit that is provided inside the housing 10 to contain a contained item in a rem...
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WO/2024/033351A1 |
An interface module according to some embodiments includes a cage, such as a small form factor pluggable (SFP) cage, configured to guide a signal connector towards an interface for connection with the signal connector. The cage includes ...
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WO/2024/031978A1 |
Provided in the present disclosure are a test clamp and a test apparatus. The test clamp comprises a clamp assembly, a driving assembly and a heat dissipation assembly, wherein the clamp assembly comprises a cover plate, a probe plate an...
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WO/2024/035338A1 |
A computer room cooling system including a plurality of bifurcated heated air return pathways for heated air generated by a plurality of server rack rows 15C operating in a computer room 15 with a false ceiling plenum 16 and a heated air...
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WO/2024/035235A1 |
An electronic device according to an embodiment of the present disclosure may comprise: a first housing; a second housing; a hinge structure connected to the first housing and the second housing to enable the first housing and the second...
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WO/2024/033203A1 |
The invention relates to a cooling system (100), preferably for a motor vehicle, preferably an autonomous or semi-autonomous driving motor vehicle, having a first and a second cooling circuit (10, 20), which are or can be thermally conne...
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WO/2024/031161A1 |
The present utility model relates to a structural arrangement for a power supply with a double fastening system, which is intended to overcome the disadvantages of the prior art by means of a power supply (100) for low-voltage LED light ...
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WO/2023/246423A9 |
A heat dissipation film, a display module and a display device, which relate to the technical field of displays. The heat dissipation film comprises a foam tape layer, and a metal layer, which is laminated on a side of the foam tape laye...
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WO/2024/032146A1 |
The present disclosure belongs to the technical field of display screens, and relates to a casing frame (1) and an LED display screen. The casing frame (1) comprises a frame border (11), the frame border (11) comprising a plurality of co...
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WO/2024/034632A1 |
A vapor chamber according to the present disclosure comprises: a vapor chamber body that has a first surface, a second surface positioned opposite the first surface, and an inner space portion that is positioned between the first surface...
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WO/2024/033202A1 |
The invention relates to a cooling system (100), preferably for a motor vehicle, comprising a battery cooling circuit (10) for cooling a battery device (12) and comprising power electronics (21), preferably for processing data for an aut...
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WO/2024/034291A1 |
The present invention suppresses the occurrence of a deviated flow distribution in a cooler and the increase in pressure loss. A cooler (10) comprises, inside a container (14): a first flow path (14e) disposed parallel with a first sid...
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WO/2024/033153A1 |
The present invention relates to a sled (10, 70, 80, 84) for an orthogonal-direct, OD, chassis (90, 100), comprising: a frame (12); a plurality of connection elements (14) for establishing an OD connection with one or more other sleds of...
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WO/2024/034279A1 |
This heat dissipation device 1A comprises: a casing 100 which has a first inner surface 10a and a second inner surface 10b opposite one another in a thickness direction T and is provided with an internal space; a working medium 20 which ...
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WO/2024/031409A1 |
A vehicle-mounted display device (10) and a control method therefor. The vehicle-mounted display device (10) comprises a display main body (11) and a heating structure (12); the display main body (11) is provided with a bending area (11a...
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WO/2024/028146A1 |
The invention describes a technology for dissipating heat from an electrical circuit. According to one aspect, a device (100) comprises a heat sink (110) and at least one heat transfer module (120). The heat sink (110) has a heat sink ba...
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WO/2024/028065A1 |
The invention is about a refrigerant module for a thermal management system, comprising a first refrigerant distribution unit (RU-1), and a second refrigerant distribution unit (RU-2), each of the first and second refrigerant distributio...
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WO/2024/026980A1 |
Embodiments of the present application provide a heat dissipater module, comprising a heat dissipater and a fastener used for fixing the heat dissipater to a corresponding heating body. Slots are symmetrically formed on the outer surface...
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WO/2024/029008A1 |
An electronic control device (1) comprises: a housing (2) in which a circuit board (6) is sealed and accommodated; a first heat dissipation fin (21a) provided to the lower surface of the housing (2); a second heat dissipation fin (22a) p...
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WO/2024/027698A1 |
Provided in the embodiments of the present application is a foldable device. A first shell and a second shell of the device are rotationally connected by means of a rotating shaft mechanism; and a first cavity is formed between a flexibl...
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WO/2024/027303A1 |
The present application provides a heat dissipation device and an electronic apparatus, which are used for improving the efficiency of heat conduction between the heat dissipation device and a hard disk, thereby improving the heat dissip...
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WO/2024/027543A1 |
A cooling medium distribution device (120), a heat dissipation cabinet and a server system (100). The cooling medium distribution device (120) comprises: a first heat exchanger (121), a second heat exchanger (123), a liquid storage tank ...
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WO/2024/029311A1 |
This composite material is plate-shaped and has a first surface and a second surface that is a surface opposite to the first surface. The composite material comprises a plurality of first layers and at least one second layer. The first s...
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