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Patent Searching and Data


Matches 351 - 400 out of 100,253

Document Document Title
WO/2023/234907A1
The invention is a smart lock system (1) consisting of a login panel (2) for users to enter the information defined for the purpose of system activation, a control panel (3) used for checking the entered passwords and activation of the s...  
WO/2023/231657A1
The present application provides an optical module. The optical module comprises: a housing assembly; an optical assembly, disposed in the housing assembly; and a heat dissipation elastic sheet, sandwiched between the optical assembly an...  
WO/2023/233869A1
This semiconductor device comprises: a semiconductor package; a cooler for cooling the semiconductor package; a sealing member that is provided interposed between the semiconductor package and the cooler, the sealing member having an ope...  
WO/2023/232027A1
An electric pump (100), comprising a rotor assembly (121) and a control board assembly (15), and further comprising a first cavity (27) and a second cavity (281) which are not in communication. The rotor assembly (121) is located in the ...  
WO/2023/232323A1
The invention relates to a device comprising at least one exchangeable electronics assembly (25) of a motor vehicle, wherein the electronics assembly (25) is designed to cooperate with an insertion mechanism (18) of a housing (11) for re...  
WO/2023/231494A1
A charging device, comprising a housing, a charging unit, and fans. The housing is provided with an accommodation cavity; the housing is provided with air inlets and air outlets communicated with the accommodation cavity; the charging un...  
WO/2023/235398A1
An electronics packaging assembly configured to facilitate heat transfer includes a housing having an electronics compartment configured to house at least one electronic component therein. The electronics packaging assembly also includes...  
WO/2023/232539A1
The invention relates to an assembly (1) for a power electronics module of a motor vehicle, having: - a first component (2) with at least one first, interference signal-emitting electrical component (5) and an electrically insulating lay...  
WO/2023/234660A1
The present invention relates to a heat sink structure and a manufacturing method thereof, which fix, through laser welding, a plurality of radiation fin portions radiating heat at a radiation surface of a heat sink body portion, so as t...  
WO/2023/234113A1
An electrical connection box 10 of the present disclosure comprises a housing 20 and a bus bar 30 attached to the housing 20, wherein: the housing 20 is provided with a shared fuse mount part 21 mounted with at least two fuses including ...  
WO/2023/235059A1
Technology is disclosed for a computing system with a printed circuit board having a top and bottom; an integrated circuit component coupled to the top of the board; a passive heat exchanger coupled to the top of the board and spaced fro...  
WO/2023/235244A1
A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. T...  
WO/2023/232204A1
A cooling arrangement comprising a housing (2), in particular a housing of a control device (1) or of a sensor, comprising a component to be cooled, which is arranged in the housing (2) of the cooling arrangement, and comprising a first ...  
WO/2023/229619A1
A chassis is provided for supporting electronic device circuitry. The chassis includes a mounting surface on a first side of the chassis and a cooling surface on a second side of the chassis opposite the mounting surface. The cooling sur...  
WO/2023/228676A1
A resin component for a cooling structure, comprising a first resin portion 100A and a second resin portion 100B that is joined to the first resin portion, wherein a first joint surface of the first resin portion that is joined to the se...  
WO/2023/226961A1
The present disclosure relates to a heat dissipation structure, a display module, an electronic device and a processing method for the display module. The heat dissipation structure comprises a heat dissipation layer, a supporting layer ...  
WO/2023/228838A1
Disclosed is a highly versatile branch circuit unit that can accommodate an increase or decrease in the number of branches, while maintaining excellent space efficiency and handleability. A branch circuit unit 10 comprises: a basic uni...  
WO/2023/226445A1
Disclosed in the present application are a heat dissipator and a communication device. The heat dissipator comprises a heat dissipation substrate (110), at least two heat dissipation fins (120), and at least one strip-shaped heat dissipa...  
WO/2023/226165A1
The present invention relates to the technical field of antennas. Provided in the present application are a communications-on-the-move antenna and a vehicle. The communications-on-the-move antenna comprises a housing and an antenna body ...  
WO/2023/229229A1
An electronic device according to various embodiments of the present disclosure comprises: a housing; a component bracket arranged in the housing, the component bracket having a first recess formed in a first surface facing a first direc...  
WO/2023/226299A1
The present invention relates to an air conditioner using a water vapor refrigerant for a modular data center and a data center comprising same. The air conditioner using a water vapor refrigerant for a modular data center in the present...  
WO/2023/229794A1
An electric drive unit includes an electric motor and a housing that houses the electric motor. The housing includes a heat exchanging wall portion that includes an inner surface that defines a fluid jacket cavity for conveying a first f...  
WO/2023/225790A1
The present disclosure relates to the technical field of display, and provides a flexible circuit board and a display module. The flexible circuit board comprises a flexible substrate (100), a driving chip (200) and a protective layer (3...  
WO/2023/229621A1
A chassis is provided for supporting electronic device circuitry. The chassis generally includes a mounting surface on a first side of the chassis and a cooling surface on a second side of the chassis opposite the mounting surface. The c...  
WO/2023/227017A1
A fin assembly and an evaporator thereof. The fin assembly comprises a fin assembly. The fin assembly comprises at least one first fin and at least one second fin, and the first fin and the second fin are stacked; the first fin comprises...  
WO/2023/226745A1
The present application provides a heating module, a heat dissipation apparatus, and a communication device. The heating module comprises a housing, a first heating component, and a floating cover plate. The first heating component is ar...  
WO/2023/227552A1
The invention relates to an assembly (300) comprising a circuit board (140) on which a semiconductor light source (150) is mounted. The assembly comprises an adhesive sheet (120; 220; 320), a sheet of thermally conductive material (130; ...  
WO/2023/228278A1
A rack (110) comprises a first to a fourth column members (11 to 14), and a first and a second guide members (15A, 15B). A casing of an electric device (20) has a first and a second side surfaces in the width direction that are respectiv...  
WO/2023/226608A1
Provided in an embodiment of the present application is an electronic device, comprising at least a shell and a first display. The shell comprises a first frame body, a second frame body, and a hinge. The hinge is connected to the first ...  
WO/2023/227338A1
For an electronic assembly (1), in particular an electronic power assembly for hybrid vehicles or electric vehicles, comprising a printed circuit board (10), further comprising an electronics unit (20), in particular a power electronics ...  
WO/2023/227485A1
There is provided an industrial monitoring apparatus, comprising: a housing having walls, a top and a base; a computer assembly arranged in the housing, the computer assembly arranged to be conductively cooled and comprising: a computer ...  
WO/2023/227665A1
A base module (2) has a base-connection surface (13) with a first opening (22), wherein a protrusion (49) is formed so as to run around the first opening (22). A function module (3) has a function-connection surface (15) with a second op...  
WO/2023/227705A1
The invention relates to a frequency converter kit (100) comprising: - base units (1) comprising: - a first plug-in connector by means of which the base units (1) are connectable to an AC voltage grid; - a power electronics system; - a h...  
WO/2023/229618A1
A chassis is provided for a circuit board, the chassis having a heatsink. The chassis includes a plurality of fins extending from the chassis for extracting heat from electronics mounted on the chassis. The plurality of fins are organize...  
WO/2023/226977A1
Provided in the present application are a heat exchange device and a heat exchange system. The heat exchange device has a first heat exchange mode and comprises a shell, a partition plate, an evaporator, and a compressor, and the partiti...  
WO/2023/229026A1
This cooling unit has: a first cold plate and a second cold plate; an inflow pipe; and an outflow pipe. The first cold plate and the second cold plate are respectively disposed on both sides of a heat-generating component in a first dire...  
WO/2023/228438A1
In the present invention, a plate-shaped heat dissipation fin installed on the main surface of a base plate comprises: a fin root part which extends from one end to the other end of the plate-shaped heat dissipation fin in the width dire...  
WO/2023/222846A1
The present invention is related to an apparatus and a process for distilling a solvent using the heat released by a semiconductor configured to be working at a predetermined operational temperature and pressure.  
WO/2023/221682A1
The present application relates to the technical field of communication. Disclosed are a circuit board module (210) and a communication device (1), with the aim of improving the heat dissipation performance of the circuit board module (2...  
WO/2023/221289A1
An air duct member (1) and a household appliance comprising same. The air duct member (1) comprises an air inlet channel (11) and air outlet channels (12) that are communicated with each other; the number of the air outlet channels (12) ...  
WO/2023/224015A1
This cooling structure comprises: an outer packaging material provided with an inlet and an outlet for a refrigerant; and an inner core material disposed in the outer packaging material. The inner core material has a shape having project...  
WO/2023/224254A1
A PCB cooling apparatus, for cooling a PCB by contacting one surface of the PCB, according to the present invention, comprises: a base member; a channel provided in the base member to allow a cooling medium to flow; an inlet provided in ...  
WO/2023/222346A1
A liquid cooling apparatus and system for the immersion cooling of electronic devices including in particular servers and other IT hardware nodes having an array of heat generating devices including microprocessors, RAM, motherboards etc...  
WO/2023/224017A1
This cooling structure has an outer covering material in which a coolant inlet and outlet are disposed. The outer covering material has a metal layer and a resin layer disposed on at least one side of the metal layer, and has a conductio...  
WO/2023/222168A1
The present invention relates to an electronic device (1) and to transport means comprising such an electronic device (1). The electronic device (1) comprises a support element (2) and at least one heat-producing electronic component (3 ...  
WO/2023/221638A1
Embodiments of the present application relate to a heat dissipation apparatus, a connecting structure, and an electronic device. A first heat dissipation device (110a) is in thermal contact with a first heating device (201a) on a first a...  
WO/2023/224203A1
The present invention relates to a power module cooling device comprising: a housing part having an inlet part through which a refrigerant flows in and an outlet part through which the refrigerant flows out, and having a flow space forme...  
WO/2023/224873A1
An example method of flattening a circuit board assembly includes attaching the circuit board assembly to a structure having dimensions that partly enclose a space, where attachment of the circuit board assembly to the structure creates ...  
WO/2023/223451A1
A subrack device (11) comprises a plurality of plug-in units (31), a backplane (41), and a subrack (21). A first ventilation hole (41a) is formed in the backplane (41). The subrack (21) has a box shape with an opening (21a) formed on one...  
WO/2023/221045A1
The present disclosure provides a composite heat dissipation structure and a display device. The composite heat dissipation structure comprises: a grid tape, a buffer layer and a ferrite layer stacked in sequence, and a flexible circuit ...  

Matches 351 - 400 out of 100,253