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Matches 1 - 50 out of 124,036

Document Document Title
WO/2021/085006A1
The present invention addresses the problem that adhesion of a power semiconductor device to a heat dissipation surface is inadequate and heat dissipation performance is reduced. A heat conduction layer 5 is brought into contact with a h...  
WO/2021/082414A1
The present application relates to a temperature equalization component and an electronic device. The temperature equalization component may comprise a housing and a capillary structure. The housing may comprise a cavity, the capillary s...  
WO/2021/082498A1
The present utility model discloses a computer numerical control machine tool processing status self-recognition chip, comprising a box. Support columns are fixedly connected to both sides of the bottom of the inner chamber of the box; a...  
WO/2021/081927A1
A PCB heat dissipation assembly (100) and a server having same. The PCB heat dissipation assembly (100) comprises: a PCB board (1), multiple chips (11) being provided on the PCB board (1); at least one heat dissipation device (2), the he...  
WO/2021/082962A1
The present application provides a vehicle-mounted antenna module and a vehicle-mounted communication terminal. Both the vehicle-mounted antenna module and the vehicle-mounted communication terminal comprise a heat exchange module; the h...  
WO/2021/083142A1
The present application provides an electronic device, and in particular, to the field of heat dissipation of electronic devices. The electronic device comprises: a display screen; a middle frame comprising a first surface facing a first...  
WO/2021/085763A1
The present invention relates to an inverter mounting structure having improved ease of assembly and durability, and capable of simplifying the structure of an inverter. According to one aspect of the present invention, provided is an in...  
WO/2021/083493A1
The invention relates to a device (100) for controlling an air flow for cooling an electrical component (200) based on an ambient temperature of the electrical component (200). The device (100) comprises a bi-metal device (104) coupled t...  
WO/2021/086873A1
A system including an orifice plate, a fan element and at least one channel is disclosed. The orifice plate has at least one orifice therein. The fan element is configured to undergo vibrational motion to drive a fluid through the orific...  
WO/2021/084897A1
The purpose of the present invention is to improve the thermal performance of a heat-generating component. A heat-transfer-member-equipped substrate that comprises a substrate, a heat transfer member that is provided in a through hole in...  
WO/2021/083967A1
A housing unit (10) for fitting to a free end (102) of a pole (100) is disclosed. The housing unit (10) comprises a first part (11) configured to couple with, and extend into, the free end (102) of the pole (100) to locate the housing un...  
WO/2021/083013A1
The present application relates to the technical field of electronics. Disclosed are an interconnection structure for an electronic device and an assembling method therefor. The interconnection structure for an electronic device comprise...  
WO/2021/086358A1
An example ventilation system for a computing device includes: a cover slidably engageable with a housing of the computing device to a closed position defining an internal space of the computing device, the cover having first ventilation...  
WO/2021/081474A1
A three-dimensional geometry of a thermal interface body may be customized to substantially fill an irregular gap along a thermal dissipation pathway in an electronic package. The thermal interface body is fabricated through an additive ...  
WO/2021/078457A1
The invention relates to a method for determining a target volumetric flow rate (VĖ‡) for a coolant that is conducted through a coolant path in order to cool a power converter, wherein: the temperature (TC) of a DC-link capacitor of the ...  
WO/2021/078009A1
The present invention relates to a heat sink antenna array structure, comprising a fin-type metal heat sink, a heat sink metal base, and a base plate. The base plate has an upper surface connected to the heat sink metal base, and a lower...  
WO/2021/078618A1
The invention relates to a switch cabinet having a support structure that is designed to house an assembly. A housing is connected to the support structure. Also, a cooling conduit is connected to at least one part of the support structu...  
WO/2021/077749A1
Provided in the present application are a liquid-cooling heat dissipation system, a heat dissipation control method and a control chip. The liquid-cooling heat dissipation system comprises a control unit, a heat source box body and a hea...  
WO/2021/078401A1
The invention relates to an arrangement with an electrical appliance, in particular converter or inverter, and a component, the electrical appliance having a heat sink, a base plate being fastened to the heat sink and the component being...  
WO/2021/077802A1
Disclosed is an integrated air source heat pump. An electric appliance box is arranged in a containing space of a housing, a support is arranged in an inner space of the electric appliance box, a driving plate and a radiator are respecti...  
WO/2021/080660A1
A removable immersion cooling infrastructure module can have a form factor equivalent to that of one or more of the computing devices being cooled by immersion cooling, thereby enabling the immersion cooling infrastructure module to be i...  
WO/2021/080787A1
A method of controlling energy in a datacenter includes receiving a fuel cell operating percentage of an operating capacity of the fuel cell, receiving a fuel cell exhaust temperature, receiving a hot aisle air temperature from a hot ais...  
WO/2021/080546A1
The invention, in the telecommunication equipment, consumer electronics, LED and thermal lighting, cooling and memory modules, is a thermal graphite sponge (10) that allows cooling the products and extending the economic life of the same...  
WO/2021/077787A1
Provided in the present disclosure is outdoor customer premises equipment, comprising: a printed circuit board, a heat dissipation fin set, a heating plate set, a SIM card tray, a radio frequency cable, and a 5G communication module body...  
WO/2021/077631A1
The present invention relates to the technical field of heat dissipation. Provided are a radiator and an air conditioner having same. The radiator comprises: a heat-conducting base comprising a first portion (11) and a second portion (12...  
WO/2021/080773A1
In general, embodiments relate to systems for latching electrical modules to one another. Specifically, embodiments provide for a latching assembly to mechanically aid an operative connection between electrical modules. Further, embodime...  
WO/2021/074071A1
According to various embodiments, a computing center (151) can have: a computing system (104) arranged in a chamber (102), wherein the computing system (104) has a plurality of cooling elements (104k) and a plurality of processors, of wh...  
WO/2021/076408A1
A thermal component has a shield portion and a heat exchanger portion. The shield portion includes a plurality of cells adapted to inhibit radio radiation (RF) having a frequency within a target frequency range, while the heat exchanger ...  
WO/2021/075980A1
Disclosed is a rack fastener to engage and retain a first member and hold a second member to the first member. The fastener has two coextensive studs, each having base portions, to install from a back surface of the first member each int...  
WO/2021/073159A1
The present invention provides a thin integrated structure vapor chamber. A vapor chamber body and a plastic component are integrated into an integral component so that the vapor chamber is high in precision and good in strength, additio...  
WO/2021/073492A1
Disclosed is a vacuum soaking plate with a supporting structure. The vacuum soaking plate comprises a bottom plate and a cover plate fixed on the bottom plate, wherein a cavity in a vacuum state is formed between the bottom plate and the...  
WO/2021/073836A1
The invention relates to an electronic system (10) with a heat transfer device (13). The invention additionally relates to a locomotive means, in particular a motor vehicle, in which such an electronic system (10) is used. The electronic...  
WO/2021/073966A1
A circuit substrate for a semiconductor module, wherein the circuit substrate comprises the following: – at least one first printed circuit board formed from a glass fiber/epoxy resin composite material, – at least one second printed...  
WO/2021/069011A1
The invention relates to a switch cabinet (1) with a housing (2) and with a door (5) which has a door leaf (4) and which is secured to said housing while being able to pivot by way of at least one hinge (3), characterized in that the doo...  
WO/2021/070562A1
The present invention addresses the problem of providing a layered body having an excellent function for suppressing rise in temperature of a heat-generating body even if a deformation such as folding or bending has occurred, and an elec...  
WO/2021/068516A1
A foldable conductive guide rail, comprising: an outer guide rail (1) fixed on a box body, the outer guide rail (1) being electrically connected to a power supply of the box body by means of an outer guide rail pad (3) and having an oute...  
WO/2021/069448A1
The invention relates to a method for producing a power semiconductor module (21), comprising the following: providing a circuit board (1) having a number of mounting places (2) for power components (9), the mounting places (2) being pro...  
WO/2021/071412A1
The invention relates to an electric vehicle (1) comprising an electric motor (2), at least one built-in battery module (3) for powering the motor (2), a control circuit (4) for receiving driver inputs and direct power from the built-in ...  
WO/2021/071433A1
This invention relates to a centralized power and cooling plant for powering and cooling a floating data centre park. The centralized power and cooling plant comprises: a vessel comprising a power plant module and a cooling plant module;...  
WO/2021/070470A1
A heat transfer body (10) comprises a base material (20) that is to be attached to a heat transfer object and includes at least metal fibers, and a heat transfer unit (30) in which a part is fused to the metal fibers of the base material...  
WO/2021/069324A1
The invention relates to an electronic assembly (1), in particular for electric vehicles or hybrid vehicles, comprising a circuit carrier (3) equipped with at least one heat-generating electrical component (2) on a first side (20), a coo...  
WO/2021/070370A1
This charging device (1) has: a housing (2); a cable (3) that is connected to a power converter (11) disposed inside the housing (2), a second end part of the cable (3) being positioned outside the housing (2); a detachable outside cover...  
WO/2021/070569A1
An electronic device (1) according to the present invention is provided with: a printed board (2); a plurality of electronic components (3-6) which are mounted on the printed board; and a lid (17) which is configured from a metal materia...  
WO/2021/072096A1
This document describes a thermal-control system (110) that may be integrated into a mesh network device (102) and associated mesh network devices. The thermal-control system (110), which may include a heat sink (112), multiple heat spre...  
WO/2021/069102A1
An apparatus includes a plurality of semiconductor switches. A first bus interconnects first terminals of the semiconductor switches in a first chain and provides a first impedance between the first terminals of switches of the first cha...  
WO/2021/070283A1
This power conversion device comprises a first stage (110) on which a first module is mounted, a second stage (120) which is stacked over the first stage (110) and on which a second module is mounted, and a refrigerant circulation circui...  
WO/2021/071726A1
Described may be a modular network communication system for use in a foundational structure, for the inclusion of new foundational structure construction, or configured for mobility between different foundational structures. The network ...  
WO/2021/068327A1
An air conditioner outdoor unit and a control method. The air conditioner outdoor unit comprises: a housing in which at least two compressors (550) are provided; at least two drive modules (400), each drive module respectively correspond...  
WO/2021/070544A1
This vapor chamber wick sheet is interposed between the first sheet and the second sheet of a vapor chamber in which working fluid is sealed. This vapor chamber wick sheet comprises: a sheet body that has a first body surface and a secon...  
WO/2021/064988A1
A power conversion device (1) includes: a first housing (2) having a first flat surface section (21) in which a first through-hole section (23) is formed, and also having a first side-surface section (22); a second housing (6) having a b...  

Matches 1 - 50 out of 124,036