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WO/2024/080466A1 |
The invention relates to an electric compressor comprising a compression mechanism for compressing a refrigerant by receiving power from a motor, and an inverter for controlling the motor, wherein: a housing for accommodating the motor a...
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WO/2024/078206A1 |
Disclosed in the embodiments of the present application are a computing device and a computing node. A housing of the computing node comprises a bottom casing and a top cover, the top cover and the bottom casing being matched to form an ...
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WO/2024/078948A1 |
The invention relates to a method for producing an assembly (1) with a converter and to an assembly (1) with a converter for converting electric current types and voltage types, comprising at least one power module (2) and at least one i...
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WO/2024/077925A1 |
A bent specially shaped ultra-thin vapor chamber, a manufacturing process therefor, and an application. The manufacturing process comprises: cleaning upper and lower housing plates, and drying; preparing a liquid absorption core material...
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WO/2024/080624A1 |
An electronic device may comprise: a first substrate including a first hole; a second substrate including a second hole; a shield can attached to another side opposite to one side of the first substrate facing the second substrate; an in...
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WO/2024/080652A1 |
An electronic device according to an embodiment of the present disclosure comprises: a heating unit including an electronic component in which heat is generated during the operation of the electronic device; and a heat dissipation struct...
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WO/2024/081808A1 |
A manifold assembly is provided for a server rack. The manifold assembly can include a manifold tube including at least one side wall. A channel can have a top portion and a bottom portion, each including at least one attachment aperture...
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WO/2023/019030A8 |
An apparatus includes a base; a mount attached to the base, the mount including a backplate, a bottom platform formed perpendicular to the backplate along a bottom of the backplate, the bottom platform including a retention wall formed a...
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WO/2024/080710A1 |
The present invention relates to a circuit board coupling structure and, more specifically, provides a circuit board coupling structure comprising: a circuit board having an asymmetric portion which is one edge formed asymmetrically with...
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WO/2024/077816A1 |
A rapid cooling device for a server cabinet. The rapid cooling device comprises: a cabinet body; a support mechanism, which is fixedly connected to inner sides of the cabinet body; and a heat dissipation mechanism, which is arranged on a...
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WO/2024/080762A1 |
Disclosed is a vapor chamber having a porous filler portion forming a gas diffusion path. According to the present invention, the heat transmitted via a metal chamber housing quickly vaporizes a phase change liquid even at a relatively l...
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WO/2024/080455A1 |
The present invention relates to a method for manufacturing a heat-dissipating film, comprising the steps of: preparing a first mixture by mixing hexagonal boron nitride and an organic solvent; conducting first surface-modification of th...
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WO/2024/081409A1 |
The fluoroether 3-(difluoromethoxy)-1,1,1,2,2-pentafluoropropane ("HFE-347mcf") may be used as a refrigerant and/or heat transfer composition, such as in single phase and two phase cooling systems, and a method of heating and/or cooling ...
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WO/2024/081394A1 |
Methods of heating and/or cooling electronic components, articles and devices during operation thereof and/or during manufacture thereof by providing a refrigerant comprising 2-(1,1,2,3,3,3-hexafluoropropoxy)-1,1,1,3,3,3-hexafluoroprop
a...
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WO/2024/080458A1 |
A server processor of a server device, according to an embodiment of the present invention, can be configured to: calculate a predicted communication traffic volume processed through a telecommunication building in which a cooling system...
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WO/2024/080589A1 |
The present invention relates to a BMS assembly comprising: a circuit board which has a first fastening hole for grounding; a first casing mold which accommodates the circuit board and includes a bushing portion formed inside a second fa...
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WO/2024/077512A1 |
An electronic device comprises a heat sink and a cooling structure, the cooling structure comprising a heat obtaining module, a Stirling engine, a transmission component and a fan, wherein the heat obtaining module obtains heat energy an...
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WO/2024/075933A1 |
This electronic device comprises an antenna board designed for massive multiple input multiple output (massive MIMO). The antenna board is coupled to a filter board by means of elastic signal contacts and elastic ground contacts. The con...
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WO/2024/076556A1 |
A system and method for operating an immersion tank for cooling electronics is provided. The system comprises an immersion tank configured to house a dielectric fluid and at least one electronic device; a cooling tank configured to house...
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WO/2024/075392A1 |
This electrical device comprising an electrical component, an electrical component support, an outer frame, and an inner frame, wherein an internal space is formed between the electrical component support and the inner frame, the electri...
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WO/2024/075867A1 |
A control box and a display device comprising same are disclosed. The control box of the present disclosure may comprise: a case; a bracket which is disposed within the case and coupled to the case; and a communication module which is ro...
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WO/2024/076395A2 |
In a general aspect, an apparatus is configured for communicating electrical signals in a cryogenic system. The apparatus includes a metal plate and a circuit board secured to the metal plate. The metal plate includes a first surface on ...
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WO/2024/074261A1 |
The invention relates to an electrical component (1) for a motor vehicle, having a housing (2), which has a main housing (3) and a housing cover (4) that covers an opening in the main housing, and having an inverter (5), which is arrange...
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WO/2024/041571A9 |
Disclosed is a display module. The display module comprises a display panel, a flexible printed circuit and a bonding structure. The display panel has a light-emergent side and a side that faces away from light and is opposite the light-...
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WO/2024/074884A1 |
A method, system and apparatus are disclosed. According to some embodiments, a radio assembly for a cellular site is provided. The radio assembly includes a thermal energy transfer element affixable to a structure at the cellular site, a...
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WO/2024/075749A1 |
Provided is a cooling execution device which is equipped with: a prediction unit for predicting a change in the temperature of a control device which is installed in a vehicle and controls the automated driving of the vehicle, and a cool...
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WO/2024/075041A1 |
A robotic apparatus (1) for performing maintenance tasks on an electronic component to be maintained (2a) is fitted to a support for electronic components (2) arranged in a workroom, the robotic apparatus (1) comprising: - a movable base...
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WO/2024/075631A1 |
A vapor chamber 1 according to an embodiment of a thermal diffusion device comprises: a housing 10 which has a first inner surface 11a and a second inner surface 12a which face each other in a thickness direction Z and is provided with a...
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WO/2024/073448A1 |
Cooling systems featuring cooling manifolds with features that conform to the shape of an electrical component to be cooled are provided herein. Such cooling manifolds may be connected with a cooling fluid source, such as a clean dry air...
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WO/2024/065847A1 |
Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An immersion cooling chassis includes a first face, a second face opposite...
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WO/2024/068604A1 |
The invention relates to a plug-in connector part for mechanical and electrical connection to a mating plug-in connector part, in particular a motor-vehicle-mounted charging socket (1) for coupling to a charging plug as components of an ...
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WO/2024/066486A1 |
The present disclosure discloses an electronic device. The electronic device comprises a first part, a second part and a connecting structure, the connecting structure comprises a first connector arranged on the first part and a second c...
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WO/2024/072677A1 |
A data storage card insertable into a peripheral slot of host system is provided that houses storage devices on both sides of the data storage card. A heat sink member establishes a skewed offset stackup among a primary circuit board and...
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WO/2024/066546A1 |
A heat dissipation apparatus (100), a power device and a photovoltaic system, which have a better heat exchange effect. The heat dissipation apparatus (100) may comprise a housing (110); a heat source is fixed on the outer surface of a f...
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WO/2024/072903A1 |
Aspects of this disclosure relate to a computing cabinet for a computing system and to computing systems with one or more computing cabinets. The computing cabinet can include a power plane for power conversion, a compute plane, and a ho...
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WO/2024/073424A1 |
Apparatuses, systems, and methods are disclosed for techniques for small form factor device cooling. An apparatus (100) includes a housing unit (102), a fan (108) located within the housing unit (102), a plurality of inlets (108) on the ...
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WO/2024/072530A1 |
A thermal management system includes a high-pressure (HP) container, a low-pressure (LP) container in fluid communication with the HP container and having a fluid pressure less than the HP container, and a two-phase working fluid partial...
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WO/2024/069356A1 |
High voltage modular power distribution unit for electric or hybrid vehicles, the modular power distribution unit being equipped with two or more base electric modules (1) mechanically connected to each other, the base electric module (1...
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WO/2024/069442A1 |
A subassembly for an electrical component includes: a first plate including: a wall, stepped walls extending from opposite sides of the wall, flange elements extending outwardly from the stepped walls, each flange element defining an eng...
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WO/2024/066703A1 |
Provided in the present application are a heat dissipation system and a power apparatus. The heat dissipation system comprises a power module, an evaporator and a condenser, wherein the power module comprises a thermally conductive subst...
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WO/2024/072385A1 |
Examples of retention structures (242) are described herein. In some examples, an apparatus (240) includes a three-dimensional (3D) printed substrate (232). In some examples, the apparatus includes a 3D printed contact (230) included in ...
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WO/2024/067061A1 |
An electronic device, comprising a main middle frame (2), an auxiliary middle frame (3), a flexible screen module (1), a rotating shaft assembly (5) and a flexible heat dissipation module (4). The flexible screen module (1) is connected ...
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WO/2024/073227A1 |
An apparatus for sub-cooling components includes a component cooling device, a processor thermally coupled to the component cooling device, an electronic component, a fan configured to direct an airflow across the processor and the elect...
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WO/2024/071110A1 |
This semiconductor module comprises a substrate, at least one semiconductor element that is positioned on a first surface of the substrate, a heat dissipation member that is positioned above the semiconductor element, and an optic fiber ...
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WO/2024/067668A1 |
The present application discloses a circuit board apparatus and an electronic device. The disclosed circuit board apparatus comprises a circuit board, a first chip, and a cooling element; the circuit board is provided with an accommodati...
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WO/2024/070171A1 |
A cable cover (10) fixes a cable (C) in a measurement hole (20) provided in a wall surface of an incubator (30), the cable (C) being drawn out of an internal space (S2) to an external space (S1) through the measurement hole (20). The cab...
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WO/2024/069441A1 |
A system includes a power module, wherein the power module includes a first interlocking feature on a first surface of the power module; and at least one heat sink, wherein the at least one heat sink includes a second interlocking featur...
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WO/2024/066452A1 |
Provided in the embodiments of the present application is a server, comprising a chassis, a storage module, a master control module, a first module and a second module; the chassis is provided with an inner chamber, the inner chamber of ...
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WO/2024/066441A1 |
A flow control method and a computing node (100, 200, 300). The flow control method is applied to the computing node (100, 200, 300). The computing node (100, 200, 300) comprises a housing, a device (101) to be subjected to heat dissipat...
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WO/2024/066598A1 |
An indoor unit and an air conditioner. The indoor unit comprises: a housing (100), the interior of which is partitioned into a first compartment (101) and a second compartment (102) by means of a middle partition plate (110); a heat exch...
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