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Patent Searching and Data


Title:
【発明の名称】基板処理方法
Document Type and Number:
Japanese Patent JP2003522290
Kind Code:
A
Abstract:
Method for removing a portion of the binder phase from the surface of a substrate that is composed of particles of at least a first phase joined together by the binder phase, and wherein the surface is etched by contacting it with a gas flow of an etchant gas and a second gas. The second gas is one or more gases that will not react with the substrate or the removed binder phase and will not alter the oxidation state of the substrate during etching.

Inventors:
レヴェレンズ,ロイ・ブイ
ボスト,ジョン
Application Number:
JP2001503268A
Publication Date:
July 22, 2003
Filing Date:
June 16, 1999
Export Citation:
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Assignee:
ティーディーワイ・インダストリーズ・インコーポレーテッド
International Classes:
C23C16/02; C23C16/34; C23C16/36; C23F1/02; C23F1/12; (IPC1-7): C23C16/02
Domestic Patent References:
JPS61168291A1986-07-29
JPH1087399A1998-04-07
JPH11140623A1999-05-25
JPH07109572A1995-04-25
JPH0288782A1990-03-28
Attorney, Agent or Firm:
社本 一夫 (外5名)