Title:
トランスファ成形により製造されるマイクロチップ組立体
Document Type and Number:
Japanese Patent JP2009500191
Kind Code:
A
Abstract:
The invention relates to a microchip assembly and an associated general production process, wherein an originally unshaped first component ( 1 ) is forged against the surface of a transfer molding form by an injected molten second component ( 5 ). The first component ( 1 ) may particularly comprise electrical tracks ( 3 ) on a carrier layer, said carrier layer being removed after the solidification of the injected material. According to a preferred embodiment, a microchip ( 8 ) is bonded to the electrical tracks ( 3 ) and then embedded in a filling ( 10 ). The electrical tracks ( 3 ) preferably lead from the front side ( 11 ) of the microchip ( 8 ) to the back side of the assembly, where they can be connected to external circuits. A sensitive front side ( 11 ) of a sensor microchip ( 8 ) can thus be placed very close to the front plane of the whole assembly, making the assembly apt for biosensor applications.
Inventors:
Wekamp Johannes Wilhelms
Anthemsville Jay H
Deble Hezel
Anthemsville Jay H
Deble Hezel
Application Number:
JP2008519089A
Publication Date:
January 08, 2009
Filing Date:
June 28, 2006
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
B29C45/14; B29C45/02; B29C45/70; H01L21/60; H01L23/50
Attorney, Agent or Firm:
Susumu Tsugaru
Akihiko Miyazaki
Fueda Shusen
Akihiko Miyazaki
Fueda Shusen