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Document Type and Number:
Japanese Patent JP2010539252
Kind Code:
It is an object of the present invention to provide a fluororesin composition which hardly causes molding defects even when high-speed molding is performed in covering extrusion molding within a relatively broad molding temperature range and which can give covered electric wires, in particular foamed electric wires, excellent in surface smoothness. A fluororesin composition comprising a polytetrafluoroethylene [PTFE] having a standard specific gravity of 2.15 to 2.30 and a tetrafluoroethylene/hexafluoropropylene-based copolymer [FEP], the content of said PTFE being 0.01 to 3 parts by mass per 100 parts by mass of said FEP and the alkali metal content being not higher than 5 ppm on the resin composition solid matter basis, wherein said composition is obtained by a method comprising the step (1) of obtaining a cocoagulated fluororesin powder by mixing an aqueous dispersion containing said FEP and an aqueous dispersion containing said PTFE together, followed by coagulation, the step (2) of melt extruding the cocoagulated powder and the step (3) of subjecting the extrusion product to treatment for stabilizing unstable terminal groups in said PTFE and FEP.

塩月 敬三
河野 英樹
石井 健二
伊藤 剣吾
谷本 健次郎
北原 隆宏
Application Number:
Publication Date:
December 16, 2010
Filing Date:
September 24, 2008
Export Citation:
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International Classes:
C08L27/18; C08J3/16; C08J3/20; C08K3/08; H01B3/24; H01B7/02
Domestic Patent References:
Foreign References:
Attorney, Agent or Firm:
特許業務法人 安富国際特許事務所