Title:
セラミック製品の切断システムおよび方法
Document Type and Number:
Japanese Patent JP2011513094
Kind Code:
A
Abstract:
Cutting and grinding of ceramic-type logs to a desired piece length is disclosed. A method of manufacturing ceramic ware is disclosed which comprises transversely cutting a piece from a ceramic-type log having a longitudinal axis by cutting into the log with a blade at a location along the length of the log to form a cut transverse surface on the piece and grinding the cut transverse surface with a side of the blade. An apparatus for manufacturing ceramic ware is also disclosed comprising means for transversely cutting a piece from a ceramic-type log having a longitudinal axis, including a blade for cutting into the log at a location along the length of the log to form a cut transverse surface on the piece, and means for grinding the cut transverse surface with a side of the blade.
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| JPS63212470 | ID BLADE |
Inventors:
Ronald A. Boyco
Pesansky, George Pea
Pesansky, George Pea
Application Number:
JP2010548728A
Publication Date:
April 28, 2011
Filing Date:
February 27, 2009
Export Citation:
Assignee:
CORNING INCORPORATED
International Classes:
B28D5/02; B24D5/12; B28D1/24
Domestic Patent References:
| JPH07251321A | 1995-10-03 | |||
| JPS61152375A | 1986-07-11 | |||
| JP2006068998A | 2006-03-16 |
Attorney, Agent or Firm:
Yanagita Seiji
Go Sakuma
Go Sakuma