Title:
デバイスを形成する方法およびデバイス
Document Type and Number:
Japanese Patent JP2013530519
Kind Code:
A
Abstract:
Interconnect structures having self-aligned dielectric caps are provided. At least one metallization level is formed on a substrate. A dielectric cap is selectively deposited on the metallization level.
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Inventors:
Horak, David, Ve
Takeshi Nogami
Ponos, Shom
Yang, Qichao
Takeshi Nogami
Ponos, Shom
Yang, Qichao
Application Number:
JP2013509071A
Publication Date:
July 25, 2013
Filing Date:
March 21, 2011
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
International Classes:
H01L21/768; H01L21/3065; H01L21/318; H01L23/522
Domestic Patent References:
JP2009528702A | 2009-08-06 | |||
JP2008205119A | 2008-09-04 | |||
JP2007335578A | 2007-12-27 | |||
JP2004200684A | 2004-07-15 | |||
JP2009164354A | 2009-07-23 | |||
JP2007184347A | 2007-07-19 | |||
JP2009528702A | 2009-08-06 |
Foreign References:
US0008028A | 1851-04-08 |
Attorney, Agent or Firm:
Takeshi Ueno
Tasaichi Tanae
Yoshihiro City
Tasaichi Tanae
Yoshihiro City