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Title:
INSPECTION PROCEDURE DATA GENERATION DEVICE, SUBSTRATE INSPECTION DEVICE, AND SUBSTRATE INSPECTION METHOD
Document Type and Number:
Japanese Patent JP2018179748
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To generate inspection procedure data capable of sufficiently reducing the possibility of electrostatic breakdown of electronic components in substrate inspection.SOLUTION: A test object substrate includes a semiconductor element mounted thereon, and a plurality of probing points having a first type probing point for conducting a conductor pattern defined by any one of ground and power source and a second type probing point for conducting a signal input/output terminal of a semiconductor element. An inspection procedure data generation device generates inspection procedure data for determining the execution sequence of inspection steps for causing a substrate inspection device to contact the probing points of the test object substrate with an inspection probe and to conduct inspection. Prior to execution of inspection step on the second type probing point, a connection step for connecting the first type probing point to a reference potential via the probe is incorporated to thereby generate the inspection procedure data.SELECTED DRAWING: Figure 3

Inventors:
NAKUMO MASAMICHI
Application Number:
JP2017079546A
Publication Date:
November 15, 2018
Filing Date:
April 13, 2017
Export Citation:
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Assignee:
HIOKI ELECTRIC WORKS
International Classes:
G01R31/28
Domestic Patent References:
JPH11305259A1999-11-05
JP2004030201A2004-01-29
JP2000068320A2000-03-03
JP2007065455A2007-03-15
JP2005241491A2005-09-08
Foreign References:
US20160209461A12016-07-21
Attorney, Agent or Firm:
Shinji Sakai