Title:
CUTTING METHOD OF RESIN FILM
Document Type and Number:
Japanese Patent JP2019005845
Kind Code:
A
Abstract:
To provide a cutting method of a resin film which reduces chipping and chips, and can continuously and stably cut.SOLUTION: In a cutting method of a resin film for cutting the resin film 3 of which a glass transition temperature is 90°C or higher, a cutting device having at least a pair of upper blade 1 and a lower blade 2 is used. A pushing amount of the upper blade to a lower blade side is 0.05-0.35 mm, and tensile force of the resin film is 30-300 N/m. The resin film is a thermoplastic resin film, and thermoplastic resin for forming the thermoplastic resin film is preferably (meth)acrylic resin. An engagement amount of the upper blade and the lower blade is preferably 0.02-0.60 mm.SELECTED DRAWING: Figure 1
Inventors:
DEI HIROAKI
MATSUI TOMOYUKI
OGAWA TOMOYA
FUJII SHIYUUMEI
MATSUI TOMOYUKI
OGAWA TOMOYA
FUJII SHIYUUMEI
Application Number:
JP2017123436A
Publication Date:
January 17, 2019
Filing Date:
June 23, 2017
Export Citation:
Assignee:
KURARAY CO
International Classes:
B26D3/00; B26D1/24; B26D7/14
Domestic Patent References:
| JP2008000850A | 2008-01-10 | |||
| JP2017109262A | 2017-06-22 | |||
| JP2001341397A | 2001-12-11 | |||
| JP2005206358A | 2005-08-04 | |||
| JP2015205393A | 2015-11-19 | |||
| JP2006289601A | 2006-10-26 |
Foreign References:
| WO2015151466A1 | 2015-10-08 |