Title:
COLUMNAR CONDUCTOR STRUCTURE
Document Type and Number:
Japanese Patent JP2019079965
Kind Code:
A
Abstract:
To provide a columnar conductor structure with excellent shielding properties, conductivity, and heat resistance.SOLUTION: A columnar conductor structure A in which a conductor is filled in a through hole 102 provided in the thickness direction of a substrate 100 includes a first layer 103 in contact with the wall surface or the bottom surface of the through hole 102, a second layer 104 provided on the surface, and a filling layer 105 filling the through hole 102 inside the second layer 104, and the first layer 103 is a metal layer with a thickness of 0.1 μm to 10 μm, the second layer 104 is constituted by a layer including a first intermetallic compound with a thickness of 1 μm to 10 μm, and the filling layer 105 is constituted by a second intermetallic compound 1051 and an alloy 1052, and the second intermetallic compound 1051 occupies at least 5% by mass of the filling layer 105, and the second intermetallic compound 1051 is dispersed in the alloy 1052.SELECTED DRAWING: Figure 1
Inventors:
SEKINE SHIGENOBU
Application Number:
JP2017206633A
Publication Date:
May 23, 2019
Filing Date:
October 25, 2017
Export Citation:
Assignee:
NAPURA KK
International Classes:
H01L21/3205; B22F1/00; B22F9/10; C22C13/00; H01L21/768; H01L23/14; H01L23/522; H05K1/11
Domestic Patent References:
| JP2013093499A | 2013-05-16 | |||
| JP2000049460A | 2000-02-18 | |||
| JP2015082534A | 2015-04-27 | |||
| JP2017175044A | 2017-09-28 | |||
| JP2013153131A | 2013-08-08 | |||
| JP2015008179A | 2015-01-15 | |||
| JP2014063725A | 2014-04-10 |
Attorney, Agent or Firm:
Shigeru Noda