Title:
SUBSTRATE TREATMENT APPARATUS, AND FILM DEPOSITION APPARATUS
Document Type and Number:
Japanese Patent JP2019085591
Kind Code:
A
Abstract:
To provide a technology capable of making the whole surface uniform in substrate surface treatment using an inverse sputtering principle.SOLUTION: A substrate treatment apparatus 14 for surface treatment of a substrate 2 includes a chamber 41 in which the substrate 2 is arranged and a discharge gas is introduced, a substrate holder 42 for holding the substrate 2 in the chamber 41, a substrate holder supporting unit 43 for supporting the substrate holder 42 in the chamber 41, and voltage impressing means 44 for impressing voltage to the substrate 2 with the substrate holder 42 as a cathode and at least one of the chamber 41 and the substrate holder supporting unit 43 as an anode. The surface of the substrate 2 is treated by being irradiated with an ion or an electron emitted in the chamber 41 by discharge generated by voltage impression by the voltage impressing means 44. The substrate holder 42 and the substrate holder supporting unit 43 are connected via floating part 50 that is electrically insulated from the substrate holder 42 and the substrate holder supporting unit 43.SELECTED DRAWING: Figure 1
Inventors:
ABE YOSHIKO
WATABE ARATA
ABE YAMATO
TAKEMI TAKASHI
WATABE ARATA
ABE YAMATO
TAKEMI TAKASHI
Application Number:
JP2017211800A
Publication Date:
June 06, 2019
Filing Date:
November 01, 2017
Export Citation:
Assignee:
CANON TOKKI CORP
International Classes:
C23C14/02; C23C14/34; H01L21/28; H01L21/285
Attorney, Agent or Firm:
Takeshi Niwa
Takeshi Nakamura
Koichiro Sakai
Ryota Morihiro
Yoshiyuki Kawaguchi
Takeshi Nakamura
Koichiro Sakai
Ryota Morihiro
Yoshiyuki Kawaguchi