Title:
SOFT EMBOLIC IMPLANT
Document Type and Number:
Japanese Patent JP2019107460
Kind Code:
A
Abstract:
To provide embolic implants.SOLUTION: Some embolic implants exhibit progressively increasing softness from the distal end 34 to the proximal end 32 of the coil thereof. The embolic implant has a primary coil 40, an optional second coil 42, a shape wire 48 and a stretch resistant fiber 46 disposed in the lumen of the primary coil. The embolic implant includes a proximal constraint assembly 36 configured to be releasably retained by a delivery device. Disposed near each end of some of the implants is an elliptical hole washer through which the shape wire and the stretch resistant fiber are threaded. The embolic implant has a primary, linear configuration for delivery through an implant tool, and a secondary configuration after deployment from the implant tool. The secondary configuration can be J-shaped, helical, spherical, complex, or a combination of shapes.SELECTED DRAWING: Figure 2
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| WO2000010469 | VASOOCCLUSIVE COIL |
| WO/2003/005884 | CONSTRICTION DEVICE INCLUDING FIXATION STRUCTURE |
Inventors:
ALEXANDER PLAGGE RABKIN
STEPHEN PONS
DELILAH HUI
STEPHEN PONS
DELILAH HUI
Application Number:
JP2019014397A
Publication Date:
July 04, 2019
Filing Date:
January 30, 2019
Export Citation:
Assignee:
PENUMBRA INC
International Classes:
A61B17/12
Domestic Patent References:
| JP2003501131A | 2003-01-14 |
Attorney, Agent or Firm:
Yuzo Yamazaki
Toshiaki Akamatsu
Tadao Naito
Chihiro Imai
Toshiaki Akamatsu
Tadao Naito
Chihiro Imai