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Title:
TO PACKAGE WITH GLASS FEEDTHROUGH
Document Type and Number:
Japanese Patent JP2020036009
Kind Code:
A
Abstract:
To provide a TO package that enables a high data transfer rate.SOLUTION: A TO package 1 includes a header 2 with a mounting area for an optoelectronic element. The header 2 includes at least one signal pin 7a, 7b disposed in a feedthrough 9 for the connection of the optoelectronic element. The feedthrough 9 is filled with an insulating material made of glass and/or glass ceramic. The feedthrough 9 has a recessed area on at least one side that is not completely filled up with the insulating material made of glass and/or glass ceramic. An area where the insulating material is recessed forms a cavity at least for each area around the at least one signal pin 7a, 7b, and the at least one signal pin 7a, 7b has an enlarged portion in the area.SELECTED DRAWING: Figure 1

Inventors:
ROBERT HETTLER
ARTIT AOWUDOMSUK
KENNETH TAN
KARSTEN DROEGEMUELLER
Application Number:
JP2019153683A
Publication Date:
March 05, 2020
Filing Date:
August 26, 2019
Export Citation:
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Assignee:
SCHOTT AG
International Classes:
H01S5/022
Domestic Patent References:
JP2017123414A2017-07-13
JP2009105284A2009-05-14
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima