Title:
SUBSTRATE GRINDING DEVICE AND SUBSTRATE GRINDING METHOD
Document Type and Number:
Japanese Patent JP2020040189
Kind Code:
A
Abstract:
To provide a substrate grinding device and a substrate grinding method by which a large-sized substrate can be ground with good efficiency and high accuracy.SOLUTION: A substrate grinding device 10 comprises: a work table 20 which rotates in a state that the table adsorbs and holds a substrate 30; a cup wheel type first grinding wheel 11 which grinds the substrate 30, which is held and rotated on the work table 20, while rotating; and a cup wheel type second grinding wheel 15 which approaches the substrate 30 simultaneously with the first grinding wheel 11, and grinds the substrate 30 while rotating. Thus, since the first grinding wheel 11 and the second grinding wheel 15 can simultaneously grind the substrate 30 without changing a position of the substrate 30, large-sizing of the substrate grinding device is suppressed, and a large-sized substrate 30 can be ground with good efficiency.SELECTED DRAWING: Figure 1
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Inventors:
IDE SATORU
MITSUI TAKAHIKO
BANDO TSUBASA
TAKAOKA KAZUHIRO
MITSUI TAKAHIKO
BANDO TSUBASA
TAKAOKA KAZUHIRO
Application Number:
JP2018171475A
Publication Date:
March 19, 2020
Filing Date:
September 13, 2018
Export Citation:
Assignee:
OKAMOTO MACHINE TOOL WORKS
International Classes:
B24B7/04; B24B41/06; H01L21/304
Domestic Patent References:
| JP2014097551A | 2014-05-29 | |||
| JP2007203432A | 2007-08-16 |
Foreign References:
| WO2017138355A1 | 2017-08-17 | |||
| US5622875A | 1997-04-22 |
Attorney, Agent or Firm:
Masahisa Otake