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Title:
POLYETHYLENE LAMINATE AND PACKAGING MATERIAL USING THE SAME
Document Type and Number:
Japanese Patent JP2020055176
Kind Code:
A
Abstract:
To provide a polyethylene laminate that has high heat resistance and also has excellent recyclability while keeping heat sealability.SOLUTION: A polyethylene laminate has a base material layer and a heat seal layer. The base material layer comprises polyethylene with a density of 0.930 g/cmor more and the heat seal layer comprises polyethylene with a density of less than 0.930 g/cm. Each of the base material layer and the heat seal layer is formed by co-extrusion molding of the polyethylene with a density of 0.930 g/cmor more and the polyethylene with a density of less than 0.930 g/cm. The base material layer is treated with electron beam irradiation.SELECTED DRAWING: Figure 1

Inventors:
KASHIWABARA TOMOMI
YAMADA KENICHI
SUZUKI YOSHIHIKO
Application Number:
JP2018186154A
Publication Date:
April 09, 2020
Filing Date:
September 28, 2018
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B32B27/32; B65D65/40
Domestic Patent References:
JP2018008454A2018-01-18
JP2018008455A2018-01-18
JP2018008456A2018-01-18
JPH06278774A1994-10-04
JP2015147302A2015-08-20
JP2018511504A2018-04-26
JPH10157035A1998-06-16
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Yasukazu Sato
Satoru Asakura
Mari Asano