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Title:
SOUND INSULATION FLOOR SUBSTRATE MATERIAL, SOUND INSULATION FLOOR STRUCTURE AND CONSTRUCTION METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2020076293
Kind Code:
A
Abstract:
To make it possible to effectively decrease light-weight floor impact sound even in low floor type floor substrate material 1 without increasing the thickness of sound insulation floor substrate material 1.SOLUTION: A sound insulation floor substrate material 1 comprises: a tabular cushioning material 2 comprising nonwoven fabric to be disposed so as to be abutted with a floor slab F; a plurality of joist materials 10,10,... that are fixed via adhesion onto an upper surface of the cushioning material 2 to define damping material spaces 8,8,... on the upper surface of the cushioning material 2; and damping materials 14 that are accommodated so that their upper surfaces are flush with upper surfaces of joist materials 10,10,... on the damping material spaces 8,8,.... A floor finishing material 17 can be constructed on the upper surfaces of the joist materials 10,10,... of the floor substrate material 1 and damping materials 14 in a state of being fixed to the joist materials 10,10,....SELECTED DRAWING: Figure 1

Inventors:
SENDA TAIGU
KISHI MASAHIRO
Application Number:
JP2019166077A
Publication Date:
May 21, 2020
Filing Date:
September 12, 2019
Export Citation:
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Assignee:
DAIKEN CORP
International Classes:
E04F15/20; E04B1/86; E04B5/43; E04F15/18
Domestic Patent References:
JPH08105192A1996-04-23
JPS5938453A1984-03-02
JP2003293571A2003-10-15
JPH0347949U1991-05-07
JPH0347948U1991-05-07
JP2015214804A2015-12-03
JPH03123038U1991-12-16
JP2003056171A2003-02-26
JPH039457U1991-01-29
JP2004332340A2004-11-25
Foreign References:
WO2011111608A12011-09-15
US20060230699A12006-10-19
Attorney, Agent or Firm:
Maeda patent office