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Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2020150168
Kind Code:
A
Abstract:
To provide a semiconductor device that can dice a semiconductor substrate using a stealth dicing technology even when the thickness of the semiconductor substrate is 25 μm or less.SOLUTION: A semiconductor device according to an embodiment includes a device layer, a reflectance reduction layer, and a modified layer. The device layer is arranged on the first surface of a first region of the semiconductor substrate. The reflectance reduction layer is arranged on the first surface of a second region provided around the first region of the semiconductor substrate, and the reflectance is reduced compared to the reflectance of a laser beam incident from the second surface side facing the first surface when a metal film is arranged on the first surface. The modified layer is provided on the side surface of the semiconductor substrate in the second region. The side surface of the semiconductor substrate in the second region is a cut surface extended in the semiconductor substrate.SELECTED DRAWING: Figure 1

Inventors:
ONO TAKANOBU
FUJITA TSUTOMU
KUME IPPEI
TOMONO AKIRA
Application Number:
JP2019047449A
Publication Date:
September 17, 2020
Filing Date:
March 14, 2019
Export Citation:
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Assignee:
KIOXIA CORP
International Classes:
H01L21/301; B23K26/53
Attorney, Agent or Firm:
Sakai International Patent Office