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Patent Searching and Data


Title:
【発明の名称】樹脂封止型半導体装置
Document Type and Number:
Japanese Patent JP2543686
Kind Code:
B2
Inventors:
YOKOYAMA TAKASHI
Application Number:
JP26975286A
Publication Date:
October 16, 1996
Filing Date:
November 14, 1986
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C08L63/00; C08G59/18; H01L23/29; H01L23/31; (IPC1-7): H01L23/29; C08L63/00; H01L23/31
Domestic Patent References:
JP5230184A
JP60168767A
JP59161053A
JP5950548A
JP5561042A
JP635644U
Attorney, Agent or Firm:
Hiroshi Nakamoto (1 outside)