Title:
【発明の名称】樹脂封止型半導体装置
Document Type and Number:
Japanese Patent JP2543686
Kind Code:
B2
Inventors:
YOKOYAMA TAKASHI
Application Number:
JP26975286A
Publication Date:
October 16, 1996
Filing Date:
November 14, 1986
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C08L63/00; C08G59/18; H01L23/29; H01L23/31; (IPC1-7): H01L23/29; C08L63/00; H01L23/31
Domestic Patent References:
| JP5230184A | ||||
| JP60168767A | ||||
| JP59161053A | ||||
| JP5950548A | ||||
| JP5561042A | ||||
| JP635644U |
Attorney, Agent or Firm:
Hiroshi Nakamoto (1 outside)